thermoelectric semiconductor
thermoelectric semiconductor, Total:434 items.
The international standard classification for "thermoelectric semiconductor" includes: Semiconductor devices in general , Plug-and-socket devices. Connectors , Measurement of force, weight and pressure , Other electromechanical components , Electromechanical components in general , Semiconductor devices , Electrical engineering (Vocabularies) , Mechanical structures for electronic equipment , Plastics and rubber insulating materials , Integrated circuits. Microelectronics , Testing of metals , Testing of metals in general , Rectifiers. Convertors. Stabilized power supply , Mechanical testing of metals , Electronic components in general , Semiconducting materials , Other electrical accessories , Optoelectronics. Laser equipment , Aerospace electric equipment and systems .
The Chinese standard classification for "thermoelectric semiconductor" includes: Power semiconductor device and parts , Transformer , Industrial automation and control device in general , Basic standards and general methods , Electrical insulating material and its products , Connector , Microcircuit in general , Metal physical property test method , Semiconductor integrated circuit , Metal nondestructive testing method , Semiconductor discrete devices in general , Semimetal and semiconductor material in general , Basic standards and general methods , Optoelectronic device assembly , Technical management , Technical management , Laser device , Electronic components .
Professional Standard - Machinery
- JB/T 2423-1999 Type designation for power semiconductor device
- JB/T 7483-1994 Semiconductor resistance strain sensor
- JB/T 10501-2005 Ceramic parts of case for power semiconductor devices
- JB/T 10097-2000 Case for power semiconductor device
- JB/T 7063-1993 Rated Voltage and Current of Power Semiconductor Devices
- JB/T 7786-1995 Sampling Method for Test of Power Semiconductor Devices
- JB/T 7059-1993 Guide for Preparation of Standard for Power Semiconductor Modules
- JB/T 8175-1999 Outline dimensions of extruded heat sink for power semiconductor devices
- JB/T 10096-2000 Selection guidance of case for power semiconductor device
- JB/T 5842-1991 Die alignment rings for power semiconductor devices
- JB/T 5781-1991 Sectioned Radiator for Power Semiconductor Devices. Technical Specification
- JB/T 5842-2005 Rings for dies of semiconductor devices
- JB/T 5843-2005 Connectors for power semiconductor devices
- JB/T 11331-2013 Heat-shrinkable Semi-conductive Tubing
- JB/T 5835-2005 Components of gate terminal for power semiconductor devices
- JB/T 5835-1991 Gate assemblies for power semiconductor devices
- JB/T 9644-1999 Reactor for semiconductor electric drive
- JB/T 9687.1-1999 Molybdenum Disk for Power Semiconductor Devices
- JB/T 8669-1997 Semiconductor Frequency Changing Unit Intended to Be Used in Medium Frequency Induction Heating
- JB/T 7483-2005 Semiconductor resistance strain gauge force stransducer/sensor
- JB/T 5843-1991 Connectors for Power Semiconductor Devices
- JB/T 9684-2000 Selecting guide of heat sink for power semiconductor device
- JB/T 10096-1999 Selection Guidance of Case for Power Semiconductor Device
- JB/T 8757-1998 Hot Pipe Radiators Intended to be Used in Power Semiconductor Devices
- JB/T 10097-1999 Cases for Power Semiconductor Devices
- JB/T 7061-1993 Silicon Wafers Intended to Be Used in Power Semiconductor Devices
- JB/T 8661-1997 Construction Parts of Electric Semiconductor Modules
- JB/T 9687.2-1999 Tungsten disk for power semiconductor devices
- JB/T 4277-1996 Packing of Power Semiconductor Parts
- JB/T 5844-1991 Directional relays and power relays with two input energizing quantities (IEC 60255-12: 1980 NEQ)
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
- GB/T 42835-2023 Semiconductor integrated circuits—System on chip(SoC)
- GB/T 7092-1993 Outline dimensions of semiconductor integrated circuits
- GB/T 15872-1995 Power supply interface for semiconductor equipment
- GB/T 8446.1-1987 Heat sink for power semiconductor device
- GB/T 13422-2013 Semiconductor converters—Electrical test methods
- GB/T 42836-2023 Microwave semiconductor integrated circuits—Frequency mixer
- GB 15651.4-2017 Semiconductor devices Discrete devices Part 5-4: Optoelectronic devices Semiconductor lasers
- GB/T 8446.2-2004 Heat sink for power semiconductor device - Part 2: Measuring method of thermal resistance and imput fluid-output fluid pressure difference
- GB/T 42736-2023 Heat-shinkable semiconductive polyolefin sleeving
- GB/T 19403.1-2003 Semiconductor devices—Integrated Circuits—Part 11:Section 1:Internal visual examination for semiconductor integrated circuits (excluding hybrid circuits)
- GB/T 13422-1992 Power semiconductor converters-Electrical test methods
- GB/T 8446.1-2004 Heat sink for power semiconductor device—Part 1:Casting kind series
- GB/T 12750-2006 Semiconductor devices―Integrated circuits―Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
- GB/T 7423.3-1987 Heat sink of semiconductor devices--Heat sink, staggered fingers shapes
- GB/T 14264-2024 Terminology of semiconductor materials
- GB/T 14264-2009 Semiconductor materials - Terms and definitions
- GB/T 42838-2023 Semiconductor integrated circuits—Measuring method of Holzer circuit
