GB/T 35010.6-2018 in English

This standard outlines the requirements for thermal simulation in semiconductor chip products. It specifies the procedures and criteria for conducting thermal simulations to ensure the performance and reliability of semiconductor devices under various operating conditions. The document provides guidance on the modeling and analysis techniques used in thermal simulation, including the assumptions and parameters that should be considered. It also addresses the validation and verification processes to confirm the accuracy of the simulation results. The standard is intended to support the design and development of semiconductor products by establishing a consistent approach to thermal analysis. It covers the essential aspects of thermal simulation to facilitate the evaluation of thermal behavior and the identification of potential thermal issues during the product lifecycle.