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Database: 365,228(8 Aug 2026)
superabrasive products precision dicing semiconductor chips precision dicing semiconductor chips introduction gb/t precision cutting centralized monitoring engineering electrical equipment chapter translation services
GB/T 43136-2023 in English

GB/T 43136-2023 in English

VALID

Superabrasive products—Precision dicing and cutting wheels for semiconductor chips

  • Issued on:2023-09-07
  • Implemented on:2024-04-01
  • File Format:PDF
  • Delivery:Via email within 1~3 business days
Price(USD): $240.00
$233.00
Standard No: GB/T 43136-2023
Document status: VALID
Title in English: Superabrasive products—Precision dicing and cutting wheels for semiconductor chips
Title in Chinese: 超硬磨料制品 半导体芯片精密划切用砂轮
Language: English
File Format: Electronic (PDF)
Delivery: Via email within 1~3 business days
Issued on: 2023-09-07
Implemented on: 2024-04-01
ICS Classification: 25.100.70-Abrasives
Chinese Classification: J43-Grinding material and apparatus
Professional Classification: GB-National Standard
Related Keywords: superabrasive products precision dicing
semiconductor chips
precision dicing
semiconductor chips introduction gb/t
precision cutting
Related Topics: Base abrasive
chip
semiconductor chip
chip grinding
semiconductor chip
Semiconductor Material Density
Superconductor application
core plan
semiconductor ultrasound
Superconductor application
precision navigation
semi-thin sliced slices
Terahertz chip semiconductor
Half wave plate preparation
Semiconductor Material Density
Dimensional measurement of semiconductor chips
semiconductor chip material
semi-thin slices
Semiconductor chip test
Semiconductor dicing film
Semiconductor precision liquid temperature regulating device
Core sand
Semiconductor chip series

《GB/T 43136-2023超硬磨料制品 半导体芯片精密划切用砂轮》由TC139(全国磨料磨具标准化技术委员会)归口,TC139SC3(全国磨料磨具标准化技术委员会超硬材料及制品分会)执行,主管部门为中国机械工业联合会。


Introduction

GB/T 43136-2023 Standard Overview

GB/T 43136-2023 "Superhard abrasive products - grinding wheels for precision dicing of semiconductor chips" is a standard developed for the precision processing needs of superhard abrasive products in the semiconductor industry. This standard specifies the product classification, technical requirements, test methods and inspection rules for grinding wheels for precision dicing of semiconductor chips, and is applicable to electroplated bond, resin bond and metal bond diamond grinding wheels for precision dicing of wafer chips and precision cutting of package chips.

Product Classification and Labeling

Category Product Code Binder Type Shape Code
Grinding Wheel for Precision Slicing of Wafer Chips SWDW Electroplating Binder 3A2 (Hub Type)
Grinding Wheel for Precision Cutting of Package Chips SPCW Resin Binder, Metal Binder, Electroplating Binder 1A8, 1B8, 1D8, 1E8 (Hubless Type)

Technical Requirements Analysis

The technical requirements for grinding wheels in this standard include appearance, basic size limit deviation, form and position tolerance and substrate roughness. The following is a comparison of key indicators:

Technical requirements Grinding wheel for precision wafer chip slicing Grinding wheel for precision package chip cutting
Limit deviation of abrasive layer thickness When U≤40 μm, -5 μm When T or T2≤0.15 mm, ±0.005 mm
Limit deviation of effective abrasive layer depth +130 μm +0.2 mm
Substrate roughness Ra≤1.6 μm Ra≤1.6 μm

Test methods and inspection rules

The standard specifies strict test methods and inspection rules, including appearance inspection, dimensional measurement and geometric tolerance inspection. Here are some key inspection requirements:

  • Outer diameter measurement: Use an image measuring instrument with a resolution of 0.01 mm.
  • Aperture measurement: The aperture of 3A2 grinding wheel is measured with a pneumatic measuring instrument, and other models are measured with a plug gauge or an inner diameter indicator.
  • Flatness inspection: Use a feeler gauge to measure the gap between the grinding wheel and the marble platform.

Background of Standard Formulation and Technological Evolution

With the development of the semiconductor industry, the requirements for chip processing accuracy are constantly increasing, and the application of superhard abrasive products is becoming more and more extensive. The formulation of this standard reflects the industry's demand for high-precision, high-performance grinding wheels, and embodies the technological upgrade from traditional grinding to precision machining.

Implementation Recommendations

To ensure the effective implementation of the standard, the following measures are recommended:

  1. Enterprises should establish a sound quality management system and strictly carry out production and inspection in accordance with the standards.
  2. Strengthen employee training, especially the operating specifications of newly introduced test methods and testing equipment.
  3. It is recommended to use standardized instruments (such as pneumatic measuring instruments and tool microscopes) to ensure measurement accuracy.

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