- GB/T 3430-1989 The rule of type designation for semiconductor integrated circuits
- GB/T 42837-2023 Microwave semiconductor integrated circuits—Amplifier
- GB/T 17950-2000 Semiconductor converter - Part 6: Application guide for the protection of semiconductor converters against overcurrent by fuses
- GB/T 2900.32-1994 Electrotechnical terminology - Power semiconductor device
- GB/T 20521-2006 Semconductor devices Part 14-1: Semiconductor sensors - General and classification
- GB/T 1550-1997 methods for measuring conductivity type of extrinsic semiconducting materials
- GB/T 6616-2023 Test method for resistivity of semiconductor wafers and sheet resistance of semiconductor films—Noncontact eddy-current gauge
- GB/T 20522-2006 Semiconductor devices Part 14-3: Semiconductor sensors - Pressure sensors
- GB/T 8446.2-1987 Measuring method of thermal resistance and input fluid-output fluid pressure difference of heat sink for power semiconductor device
- GB/T 7423.1-1987 Heat sink of semiconductor devices--Generic specification
- GB/T 5839-1986 Rating systems for electronic tubes and semiconductor devise
- GB/T 14862-1993 Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits
- GB/T 2900.66-2004 Electrotechnical terminology - Semiconductor devices and integrated circuits
- GB/T 15872-2013 Power supply interface for semiconductor equipment
- GB 7423.3-1987 sink of semiconductor devices - Heat sink, staggered fingers shapes
- GB/T 3859.2-1993 Semiconductor convertors Application guide
- GB/T 7423.2-1987 Heat sink of semiconductor devices--Heat sink, Extruded shapes
- GB/T 14113-1993 of packages for semiconductor integrated circuits
- GB/T 3434-1986 Families and products of ECL circuits for semiconductor integrated circuits
- GB/T 3859.3-1993 Semiconductor convertors—Transformers and reactors
- GB 5839-1986 Rating systems for electronic tubes and semiconductor devise
- GB/T 42974-2023 Semiconductor integrated circuits—Flash memory(FLASH)
- GB/T 8446.3-1988 Insulators and fasteners for heat sink for power semiconductor device
- GB 7423.1-1987 sink of semiconductor devices - Generic specification
- GB/T 14264-1993 Semiconductor materials-Terms and definitions
- GB/T 20515-2006 Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits
- GB 12565-1990 Sectional Specification for Semiconductor Devices and Optoelectronic Devices
- GB/T 8446.3-2004 Metallic materials - Wire - Wrapping test
- GB 7423.2-1987 sink of semiconductor devices - Heat sink, Extruded shapes
国家市场监督管理总局、中国国家标准化管理委员会
- GB/T 1550-2018 Test methods for conductivity type of extrinsic semiconducting materials
- GB/T 37031-2018 Semiconductor lighting terminology
- GB/T 8446.1-2022 Heat sinks for power semiconductor devices—Part 1: Radiators
- GB/T 7092-2021 Outline dimensions of semiconductor integrated circuits
- GB/T 8446.3-2022 Heat sinks for power semiconductor devices—Part 3: Insulators and fasteners
- GB/T 8446.2-2022 Heat sinks for power semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop
Military Standard of the People's Republic of China-General Armament Department
- GJB 597A-1996 General Specification for Semiconductor Integrated Circuits
- GJB/Z 41.3-1993 Military semiconductor discrete device series spectrum semiconductor optoelectronic devices
- GJB 8120-2013 General specification for semiconductor optoelectronic module
- GJB 597B-2012 General specification for semiconductor integrated circuits
- GJB 33/15-2011 Semiconductor optoelectronic device.Detail specification for type BT401 semiconductor infrared-emitting diode
- GJB 1420B-2011 General specification for packages of semiconductor integrated circuits
- GJB 8121-2013 General specification for semiconductor optoelectronic assembly
- GJB 1420A-1999 General Specification for Semiconductor Integrated Circuit Enclosures
- GJB 8119-2013 General specification for semiconductor optoelectronic device
- GJB 33/17-2011 Semiconductor optoelectronic device.Detail specification for type GO11 semiconductor photocoupler
- GJB 597/12A-1998 Detailed specifications for semiconductor integrated circuit HCMOS gate circuits
- GJB 33/18-2011 Semiconductor optoelectronic device.Detail specification for type GO417 bidirectional analog switch semiconductor photocoupler
- GJB 33/16-2011 Semiconductor optoelectronic device.Detail specification for type 3DU32 semiconductor phototransistor
机械电子工业部
- JB 5781-1991 Technical conditions of profile radiators for power semiconductor devices
- JB 5842-1991 Die positioning rings for power semiconductor devices
- JB 5835-1991 Gate assembly for power semiconductor devices
- JB 5843-1991 Connectors for power semiconductor devices
Guizhou Provincial Standard of the People's Republic of China
- DB52/T 844-2013 Semiconductor Current Regulator
- DB52/T 796-2013 Industrial semiconductor electric detonator
- DB52/T 1104-2016 Transient test method for junction-case thermal resistance of semiconductor devices
Professional Standard - Electron
- SJ 1795-1981 Detail specification for 50-1000mA low current thyristors
- SJ/T 11067-1996 Commonly used terms for semiconductor photoelectric materials and pyroelectric materials in infrared detecting materials
- SJ 20788-2000 Measurment method for thermal impedance of semiconductor diodes
- SJ 2433-1984 Bonding sheet for semiconductor tubes
