Semiconductor Material Density

Semiconductor Material Density, Total:89 items.

The international standard classification for "Semiconductor Material Density" includes: Semiconducting materials , Testing of metals in general , Abrasives , Conducting materials , Insulating fluids , Testing of metals .

The Chinese standard classification for "Semiconductor Material Density" includes: Semimetal and semiconductor material in general , Special electronic technology material , Metal physical property test method , Grinding material and apparatus , Carbon material , Carbon material in general , Technical management , Technical management .

Group Standards of the People's Republic of China

T/CNIA 0143-2022 Ultrapure Resin Vessels for Trace Impurity Analysis of Semiconductor Materials
T/CASME 798-2023 Specialized processing tools for semiconductor materials
T/CIET 722-2024 High purity sputtering targets for semiconductors
T/CIET 723-2024 Technical Specifications for Semiconductor CMP Polishing Materials
T/SHDSGY 135-2023 New Energy Semiconductor Silicon Wafer Material Technology
T/ICMTIA CM0035-2023 Sealing gasket for semiconductor silicon material process device
T/CASME 929-2023 Technical requirements for precision structural components of semiconductor equipment

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 43136-2023 Superabrasive products—Precision dicing and cutting wheels for semiconductor chips
GB/T 31469-2015 Semiconductor materials cutting fluid
GB/T 6154-1985 Carbon materials--Determination of the bulk density
GB/T 1550-1997 methods for measuring conductivity type of extrinsic semiconducting materials
GB/T 4298-1984 The activation analysis method for the determination of elemental impurities in semiconductor silicon materials
GB/T 14844-1993 of semiconductor materials
GB/T 24528-2009 Carbon materials—Determination method of the bulk density
GB/T 14264-1993 Semiconductor materials－Terms and definitions
GB/T 44687-2024 Superabrasive products—Precision grinding wheels for semiconductor wafers
GB/T 14264-2009 Semiconductor materials - Terms and definitions
GB/T 14264-2024 Terminology of semiconductor materials

Professional Standard - Electron

SJ/T 11067-1996 Commonly used terms for semiconductor photoelectric materials and pyroelectric materials in infrared detecting materials
SJ/T 11775-2021 Multi-wire saw used for semiconductor materials
SJ/T 10414-2015 Solder for semiconductor device
SJ 20744-1999 General rule of infrared absorption spectral analysis for the impurity concentration in semiconductor materials
SJ/T 10414-1993 Solder for semicoductor device
SJ/Z 3206.13-1989 General rules for emision spectrum analysis for semiconductor materials

国家市场监督管理总局、中国国家标准化管理委员会

GB/T 1550-2018 Test methods for conductivity type of extrinsic semiconducting materials
GB/T 14844-2018 Designations of semiconductor materials

Taiwan Provincial Standard of the People's Republic of China

CNS 5751-1980 Method of Test for Apparent Density of Ceramics for Electron Device and Semiconductor Application

Professional Standard - Ferrous Metallurgy

YB/T 119-1997 Carbon materials. Determination method of the bulk density

Shaanxi Provincial Standard of the People's Republic of China

DB61/T 1250-2019 General Specification for Sic (Silicon Carbide) Material Semiconductor Discrete Devices

National Metrological Verification Regulations of the People's Republic of China

JJG(电子) 31010-2007 Verification Regulations for Precision Analyzer of Semiconductor Parameters

National Metrological Technical Specifications of the People's Republic of China

JJF 2009-2022 Calibration Specification for Semiconductor Parameters Precision Analyzers

German Institute for Standardization

DIN 50441-1:1996 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 1: Thickness and thickness variation
DIN 50454-3:1994 Testing of materials for semiconductor technology - Determination of the dislocation etch pits density in monocrystals of III-V-compound semiconductors - Part 3: Gallium phosphide
DIN 50454-2:1994 Testing of materials for semiconductor technology - Determination of the dislocation etch pits density in monocrystals of III-V-compound semiconductors - Part 2: Indium phosphide
DIN 50446:1995 Testing of materials for semiconductor technology - Determination of defect types and defect densities of silicon epitaxial layers
DIN 50439:1982 Testing of materials for semiconductor technology; determination of the dopant concentration profile of single crystalline semiconductor material by means of the capacitancevoltage method and mercury contact
DIN 50447:1995 Testing of materials for semiconductor technology - Contactless determination of the electrical sheet resistance of semiconductor layers with the eddy-current method
DIN 50445:1992 Testing of materials for semiconductor technology; contactless determination of the electrical resistivity of semiconductor slices with the eddy current method; homogeneously doped semiconductor wafers
DIN 50448:1998 Testing of materials for semiconductor technology - Contactless determination of the electrical resistivity of semi-insulating semi-conductor slices using a capacitive probe
DIN 50441-2:1998 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 2: Testing of edge profile
DIN 50441-4:1999 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 4: Slice diameter, diamter variation, flat diameter, flat length, flat depth

RU-GOST R

GOST 32183-2013 Semi-solid bituminous materials. Determination of density by pycnometer
GOST ISO 8840-2014 Refractory materials. Determination of bulk density of granular materials (grain density)
GOST 18986.23-1980 Zener diodes. Methods for measuring spectral noise density
GOST 22622-1977 Semiconductor materials. Terms and definitions

