Dimensional measurement of semiconductor chips

Dimensional measurement of semiconductor chips, Total:194 items.

The international standard classification for "Dimensional measurement of semiconductor chips" includes: Optoelectronics. Laser equipment , Motion picture films. Cartridges , Integrated circuits. Microelectronics , Semiconductor devices , Abrasives .

The Chinese standard classification for "Dimensional measurement of semiconductor chips" includes: Microwave and millimeter wave diode and triode , Technical management , Photosensitive material , Microcircuit in general , Semiconductor triode , Semiconductor emitting device , Grinding material and apparatus , Power semiconductor device and parts .

---

Group Standards of the People's Republic of China

• T/QGCML 4122-2024 Semiconductor chip sorting machine
• T/QGCML 2041-2023 878 nm high power semiconductor laser chip
• T/JSSIA 0004-2017 Outline Dimensions of Wafer Level Chip Scale Package
• T/SZBX 018-2021 Products of Wafer Level Chip Scale Package

Fujian Provincial Standard of the People's Republic of China

• DB35/T 1193-2011 Semiconductor LED chip

Professional Standard - Electron

• SJ/T 11856.3-2022 Technical Specifications for Semiconductor Laser Chips for Optical Fiber Communications Part 3: Electric Absorption Modulated Semiconductor Laser Chips for Light Sources
• SJ/T 11487-2015 Non-contact measurement method for the resistivity of semi-insulating semiconductor wafer
• SJ/T 11399-2009 Measurement methods for chips of light emitting diodes
• SJ 2849-1988 Construction dimensions for package parts of discrete semiconductor devices
• SJ 2684-1986 Physical demensions for light emitting device of semiconductor
• SJ/T 11856.2-2022 Technical Specifications for Semiconductor Laser Chips for Optical Fiber Communications Part 2: Vertical Cavity Surface Emitting Semiconductor Laser Chips for Light Sources
• SJ 2247-1982 Outlines dimension for semiconductor optoelectronic devices
• SJ/T 11398-2009 Technical specification for power light-emitting diode chips
• SJ/T 11818.2-2022 Semiconductor UV Emitting Diodes Part 2: Chip Specifications
• SJ/T 11402-2009 Technical specification of semiconductor laser chip used in optical fiber communication
• SJ 2750-1987 Outline dimensions for semiconductor laser diodes
• SJ 2433-1984 Bonding sheet for semiconductor tubes
• SJ/T 10416-1993 Generic Apecification for chip for semiconductor discrete devices
• SJ/T 11856.1-2022 Technical Specifications for Semiconductor Laser Chips for Optical Fiber Communications Part 1: Fabry-Perot Type and Distributed Feedback Type Semiconductor Laser Chips for Light Sources

未注明发布机构

• JEDEC JESD49B.01-2023 Procurement Standard for Semiconductor Die Products Including Known Good Die (KGD)

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

• GB/T 36356-2018 Technical specification for power light-emitting diode chips
• GB/T 7092-1993 Outline dimensions of semiconductor integrated circuits
• GB/T 7581-1987 of outlines for semiconductor discrete devices
• GB/T 43136-2023 Superabrasive products—Precision dicing and cutting wheels for semiconductor chips
• GB/T 36357-2018 Technical specification for middle power light-emitting diode chips
• GB/T 6848-1986 Dimensions of the cores for motion-picture film rolls

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会

• GB/T 35010.4-2018 Semiconductor die products—Part 4: Requirements for die users and suppliers
• GB/T 35010.8-2018 Semiconductor die products—Part 8:EXPRESS model schema for data exchange
• GB/T 35010.7-2018 Semiconductor die products—Part 7:XML schema for data exchange
• GB/T 35010.3-2018 Semiconductor die products—Part 3: Guide for handling, packing and storage
• GB/T 35010.1-2018 Semiconductor die products—Part 1:Requirements for procurement and use
• GB/T 35010.5-2018 Semiconductor die products—Part 5:Requirements for concerning electrical simulation
• GB/T 35010.6-2018 Semiconductor die products—Part 6:Requirements for concerning thermal simulation
• GB/T 35010.2-2018 Semiconductor die products—Part 2:Exchange data formats