- SJ/T 11487-2015 Non-contact measurement method for the resistivity of semi-insulating semiconductor wafer
- SJ/T 11395-2009 Semiconductor lighting terminology
- SJ 20787-2000 Measurement method for thermal resistance of semiconductor bridge rectifieres
- SJ/T 9534-1993 Grading standard of quality for semiconductor integrated circuits
- SJ 20642-1997 Semiconductor opto-electronic module-General specification for
- SJ/T 2215-2015 Measuring methods for semiconductor photocouplers
- SJ 20786-2000 General specification for semiconductor opto-electronic assembly
- SJ/T 11742-2019 Thermally conductive non-prepreg prepreg for printed circuit
- SJ 50033/109-1996 Semiconductor optoelectronic devices - Detail specification for Types GJ903T and GJ9032T and GJ9034T semiconductor laser diodes
- SJ 2247-1982 Outlines dimension for semiconductor optoelectronic devices
- SJ/T 2214-2015 Measuring methods for semiconductor photodiode and phototransistor
国家机械工业局
- JB 9644-1999 Reactor for semiconductor electric transmission
Taiwan Provincial Standard of the People's Republic of China
- CNS 13802.5-1997 Graphical Symbols for Diagrams (Semiconductors and Electron Tubes)
- CNS 13802-5-1997 Graphical Symbols for Diagrams (Semiconductors and Electron Tubes)
- CNS 7011-1981 Numbering of Electrodes in Multiple Electrode Semiconductor Devices and Designation of Units in Multiple Unit Semiconductor Devices
- CNS 11900-1987 Fixed Ceramic Capacitors for Electronic Equipment (Semiconductor)
中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会
- GB/T 15651.4-2017 Semiconductor devices-Discrete devices-Part 5-4:Optoelectronic devices-Semiconductor lasers
- GB/T 35010.6-2018 Semiconductor die products—Part 6:Requirements for concerning thermal simulation
Professional Standard - Aerospace
- QJ 259-1977 器件
- QJ 786-1983 Semiconductor Integrated Circuits - Specifications for Screening
- QJ 2212-1991 Semiconductor Integrated Circuit Design Guidelines
机械工业部
- JB/T 6306-1992 Power semiconductor module dimensions
Professional Standard - Ferrous Metallurgy
- YB/T 6113-2023 Silicon carbide heat conductor for electric heating furnace
Guangdong Provincial Standard of the People's Republic of China
- DB44/T 1873-2016 semiconductor refrigeration wine cabinet
Group Standards of the People's Republic of China
- T/IAWBS 009-2019 High Voltage Bias Steady-state Temperature Humidity Test for Power Semiconductor Devices
- T/JSXH 0002-2020 Regeneration solution for semiconductor
- T/QGCML 4031-2024 Semiconductor optical wafer
工业和信息化部
- QB/T 5369-2019 Semiconductor refrigeration appliance
Jiangxi Provincial Standard of the People's Republic of China
- DB3603/T 4-2022 Technical specifications for the manufacture of semiconducting glazes for electric porcelain
GOSTR
- GOST 18577-1980 Thermoelectric semiconductor devices. Terms and definitions
SCC
- BS PD IEC TR 63378-1:2021 Thermal standardization on semiconductor packages-Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
- DANSK DS/EN 62830-2:2017 Semiconductor devices – Semiconductor devices for energy harvesting and generation – Part 2: Thermo power based thermoelectric energy harvesting
- BS IEC 60747-14-3:2001 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-Pressure sensors
- DIN EN 62830-2 E:2014 Draft Document - Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting (IEC 47/2190/CD:2014)
- BS IEC 60747-14-1:2000 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-General and classification-Sensor generals and classification for semiconductor sensors
- CEI EN 62416:2011 Semiconductor devices - Hot carrier test on MOS transistors
- AS 1955.2:1978 Semiconductor convertors - Semiconductor self-commutated convertors
- DANSK DS/EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
- BS 3839:1965 Oxygen free high conductivity copper for electronic tubes and semiconductor devices
- BS PD ES 59008-4-3:2000 Data requirements for semiconductor die. Specific requirements and recommendations-Thermal
- CEI 3-17:2005 Segni grafici per schemi - Semiconduttori e tubi elettronici
- IEC 60146:1973 Semiconductor convertors
- DANSK DS/EN IEC 63244-1:2021 Semiconductor devices – Semiconductor devices for wireless power transfer and charging – Part 1: General requirements and specifications
- CEI EN IEC 63244-1:2022 Semiconductor devices - Semiconductor devices for wireless power transfer and charging Part 1: General requirements and specifications
- BS 3363:1961 Schedule of letter symbols for light-current semiconductor devices
- CEI EN 62415:2011 Semiconductor devices - Constant current electromigration test
- DIN IEC 60747-14-5 E:2008 Draft Document - Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor (IEC 47E/353/CD:2007)
- DIN IEC 60747-10:1987 Semiconductor devices; generic specification for semiconductor devices and integrated circuits; identical with IEC 60747-10, edition 1984
- DANSK DS/EN 62415:2010 Semiconductor devices - Constant current electromigration test
- 12/30258683 DC BS EN 62779-1. Semiconductor devices. Semiconductor interface for human body communication. General requirements
- MIL MIL-H-87111/5B-1986 HEAT SINKS, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, CLASS I (FORMED) (S/S BY MIL-H-87111/5C)