RO-ASRO

STAS 6360-1974 SEMICONDUCTOR MATERIALS AND DEVICES Terminology

HU-MSZT

MSZ 771/5-1979 Mechanical properties of semiconductor materials

Indonesia Standards

SNI 19-0429-1989 Guide for sampling of liquid and semi solid materials

British Standards Institution (BSI)

BS IEC 62899-203:2024 Printed electronics - Materials. Semiconductor ink
BS IEC 60747-14-5:2010 Semiconductor devices - Semiconductor sensors - PN-junction semiconductor temperature sensor
BS EN ISO 8840:2024 Refractory materials. Determination of bulk density of granular materials (grain density)
BS IEC 62899-203:2018 Printed electronics. Materials. Semiconductor ink
BS IEC 62951-5:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for thermal characteristics of flexible materials
BS IEC 62951-4:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices

SCC

DANSK DS/ISO 8840:2023 Refractory materials – Determination of bulk density of granular materials (grain density)
SPC GB/T 14844-2018 Designations of semiconductor materials (TEXT OF DOCUMENT IS IN CHINESE)
DIN EN ISO 8840 E:2024 Draft Document - Refractory materials - Determination of bulk density of granular materials (grain density) (ISO 8840:2021); German and English version prEN ISO 8840:2024
AASHTO T 228-2022 Standard Method of Test for Specific Gravity and Density of Semi-Solid Asphalt Materials (ASTM Designation: D70-21)
DIN IEC 60747-14-5 E:2008 Draft Document - Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor (IEC 47E/353/CD:2007)
05/30137514 DC IEC 60747-14-4. Discrete semiconductor devices. Part 14-4. Semiconductor accelerometers
07/30164953 DC IEC 60747-14-5. Semiconductor devices. Discrete devices. Part 14-5. Semiconductor sensors. PN-junction semiconductor temperature sensor
SPC GB/T 1550-2018 Test methods for conductivity type of extrinsic semiconducting materials (TEXT OF DOCUMENT IS IN CHINESE)

American Society for Testing and Materials (ASTM)

ASTM D3289-17 Standard Test Method for Density of Semi-Solid and Solid Asphalt Materials (Nickel Crucible Method)
ASTM D3289-17(2022) Standard Test Method for Density of Semi-Solid and Solid Asphalt Materials (Nickel Crucible Method)
ASTM D70-97 Standard Test Method for Specific Gravity and Density of Semi-Solid Bituminous Materials (Pycnometer Method)
ASTM D8188-18 Standard Test Method for Determination of Density and Relative Density of Asphalt, Semi-Solid Bituminous Materials, and Soft-Tar Pitch by Use of a Digital Density Meter (U-Tube)
ASTM D70-09e1 Standard Test Method for Density of Semi-Solid Bituminous Materials (Pycnometer Method)
ASTM D6095-12 Standard Test Method for Longitudinal Measurement of Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
ASTM D3004-97 Standard Specification for Extruded Crosslinked and Thermoplastic Semi-Conducting, Conductor and Insulation Shielding Materials
ASTM D6095-06 Standard Test Method for Longitudinal Measurement of Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
ASTM D3004-02 Standard Specification for Extruded Crosslinked and Thermoplastic Semi-Conducting, Conductor and Insulation Shielding Materials
ASTM D3004-08(2020) Standard Specification for Crosslinked and Thermoplastic Extruded Semi-Conducting, Conductor, and Insulation Shielding Materials
ASTM D8188-23 Standard Test Method for Determination of Density and Relative Density of Asphalt, Semi-Solid Bituminous Materials, and Soft-Tar Pitch by Use of a Digital Density Meter (U-Tube)

GSO

GSO IEC 60747-14-5:2015 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
OS GSO IEC 60747-14-4:2014 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
BH GSO IEC 60747-14-4:2016 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
GSO ISO 8840:2015 Refractory materials -- Determination of bulk density of granular materials (grain density)
OS GSO ISO 8840:2015 Refractory materials -- Determination of bulk density of granular materials (grain density)

BSI

NS-EN ISO 8840:2024 Refractory materials - Determination of bulk density of granular materials (grain density) (ISO 8840:2021)
DANSK DS/EN ISO 8840:2024 Refractory materials – Determination of bulk density of granular materials (grain density) (ISO 8840:2021)

International Electrotechnical Commission (IEC)

IEC 60747-14-5:2010 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
IEC 62899-203:2018 Printed electronics - Part 203: Materials - Semiconductor ink
IEC 62951-5:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials

IX-IX-IEC

IEC 62899-203:2024 RLV Printed electronics - Part 203: Materials - Semiconductor ink

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

JEDEC JEP140-2002 Beaded Thermocouple Temperature Measurement of Semiconductor Packages

GOSTR

GOST R 57844-2017 Composites. Determination of density by volumetric displacement - skeleton density by gas pycnometry

KR-KS

KS C IEC 62899-203-2023 Printed electronics — Part 203: Materials — Semiconductor ink

FI-SFS

NORDEST NT FIRE 012-1980 Smoke generated from solid materials. Specific optical density

CZ-CSN

CSN 35 8701-1975 Terminology of semiconductors and semiconductor devices