机械工业部

• JB/T 6306-1992 Power semiconductor module dimensions

国家市场监督管理总局、中国国家标准化管理委员会

• GB/T 7092-2021 Outline dimensions of semiconductor integrated circuits

Hebei Provincial Standard of the People's Republic of China

• DB13/T 5120-2019 Specifications for DC performance test of FP and DFB semiconductor laser chips for optical communication

Professional Standard - Machinery

• JB/T 8175-1999 Outline dimensions of extruded heat sink for power semiconductor devices

German Institute for Standardization

• DIN 50441-2:1998 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 2: Testing of edge profile
• DIN 50441-1:1996 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 1: Thickness and thickness variation
• DIN 50441-5:2001 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 5: Terms of shape and flatness deviation
• DIN 50441-4:1999 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 4: Slice diameter, diamter variation, flat diameter, flat length, flat depth
• DIN 50441-3:1985 Testing of materials for semiconductor technology; measurement of the geometric dimensions of semiconductor slices; determination of flatness deviation of polished slices by means of the multiple beam interference
• DIN 41885:1976 Cases type 101 for semiconductor devices; main dimensions
• DIN EN 62258-2:2011-12 Semiconductor die products - Part 2: Exchange data formats (IEC 62258-2:2011); English version EN 62258-2:2011 / Note: DIN EN 62258-2 (2005-12) remains valid alongside this standard until 2014-06-29.
• DIN 41877:1971 Case 6 A 3 for semiconductor devices; main dimensions
• DIN EN 62323:2006 Dimensions of half pot-cores made of ferrite for inductive proximity switches (IEC 62323:2005); German version EN 62323:2005
• DIN EN 60749-19:2011-01 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003 + A1:2010); German version EN 60749-19:2003 + A1:2010 / Note: DIN EN 60749-19 (2003-10) remains valid alongside this standard until 2013-09-01.
• DIN 41888:1976 Cases type 106 and 107 for semiconductor devices; main dimensions

CZ-CSN

• CSN 35 8720 Cast.1-1987 Semiconductor devices. Dimensions
• CSN 35 1605-1988 Power semiconductor devices. Main and connecting dimensions
• CSN 35 1607-1988 Power semiconductor devices. Air coolers. Main and connecting dimensions
• CSN 34 7190-1965 Measuring of dimensions and increments of strips. Conductors for winding.
• CSN 35 8970-1982 A group magazines forsemiconductor plates. Types, dimensitms and teehnical requirements

SCC

• BS PD ES 59008-2:1999 Data requirements for semiconductor die-Vocabulary
• BS PD ES 59008-4-1:2001 Data requirements for semiconductor die. Specific requirements and recommendations-Test and quality
• BS PD IEC/TR 62258-4:2007 Semiconductor die products-Questionnaire for die users and suppliers
• CEI EN 62258-1:2011 Semiconductor devices - Semiconductor die products Part 1: Procurement and use
• BS PD ES 59008-1:2000 Data requirements for semiconductor die-General requirements
• BS PD ES 59008-5-3:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types-Minimally-packaged die
• DANSK DS/CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
• CEI CLC/TR 62258-4:2013 Semiconductor die products Part 4: Questionnaire for die users and suppliers
• BS PD ES 59008-4-3:2000 Data requirements for semiconductor die. Specific requirements and recommendations-Thermal
• DANSK DS/EN 62258-1:2010 Semiconductor die products - Part 1: Procurement and use
• CEI EN 62258-2:2012 Semiconductor die products Part 2: Exchange data formats
• BS PD IEC/TR 62258-8:2008 Semiconductor die products-EXPRESS model schema for data exchange
• DANSK DS/EN 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
• BS PD IEC/TR 62258-7:2007 Semiconductor die products-XML schema for data exchange
• BS IEC 60191-2:1966+A20:2018 Mechanical standardization of semiconductor devices-Dimensions
• AS C379.2:1970 Mechanical standardization of semiconductor devices - Dimensions
• AS 3708.2:1989 Mechanical standardization of semiconductor devices - Dimensions
• 05/30127455 DC IEC 62258-4 ED.1. Semiconductor die products. Part 4. Questionnaire for die users and suppliers
• BS PD ES 59008-4-4:2000 Data requirements for semiconductor die. Specific requirements and recommendations-Electrical simulation
• BS 3934:1965 Specification for dimensions of semiconductor devices and integrated electronic circuits
• CEI EN 62323:2006 Dimensions of half pot-cores made of ferrite for inductive proximity switches
• UNE 57163-4:1992 PAPER AND BOARD CORES. PART 4: DIMENSIONAL MEASUREMENTS.
• DANSK DS/EN 62323:2005 Dimensions of half pot-cores made of ferrite for inductive proximity switches
• BS PD ES 59008-3:1999 Data requirements for semiconductor die-Mechanical, material and connectivity requirements
• BS PD ES 59008-4-2:2001 Data requirements for semiconductor die. Specific requirements and recommendations-Handling and storage
• DANSK DS/EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
• CEI EN 60749-19/A1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
• DANSK DS/EN 60749-19/A1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