- CEI EN IEC 63287-1:2022 Semiconductor devices - Generic semiconductor qualification guidelines Part 1: Guidelines for IC reliability qualification
- CEI EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication Part 1: General requirements
- BS PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices
- 07/30164953 DC IEC 60747-14-5. Semiconductor devices. Discrete devices. Part 14-5. Semiconductor sensors. PN-junction semiconductor temperature sensor
- DANSK DS/EN IEC 63287-1:2021 Semiconductor devices – Generic semiconductor qualification guidelines – Part 1: Guidelines for IC reliability qualification
- 12/30261676 DC BS EN 62779-2. Semiconductor devices. Semiconductor interface for human body communication. Characterization of interfacing performances
- AS 1102.5:1972 Graphical symbols for electrotechnology - Semiconductor devices
- MIL MIL-DTL-19491J-2014 Semiconductor Devices, Packaging of
- BS IEC 60747-1:2006 Semiconductor devices. General
- CEI EN 62258-1:2011 Semiconductor devices - Semiconductor die products Part 1: Procurement and use
- AENOR UNE 21017:1959 BARE, SEMI-RIGID COPPER CABLES FOR ELECTRICAL CONDUCTORS
- AS C379.1:1970 Mechanical standardization of semiconductor devices - Preparation of drawings of semiconductor devices
- DANSK DS/EN IEC 62969-1:2018 Semiconductor devices – Semiconductor interface for automotive vehicles – Part 1: General requirements of power interface for automotive vehicle sensors
British Standards Institution (BSI)
- PD IEC TR 63378-1:2021 Thermal standardization on semiconductor packages. Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
- BS IEC 62830-2:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation. - Part 2: Thermo power based thermoelectric energy harvesting
- BS IEC 60747-5-4:2022 Semiconductor devices - Optoelectronic devices. Semiconductor lasers
- BS EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
- BS IEC 60747-14-2:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
- BS IEC 60747-14-2:2000 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
- BS IEC 60747-6:2000 Discrete semiconductor devices and integrated circuits - Thyristors
- BS IEC 60747-6:2001 Discrete semiconductor devices and integrated circuits - Thyristors
- BS IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Optoelectronic devices - Semiconductor lasers
- BS IEC 60747-14-1:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - General and classification - Sensor generals and classification for semiconductor sensors
- BS IEC 60747-14-5:2010 Semiconductor devices - Semiconductor sensors - PN-junction semiconductor temperature sensor
- BS IEC 62830-5:2021 Semiconductor devices. Semiconductor devices for energy harvesting and generation. Test method for measuring generated power from flexible thermoelectric devices
- 22/30443234 DC BS EN 63378-3. Thermal standardization on semiconductor packages - Part 3. Thermal circuit simulation models of semiconductor packages for transient analysis
- BS IEC 62951-5:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for thermal characteristics of flexible materials
- BS IEC 60748-11:1991 Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits
- BS IEC 60748-11:2000 Semiconductor devices - Integrated circuits - Sectional specification for semiconductor integrated circuits excluding hybrid circuits
- BS IEC 62951-4:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
- 23/30469010 DC BS EN IEC 63378-3. Thermal standardization on semiconductor packages - Part 3. Thermal circuit simulation models of discrete semiconductor packages for transient analysis
- BS IEC 60747-14-4:2011 Semiconductor devices. Discrete devices. Semiconductor accelerometers
- BS IEC 60747-14-3:2009 Semiconductor devices - Semiconductor sensors - Pressure sensors
- BS IEC 62951-6:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for sheet resistance of flexible conducting films
- BS EN 60747-15:2004 Discrete semiconductor devices. Isolated power semiconductor devices
- BS EN 62779-1:2016 Semiconductor devices. Semiconductor interface for human body communication. General requirements
- BS EN IEC 62969-1:2018 Semiconductor devices. Semiconductor interface for automotive vehicles. General requirements of power interface for automotive vehicle sensors
- BS IEC 62899-203:2024 Printed electronics - Materials. Semiconductor ink
- BS IEC 60747-8-4:2004 Discrete semiconductor devices - Metal-oxide semiconductor field-effect transistors (MOSFETs) for power switching applications
- 18/30355426 DC BS EN 62830-5. Semiconductor devices. Semiconductor devices for energy harvesting and generation. Part 5. Test method for measuring generated power from flexible thermoelectric devices
- 19/30404095 DC BS EN IEC 60747-5-4. Semiconductor devices. Part 5-4. Optoelectronic devices. Semiconductor lasers
- BS 6493-2.1:1985 Semiconductor devices - Integrated circuits - General
- BS IEC 60748-1:2002 Semiconductor devices - Integrated circuits - General
- BS EN IEC 63244-1:2021 Semiconductor devices. Semiconductor devices for wireless power transfer and charging. General requirements and specifications
- BS EN 60747-15:2012 Semiconductor devices. Discrete devices. Isolated power semiconductor devices
- BS QC 790101:1992 Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits. Internal visual examination for semiconductor integr...
