GB/T 43136-2023 in English
VALIDSuperabrasive products—Precision dicing and cutting wheels for semiconductor chips
- Issued on:2023-09-07
- Implemented on:2024-04-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
$233.00
《GB/T 43136-2023超硬磨料制品 半导体芯片精密划切用砂轮》由TC139(全国磨料磨具标准化技术委员会)归口,TC139SC3(全国磨料磨具标准化技术委员会超硬材料及制品分会)执行,主管部门为中国机械工业联合会。
Introduction
GB/T 43136-2023 Standard Overview
GB/T 43136-2023 "Superhard abrasive products - grinding wheels for precision dicing of semiconductor chips" is a standard developed for the precision processing needs of superhard abrasive products in the semiconductor industry. This standard specifies the product classification, technical requirements, test methods and inspection rules for grinding wheels for precision dicing of semiconductor chips, and is applicable to electroplated bond, resin bond and metal bond diamond grinding wheels for precision dicing of wafer chips and precision cutting of package chips.
Product Classification and Labeling
| Category | Product Code | Binder Type | Shape Code |
|---|---|---|---|
| Grinding Wheel for Precision Slicing of Wafer Chips | SWDW | Electroplating Binder | 3A2 (Hub Type) |
| Grinding Wheel for Precision Cutting of Package Chips | SPCW | Resin Binder, Metal Binder, Electroplating Binder | 1A8, 1B8, 1D8, 1E8 (Hubless Type) |
Technical Requirements Analysis
The technical requirements for grinding wheels in this standard include appearance, basic size limit deviation, form and position tolerance and substrate roughness. The following is a comparison of key indicators:
| Technical requirements | Grinding wheel for precision wafer chip slicing | Grinding wheel for precision package chip cutting |
|---|---|---|
| Limit deviation of abrasive layer thickness | When U≤40 μm, -5 μm | When T or T2≤0.15 mm, ±0.005 mm |
| Limit deviation of effective abrasive layer depth | +130 μm | +0.2 mm |
| Substrate roughness | Ra≤1.6 μm | Ra≤1.6 μm |
Test methods and inspection rules
The standard specifies strict test methods and inspection rules, including appearance inspection, dimensional measurement and geometric tolerance inspection. Here are some key inspection requirements:
- Outer diameter measurement: Use an image measuring instrument with a resolution of 0.01 mm.
- Aperture measurement: The aperture of 3A2 grinding wheel is measured with a pneumatic measuring instrument, and other models are measured with a plug gauge or an inner diameter indicator.
- Flatness inspection: Use a feeler gauge to measure the gap between the grinding wheel and the marble platform.
Background of Standard Formulation and Technological Evolution
With the development of the semiconductor industry, the requirements for chip processing accuracy are constantly increasing, and the application of superhard abrasive products is becoming more and more extensive. The formulation of this standard reflects the industry's demand for high-precision, high-performance grinding wheels, and embodies the technological upgrade from traditional grinding to precision machining.
Implementation Recommendations
To ensure the effective implementation of the standard, the following measures are recommended:
- Enterprises should establish a sound quality management system and strictly carry out production and inspection in accordance with the standards.
- Strengthen employee training, especially the operating specifications of newly introduced test methods and testing equipment.
- It is recommended to use standardized instruments (such as pneumatic measuring instruments and tool microscopes) to ensure measurement accuracy.

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