British Standards Institution (BSI)

• PD ES 59008-4-1:2001 Data requirements for semiconductor die. Specific requirements and recommendations. Test and quality
• BS PD CLC/TR 62258-4:2013 Semiconductor die products. Questionnaire for die users and suppliers
• PD IEC/TR 62258-7:2007 Semiconductor die products. XML schema for data exchange
• PD ES 59008-5-3:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types. Minimally-packaged die
• PD IEC/TR 62258-8:2008 Semiconductor die products. EXPRESS model schema for data exchange
• BS EN 62323:2005 Dimensions of half pot-cores made of ferrite for inductive proximity switches
• BS IEC 60191-2:1966+A18:2011 Mechanical standardization of semiconductor devices. Dimensions
• BS EN 62317-12:2016 Ferrite cores. Dimensions. Ring cores
• BS ISO 11093-4:2022 Paper and board. Testing of cores - Measurement of dimensions

RU-GOST R

• GOST R 57439-2017 Semiconductor devices. Basic dimensions
• GOST 18472-1988 Semiconductor devices. Basic dimensions
• GOST 27591-1988 Power semiconductor modules. Orerall and mounting dimensions
• GOST 23900-1987 Power semiconductor devices. Overall and mounting dimensions
• GOST 23448-1979 Semiconductor infra-red emitting diodes. Basic dimensions

JP-JEITA

• JEITA ED7500A-2-2006 Standard for the dimensions of semiconductor devices (Discrete semiconductor devices)

PL-PKN

• PN T01503 ArkusZ50-1973 Semiconductor devicesDimensions Case C9
• PN T01503 ArkusZ06-1973 Semiconductor devices Dimensions Device A 24
• PN T01503 ArkusZ16-1973 Semiconductor devices Dimensions Device A 51
• PN T01503 ArkusZ01-1972 Semiconduc?or devices Dimension Device A1
• PN T01503 ArkusZ15-1973 Semiconductor devices Oimensions Device A 33

GSO

• GSO IEC 60191-2:2014 Mechanical standardization of semiconductor devices - Part 2: Dimensions
• OS GSO IEC/TR 62258-4:2014 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
• BH GSO IEC/TR 62258-4:2016 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
• OS GSO IEC 62258-1:2014 Semiconductor die products - Part 1: Procurement and use
• BH GSO IEC 62258-1:2016 Semiconductor die products - Part 1: Procurement and use
• GSO IEC 62258-1:2014 Semiconductor die products - Part 1: Procurement and use
• BH GSO IEC 62323:2016 Dimensions of half pot-cores made of ferrite for inductive proximity switches
• GSO IEC 60749-19:2014 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