- BS IEC 62830-7:2021 Semiconductor devices. Semiconductor devices for energy harvesting and generation. Linear sliding mode triboelectric energy harvesting
- BS IEC 60747-14-1:2010 Semiconductor devices - Semiconductor sensors - Generic specification for sensors
- 23/30473272 DC BS IEC 60747-5-4 AMD 1. Semiconductor devices - Part 5-4. Optoelectronic devices. Semiconductor lasers
- BS IEC 62779-4:2020 Semiconductor devices. Semiconductor interface for human body communication - Capsule endoscope
- BS IEC 62951-1:2017 Semiconductor devices. Flexible and stretchable semiconductor devices - Bending test method for conductive thin films on flexible substrates
- 23/30469486 DC BS EN IEC 63378-2. Thermal standardization on semiconductor packages - Part 2. 3D thermal simulation models of discrete semiconductor packages for steady-state analysis
- BS EN 62415:2010 Semiconductor devices - Constant current electromigration test
- BS EN IEC 60747-5-5:2020 Semiconductor devices. Optoelectronic devices. Photocouplers
- BS 3839:1978 Specification for oxygen-free high-conductivity copper for electronic tubes and semiconductor devices
- 13/30264600 DC BS EN 60747-14-8. Semiconductor devices. Part 14-8. Semiconductor sensors. Capacitive degradation sensor of liquid
- BS EN 62779-2:2016 Semiconductor devices. Semiconductor interface for human body communication. Characterization of interfacing performances
- BS IEC 60748-2:1998 Semiconductor devices. Integrated circuits. Digital integrated circuits
- BS EN 62258-6:2006 Semiconductor die products - Requirements for information concerning thermal simulation
- PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices
- BS IEC 60748-5:1997 Semiconductor devices - Integrated circuits - Semicustom integrated circuits
- BS IEC 62899-203:2018 Printed electronics. Materials. Semiconductor ink
- BS IEC 60748-2:1997 Semiconductor devices - Integrated circuits - Digital integrated circuits
- BS EN 60747-16-4:2004+A2:2017 Semiconductor devices - Microwave integrated circuits. Switches
- BS IEC 60747-1:2006+A1:2010 Semiconductor devices - General
- BS IEC 60748-4:1997 Semiconductor devices. Integrated circuits. Interface integrated circuits
- BS EN 62047-19:2013 Semiconductor devices. Micro-electromechanical devices. Electronic compasses
- BS IEC 62951-9:2022 Semiconductor devices. Flexible and stretchable semiconductor devices - Performance testing methods of one transistor and one resistor (1T1R) resistive memory cells
- 18/30363340 DC BS IEC 62779-4. Semiconductor devices. Semiconductor interface for human body communication. Part 4. Semiconductor interface for capsule endoscopy using human body communication
Defense Logistics Agency
- DLA DESC-DWG-84002-1984 HEAT SINKS FOR SEMICONDUCTOR DEVICES
- DLA SMD-5962-96665 REV D-2005 MICROCIRCUIT, DIGITAL, RADIATION HARDENED, CMOS, HEX VOLTAGE LEVEL SHIFTER FOR TTL-TO-CMOS OR CMOS-TO- CMOS OPERATION, MONOLITHIC SILICON
- DLA MIL-S-19500/230 C VALID NOTICE 4-2011 Semiconductor Device, Diode, Silicon, High-Conductance Type JAN- 1N3207
- DLA MIL-DTL-19491 H-2002 SEMICONDUCTOR DEVICES, PACKAGING OF
PH-BPS
- PNS IEC 62830-2:2021 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
GSO
- GSO IEC 62830-2:2021 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
- BH GSO IEC 62830-2:2022 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
- GSO IEC 60747-15:2014 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- GSO IEC 60747-14-5:2015 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
- GSO IEC 60747-5-4:2014 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- OS GSO IEC 60747-5-4:2014 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- BH GSO IEC 60747-5-4:2016 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- OS GSO IEC 60748-11:2014 Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
- GSO IEC 60748-11:2014 Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
- GSO IEC 60747-14-2:2014 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
- GSO IEC 60748-5:2015 Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits
- BH GSO IEC 60747-14-2:2016 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
- BH GSO IEC 60748-11-1:2016 Semiconductor devices - Integrated circuits - Part 11-1: Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
- GSO IEC 60748-11-1:2014 Semiconductor devices - Integrated circuits - Part 11-1: Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
- BH GSO IEC 60747-14-4:2016 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
- OS GSO IEC 60747-14-4:2014 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
- OS GSO IEC 60747-14-3:2014 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
CZ-CSN
- CSN 35 1609-1983 Power semiconductor devices. Heat sinks. Testing methodo
- CSN 35 1608-1983 Power semiconductor devices. Heat sinks. General technical requirements
- CSN 35 8701-1975 Terminology of semiconductors and semiconductor devices
- CSN 35 8785-1975 Semiconductor devices. Varicaps. Measurement of thermal capacitance coefflcient.
- CSN 35 1606-1983 Power semiconductor devices. Heat sinks. Terms. Definitions. Letter symbols.
- CSN 35 8773-1977 Meaaurement of semiconductor devices. Thyristors. Meaaurement of blocking current and reverse blocking current.
- CSN 35 8701 Z1-1997 Semiconductor naming
- CSN 35 8850 Cast.1-1984 Semiconductor radiators. Main parameters of measuring methods
- CSN 35 8740-1973 Semiconduotor deviees. Transistore. Measurement of saturation voltage
- CSN 35 8732-1964 Semiconductor diodes. Measurement of forward current
- CSN 35 8742-1973 Semiconductor devices. Transistors. Measurement of cut-oíf currents
- CSN 35 8736-1964 Semiconductor diodes. Measurement of interelectrode capacitanoe
- CSN 35 1531-1973 Silicon semiconductor rectifiers
- CSN 35 8720 Cast.1-1987 Semiconductor devices. Dimensions
- CSN 35 1603-1983 Power semiconductor devices. General methodes of measurements
- CSN 35 8762-1973 Semiconductor devices. Phototransistors photodiodes. Measurement of dark current
CU-NC
- NC 66-13-1984 Electronics. Thermal Dissipators for Semiconductors Quality Specifications
AIA/NAS - Aerospace Industries Association of America Inc.
- NAS4121-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Formed
- NAS4122-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Extruded
- NAS4119-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Press-On Type
- NAS4124-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Dual Link
- NAS4118-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Retainer Clip Type
- NAS4120-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Encapsulating Type@ TO-5
- NAS4119-2011 HEAT SINK@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ PRESS-ON TYPE (Rev 1)
- NAS4121-2012 HEAT SINK@ ELECTRICAL@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ FORMED (Rev 1)
- NAS4122-2013 HEAT SINK@ ELECTRICAL-ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ EXTRUDED (REV 1)
- NAS4124-2012 HEAT SINK@ ELECTRICAL/ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ DUAL LINK (Rev 1)
- NAS4123-1995 Heat Sink@ Electrical-Electronic Component@ Semiconductor Devices@ for Dual Inline Packages (DIP)
- NAS4118-2012 HEAT SINK@ ELECTRICAL@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ RETAINER CLIP TYPE (Rev 1)
- NAS4120-2012 HEAT SINK@ ELECTRICAL@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ ENCAPSULATING TYPE@ TO-5 (Rev 1)
Aerospace Industries Association
- AIA NAS 4122-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Extruded
- AIA NAS 4119-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Press-On Type
- AIA NAS 4124-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Dual Link
- AIA NAS 4121-1996 Heat Sink, Electrical-Electronic Component, Semiconductor Devices, Formed FSC 5999
- AIA NAS 4118-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Retainer Clip Type
- AIA NAS 4120-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Encapsulating Type, TO-5
- AIA NAS 4123-1995 Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (DIP)
International Electrotechnical Commission (IEC)
- IEC 62830-2:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
- IEC TR 63378-1:2021 Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
- IEC 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
- IEC 60747-15:2003 Discrete semiconductor devices - Part 15: Isolated power semiconductor devices
- IEC 60747-5-4:2022 Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- IEC 60747-15:2010 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- IEC 60747-14-5:2010 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
- IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- IEC 62951-4:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
- IEC 60748-11:1990 Semiconductor devices; integrated circuits; part 11: sectional specification for semiconductor integrated circuits excluding hybrid circuits
- IEC 62830-5:2021 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 5: Test method for measuring generated power from flexible thermoelectric devices
- IEC 62951-5:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials
- IEC 60747-14-2:2000 Semiconductor devices - Part 14-2: Semiconductor sensors; Hall elements
- IEC 62951-6:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films
- IEC 60748-5:1997 Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits
- IEC 60748-11:1990/AMD2:1999 Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits; Amendment 2
- IEC 60747-14-4:2011 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
- IEC 62415:2010 Semiconductor devices - Constant current electromigration test
- IEC 60747-14-1:2000 Semiconductor devices - Part 14-1: Semiconductor sensors; General and classification
- IEC 60748-11-1:1992 Semiconductor devices; integrated circuits; part 11; section 1: internal visual examination for semiconductor integrated circuits excluding hybrid circuits
- IEC 60747-14-3:2001 Semiconductor devices - Part 14-3: Semiconductor sensors; Pressure sensors
- IEC 60748-11:1990/AMD1:1995 Amendment 1 - Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
- IEC 60747-14-3:2009 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
- IEC 63244-1:2021 Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications
- IEC 62779-4:2020 Semiconductor devices - Semiconductor interface for human body communication - Part 4: Capsule endoscope
- IEC 62969-1:2017 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
Aerospace Industries Association/ANSI Aerospace Standards
- AIA/NAS NAS 4124-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Dual Link
- AIA/NAS NAS 4122-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Extruded
- AIA/NAS NAS 4119-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Press-On Type
- AIA/NAS NAS4120-2012 HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, ENCAPSULATING TYPE, TO-5
- AIA/NAS NAS4121-2012 HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FORMED (Rev 1)
- AIA/NAS NAS 4120-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Encapsulating Type, TO-5
- AIA/NAS NAS 4118-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Retainer Clip Type
- AIA/NAS NAS 4123-1995 Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (DIP)
- AIA/NAS NAS4118-2012 HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, RETAINER CLIP TYPE (Rev 1)
- AIA/NAS NAS4123-2012 HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP)
- AIA/NAS NAS 4121-1996 Heat Sink, Electrical-Electronic Component, Semiconductor Devices, Formed FSC 5999
HU-MSZT
- MSZ 9200/18-1980 Electronic signals. semiconductor
(U.S.) Joint Electron Device Engineering Council Soild State Technology Association
- JEDEC JESD51-1-1995 Integrated Circuit Thermal Measurement Method - Electrical Test Method (Single Semiconductor Device)
- JEDEC JESD51-1995 Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device)
- JEDEC JEB5-A-1970 Methods of Measurement for Semiconductor Logic Gating Microcircuits
RU-GOST R
- GOST 19656.15-1984 Semiconductor UHF diodes. Measurement methods of thermal resistance and pulse thermal resistance
- GOST R 50471-1993 Semiconductor photoemitters. Measuring method for halfintensity angle
- GOST 26284-1984 Semiconductor power converters. Conventional designations
- GOST 4.137-1985 Product-quality index system. Power semiconductor devices. Nomenclature of indices
- GOST 26567-1985 Semiconductor energy converters. Test methods
- GOST 18986.10-1974 Semiconductor diodes. Methods for measuring inductance
- GOST 12.2.007.11-1975 Occupation safety standards system. Semiconductor converters of electric energy. Safety requirements
- GOST R IEC 60748-11-1-2001 Semiconductor devices integrated circuits. Part 11. Section 1. Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
- GOST 18986.4-1973 Semiconductor diodes. Methods for measuring capacitance
- GOST 20859.1-1989 Power semiconductor devices. General technical requirements
- GOST 23414-1984 Semiconductor power converters. Terms and definitions
- GOST 30617-1998 Power semiconductor modules. General specifications
Underwriters Laboratories (UL)
- UL 1557-2011 Electrically isolated semiconductor devices
- UL 1557-1993 Electrically isolated semiconductor devices
- UL 1557-2006 UL Standard for Safety Electrically Isolated Semiconductor Devices Fourth Edition; Reprint with Revisions through and Including 6/26/2006
- UL 1557-1997 Electrically isolated semiconductor devices
Association Francaise de Normalisation
- NF C96-015:2005 Discrete semiconductor devices - Part 15: isolated power semiconductor devices
- NF EN 62416:2010 Semiconductor Devices – Hot Carrier Testing on MOS Transistors
- NF C80-202*NF EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
- NF C96-015*NF EN 60747-15:2013 Semiconductor devices - Discrete devices - Part 15 : isolated power semiconductor devices
- NF C96-045:1992 Semiconductors devices. Integrated circuits. Part 11 : sectional specification for semiconducteur integrated circuits excluding hybrid circuits
- NF C86-010:1986 Semiconductor devices. Harmonized system of quality assessment for electronic components. Discrete semiconductor devices. Generic specification.