IN-BIS

• IS 5000 OD.37-1982 Semiconductor device size device outline size OD 37
• IS 5000 OC.4-1969 Semiconductor device size CASE OUTLINE OC4
• IS 5000 OD.34-1981 Semiconductor device size DEVICE OUTLINE 34
• IS 5000 OB.1-1969 Basic overall dimensions of semiconductor devices OB1
• IS 5000 OD.1-1969 Semiconductor device size device outline OD1
• IS 5000 OD.6-1969 Semiconductor device size device outline OD6
• IS 5000 OB.7-1969 Basic overall dimensions of semiconductor devices OB7
• IS 5000 OD.2-1969 Semiconductor device size device outline OD2
• IS 5000 OD.16-1973 Semiconductor device size device outline OD16
• IS 5000 OD.4-1969 Semiconductor device size device outline OD4
• IS 5000 OD.11-1971 Semiconductor device size device outline OD11
• IS 5000 OB.4-1969 Basic overall dimensions of semiconductor devices OB4
• IS 5000 OD.13-1971 Semiconductor device size device outline OD13
• IS 5000 OD.18-1974 Semiconductor device size device outline OD18
• IS 5000 OB.2-1969 Basic overall dimensions of semiconductor devices OB2
• IS 5000 OD.19-1974 Semiconductor device size device outline OD19
• IS 5000 OB.6-1969 Basic overall dimensions of semiconductor devices OB6
• IS 5000 OD.14-1971 Semiconductor device size device outline OD14
• IS 5000 OD.15-1973 Semiconductor device size device outline OD15
• IS 5000 OD.8-1969 Semiconductor device size device outline OD8
• IS 5000 OD.31-1981 Semiconductor device size device outline OD31
• IS 5000 OD.9-1969 Semiconductor device size device outline OD9
• IS 5000 OD.10-1971 Semiconductor device size device outline OD1O
• IS 5000 OD.30-1981 Semiconductor device size device outline OD30
• IS 5000 OD.17-1974 Semiconductor device size device outline OD17
• IS 5000 OD.5-1969 Semiconductor device size device outline OD5
• IS 5000 OD.33-1981 Semiconductor device size device outline OD33
• IS 5000 OD.35-1981 Semiconductor device size device outline OD35
• IS 5000 OB.5-1969 Basic dimensions of semiconductor devices OB5
• IS 5000 OD.7-1969 Semiconductor device size device outline OD7
• IS 5000 OD.12-1971 Semiconductor device size device outline OD12
• IS 5000 OD.36-1981 Semiconductor Device Dimensions Device Outline Figure 36
• IS 5000 OD.24-1979 Semiconductor device size device outline OD 24
• IS 5000 OD.28-1978 Semiconductor device size device outline OD 28
• IS 5000 OD.26-1978 Semiconductor device size device outline OD 26
• IS 5000 OC.1-1969 Dimensions of Semiconductor Equipment Case Outline OC1
• IS 5000 OD.21-1979 Semiconductor device size device outline OD 21
• IS 5000 OD.22-1978 Semiconductor device size device outline OD 22
• IS 5000 OC.3-1969 Dimensions of Semiconductor Equipment Case Outline OC3
• IS 5000 OD.29-1979 Semiconductor Device Dimensions Device Outline OD 29
• IS 5000 OD.25-1978 Semiconductor device size device outline OD 25
• IS 5000 OD.20-1978 Semiconductor device size device outline OD 20
• IS 5000 OD.27-1978 Semiconductor Device Dimensions Device Outline OD 27
• IS 5000 OC.5-1969 Dimensions of Semiconductor Equipment Case Outline OC5
• IS 5000 OD.23-1978 Semiconductor device size device outline OD 23

IPC - Association Connecting Electronics Industries

• IPC/EIA J-STD-026-1999 Semiconductor Design Standard for Flip Chip Applications
• IPC/EIA J-STD-026 CD-1999 Semiconductor Design Standard for Flip Chip Applications
• IPC J-STD-027 CD-2003 Mechanical Outline Standard for Flip Chip and Chip Size Configurations

Danish Standards Foundation

• DS/CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
• DS/ES 59008-4-1:2001 Data requirements for semiconductor die - Part 4-1: Specific requirements and recommendations - Test and quality
• DS/ES 59008-5-1:2001 Data requirements for semiconductor die - Part 5-1: Particular requirements and recommendations for die types - Bare die
• DS/EN 62258-1:2010 Semiconductor die products - Part 1: Procurement and use
• DS/EN 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
• DS/EN 60749-19/A1:2010 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
• DS/EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

European Committee for Electrotechnical Standardization（CENELEC）

• CLC/TR 62258-4-2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
• CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers

CENELEC - European Committee for Electrotechnical Standardization

• ES 59008-5-1-2001 Data Requirements for Semiconductor Die Part 5-1: Particular Requirements and Recommendations for Die Types - Bare Die
• EN 62258-2:2005 Semiconductor die products Part 2: Exchange data formats
• EN 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
• ES 59008-5-3-2001 Data Requirements for Semiconductor Die - Part 5-3: Particular Requirements and Recommendations for Die Types - Minimally-Packaged Die

ES-UNE

• UNE-EN 62258-1:2010 Semiconductor die products -- Part 1: Procurement and use (Endorsed by AENOR in February of 2011.)
• UNE-EN 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats (Endorsed by AENOR in October of 2011.)