- NF C80-201*NF EN 62415:2010 Semiconductor devices - Constant current electromigration test.
- NF EN 62415:2010 Dispositifs à semiconducteurs - Essai d'électromigration en courant constant
- NF EN IEC 63287-1:2021 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Integrated circuit reliability qualification guidelines
- NF C96-779-1*NF EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1 : general requirements
- NF C86-503:1986 Semiconductor devices. Harmonized system of quality assessment for electronic components. Phototransistors, photodarlington transistors and phototrasistor-arrays. Blank detail specification CECC 20 003.
- NF EN IEC 63244-1:2021 Semiconductor devices - Semiconductor devices for power transfer and wireless charging - Part 1: general requirements and specifications
- NF C63-244-1*NF EN IEC 63244-1:2021 Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1 : general requirements and specifications
- NF EN 62258-6:2006 Semiconductor die products - Part 6: requirements for thermal simulation information
- NF EN IEC 62969-3:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Harvesting piezoelectric shock energy for automotive sensors
PL-PKN
- PN T01305-1992 Semiconductor devices. Integrated circuits. Sectional specificatiion for semiconductor integrated circuits excluding hybrid circuits
European Committee for Electrotechnical Standardization(CENELEC)
- EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
- EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
- EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
- EN IEC 63244-1:2021 Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications
IECQ - IEC: Quality Assessment System for Electronic Components
- PQC 82-1989 Semiconductors for Use in Electronic Equipment: Sectional Specification: Semiconductor Integrated Circuits Excluding Hybrid Circuits
SE-SIS
- SIS SS-IEC 748:1991 Semiconductor devices — Integrated circuits
- SIS SEN 01 26 51-1969 Symbols for electrical diagrams Semi-conductors
- SIS SEN 01 03 51-1976 Semiconductor devices Terminology
- SIS SEN 01 03 51-1966 Semiconductor devices Terminology
ES-UNE
- UNE-EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors (Endorsed by AENOR in September of 2010.)
- UNE-EN 62415:2010 Semiconductor devices - Constant current electromigration test (Endorsed by AENOR in September of 2010.)
Danish Standards Foundation
- DS/EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
- DS/IEC 748-11/A1,2:2001 Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
- DS/EN 62415:2010 Semiconductor devices - Constant current electromigration test
- DS/EN IEC 63244-1:2021 Semiconductor devices – Semiconductor devices for wireless power transfer and charging – Part 1: General requirements and specifications
German Institute for Standardization
- DIN EN 62416:2010-12 Semiconductor devices - Hot carrier test on MOS transistors (IEC 62416:2010); German version EN 62416:2010
- DIN IEC 60747-11:1992 Semiconductor devices; sectional specification for semiconductor devices; identical with IEC 60747-11:1985
- DIN 50448:1998 Testing of materials for semiconductor technology - Contactless determination of the electrical resistivity of semi-insulating semi-conductor slices using a capacitive probe
- DIN EN 62415:2010-12 Semiconductor devices - Constant current electromigration test (IEC 62415:2010); German version EN 62415:2010
- DIN 50447:1995 Testing of materials for semiconductor technology - Contactless determination of the electrical sheet resistance of semiconductor layers with the eddy-current method
- DIN 50445:1992 Testing of materials for semiconductor technology; contactless determination of the electrical resistivity of semiconductor slices with the eddy current method; homogeneously doped semiconductor wafers
CENELEC - European Committee for Electrotechnical Standardization
- EN 60747-15:2004 Discrete semiconductor devices Part 15: Isolated power semiconductor devices
- EN 62415:2010 Semiconductor devices - Constant current electromigration test
Korean Agency for Technology and Standards (KATS)
- KS C IEC 60050-521-2002(2022) Semiconductor devices and integrated circuits
- KS C IEC 60050-521-2002(2017) Semiconductor devices and integrated circuits
- KS C IEC 60050-521-2022 Semiconductor devices and integrated circuits
- KS C IEC 60748-11:2004 Semiconductor devices-Integrated circuits-Part 11:Sectional specification for semiconductor integrated circuits excluding hybrid circuits
- KS C 2607-1980 TESTING METHODS OF SEMICONDUCTOR
- KS C 2607-1974(2000) TESTING METHODS OF SEMICONDUCTOR
- KS C IEC 60748-11:2020 Semiconductor devices — Integrated circuits — Part 11:Sectional specification for semiconductor integrated circuits excluding hybrid circuits
- KS C IEC 60748-5:2019 Semiconductor devices — Integrated circuits —Part 5: Semicustom integrated circuits