Association Francaise de Normalisation

• NF EN 62258-1:2011 Semiconductor Chip Products - Part 1: Supply and Use
• NF EN 62258-2:2011 Semiconductor Chip Products - Part 2: Data Exchange Formats
• NF C93-375*NF EN 62323:2005 Dimensions of half pot-cores made of ferrite for inductive proximity switches
• NF C93-339:2005 Ferrite cores (ETD-cores) intended for use in power supply applications - Dimensions.

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

• JEDEC JESD22-B118-2011 Semiconductor Wafer and Die Backside External Visual Inspection

IEC - International Electrotechnical Commission

• IEC TR 62258-4:2012 Produits de puces de semiconducteurs – Partie 4: Questionnaire destiné aux utilisateurs et fournisseurs de puces (Edition 2.0)

(U.S.) Telecommunications Industries Association

• TIA J-STD-026-1999 Semiconductor Design Standard for Flip Chip Applications IPC/EIA J-STD-026

Korean Agency for Technology and Standards (KATS)

• KS C 6587-1973(1998) GENERAL RULES FOR MECHANICAL STANDARDIZATION OF SEMICONDUCTOR INTEGRATED CIRCUITS
• KS C 6587-1982 GENERAL RULES FOR MECHANICAL STANDARDIZATION OF SEMICONDUCTOR INTEGRATED CIRCUITS
• KS C IEC 62323:2008 Dimensions of half pot-cores made of ferrite for inductive proximity switches
• KS C IEC 62323-2023 Dimensions of half pot-cores made of ferrite for inductive proximity switches
• KS R 5012-2003 MOUNTING DIMENSIONS OF SEMICONDUCTOR TYPE CHARGING ALTERNATORS FOR AUTOMOBILES

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

• IPC J-STD-027-2003 Mechanical Outline Standard for Flip Chip and Chip Size Configurations
• IPC J-STD-026-1999 Semiconductor Design Standard for Flip Chip Applications IPC/EIA J-STD-026

International Electrotechnical Commission (IEC)

• IEC 62323:2005 Dimensions of half pot-cores made of ferrite for inductive proximity switches

International Organization for Standardization (ISO)

• ISO 1039:1995 Cinematography - Cores for motion-picture and magnetic film rolls - Dimensions

KR-KS

• KS C IEC 62323-2008(2023) Dimensions of half pot-cores made of ferrite for inductive proximity switches

TIA - Telecommunications Industry Association

• J-STD-026-1999 Semiconductor Design Standard for Flip Chip Applications (IPC/EIA J-STD-026)

Association of German Mechanical Engineers

• VDI/VDE 3713 Blatt 8-1995 Technical procurement specification - Epoxy encapsulants for semiconductor chips

SE-SIS

• SIS SS CECC 00013-1985 Basic specification: Scanning electron microscope inspection of semiconductor dice

HU-MSZT

• MSZ 7200/3-1984 High power semiconductor tools. Contour and connection dimensions

Others: Semiconductor gap measurement,Semiconductor chip geometry measurement,Semiconductor photodetectors and photoreceivers - methods of measurement of photoelectric parameters and determination of characteristics,Measuring resistivity, Hall coefficient and Hall of single crystal semiconductor.,Measurement of Semiconductor Photocurrent,Test Method for Measuring Resistivity, Hall Coefficient and Hall Mobility of Single Crystal Semiconductors,Measuring method of Hall mobility and Hall coefficient of extrinsic semiconductor single crystal,Semiconductor Measuring Instruments,Semiconductor Optical Measurement,Semiconductor parameter measurement,High-frequency measurement of properties of semiconductor materials,Dimensional measurement of semiconductor chips,Extrinsic Semiconductor Single Crystal Hall Mobility and Hall Coefficient Measurements