- KS C IEC 60748-5:2021 Semiconductor devices — Integrated circuits —Part 5: Semicustom integrated circuits
- KS C IEC 60748-11-1-2020 Semiconductor devices-Integrated circuits-Part 11-1:Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
- KS C 2607-2002 TESTING METHODS OF SEMICONDUCTOR
- KS C IEC 60748-11-1:2004 Semiconductor devices-Integrated circuits-Part 11-1:Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
- KS C IEC 60748-5:2003 Semiconductor devices-Integrated circuits-Part 5:Semicustom integrated circuits
- KS R 5012-2003 MOUNTING DIMENSIONS OF SEMICONDUCTOR TYPE CHARGING ALTERNATORS FOR AUTOMOBILES
- KS C IEC 60747-14-1:2003 Semiconductor devices-Part 14-1:Semiconductor sensors-General and classification
- KS C IEC 60748-11-1-2004(2020) Semiconductor devices-Integrated circuits-Part 11-1:Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
ECIA - Electronic Components Industry Association
- EIA CB-5:1969 Recommended Test Procedure for Semiconductor Thermal Dissipating Devices
NEMA - National Electrical Manufacturers Association
- NEMA CB-4:1989 Semiconductor Graphite
- NEMA RI 6-1959 ELECTROCHEMICAL PROCESSING SEMICONDUCTOR RECTIFIER EQUIPMENT
JP-JEITA
- JEITA ED7500A-2-2006 Standard for the dimensions of semiconductor devices (Discrete semiconductor devices)
RO-ASRO
- STAS 11418-1980 Semiconductor devices UNIJUNCTION TRANSISTORS Terminology
- STAS 12123/1-1982 Semiconductor devices RECTIFIER DIODES Measuring methods for electrical and thermal characteristics
- STAS 11381/13-1981 Graphical symbols for electrical diagrams SEMICONDUCTOR DEVICES
- STAS 6693/2-1975 Semiconductor devices TRANSISTORS Methods for measuring electrical properties
National Fire Protection Association (NFPA)
- NFPA FPH SECTION 6-30-2003 Semiconductor Manufacturing
YU-JUS
- JUS N.R1.322-1979 Terms and definitions for semiconductor ?evices. Thyristors
- JUS N.R1.500-1980 Semioonductor ?evices. Acceptance. Electrical tests
Electronic Components, Assemblies and Materials Association
- ECA CB 5-1969 Recommended Test Procedure for Semiconductor Thermal Dissipating Devices
BELST
- STB 2365-2014 Cooling radiators of semiconductor devices. Methods of calculation
- STB 2340-2013 Cooling radiators of semiconductor devices. General specifications
American Society for Testing and Materials (ASTM)
- ASTM D6095-99 Standard Test Method for Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
- ASTM D6095-05 Standard Test Method for Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
- ASTM D3004-02 Standard Specification for Extruded Crosslinked and Thermoplastic Semi-Conducting, Conductor and Insulation Shielding Materials
- ASTM D3004-08(2020) Standard Specification for Crosslinked and Thermoplastic Extruded Semi-Conducting, Conductor, and Insulation Shielding Materials
- ASTM D3004-97 Standard Specification for Extruded Crosslinked and Thermoplastic Semi-Conducting, Conductor and Insulation Shielding Materials
- ASTM D6095-12 Standard Test Method for Longitudinal Measurement of Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
- ASTM D6095-12(2023) Standard Test Method for Longitudinal Measurement of Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
Lithuanian Standards Office
- LST EN 62416-2010 Semiconductor devices - Hot carrier test on MOS transistors (IEC 62416:2010)
IEEE - The Institute of Electrical and Electronics Engineers@ Inc.
- IEEE 256-1963 SEMICONDUCTOR DIODES
- IEEE 59-1962 SEMICONDUCTOR RECTIFIER COMPONENTS
ZA-SANS
- SANS 60146-6:1992 Semiconductor convertors Part 6: Application guide for the protection of semiconductor convertors against overcurrent by fuses
KR-KS
- KS C IEC 60748-5-2021 Semiconductor devices — Integrated circuits —Part 5: Semicustom integrated circuits
- KS C IEC 60748-11-2020 Semiconductor devices — Integrated circuits — Part 11:Sectional specification for semiconductor integrated circuits excluding hybrid circuits
- KS C IEC 60748-5-2019 Semiconductor devices — Integrated circuits —Part 5: Semicustom integrated circuits
FI-SFS
- SFS 5327-1987 Glossary of electronic technology. Semiconductor components and overall circuits
GOST
- GOST R 71070-2023 Electronic semiconductor devices. Terms and definitions
American National Standards Institute (ANSI)
- ANSI/ASTM D6095:2012 Test Method for Longitudinal Measurement of Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
- ANSI/UL 1557-2013 Standard for Safety for Electrically Isolated Semiconductor Devices
IN-BIS
- IS 1885 Pt.7-1965 Electrical Vocabulary Part Ⅶ Semiconductor Devices
US-Unspecified Preparing Activity
- DI-QCIC-80924 A-2006 SEMICONDUCTOR PROCESS SPECIFICATION
BE-NBN
- NBN C 95-001-1977 Semiconductor equipment. the term
IEC - International Electrotechnical Commission
- IEC 60146-2:1974 Semiconductor Convertors Part 2: Semiconductor Self-Commutated Convertors (Edition 1.0)
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