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Database: 365,228(8 Aug 2026)

thermoelectric semiconductor

thermoelectric semiconductor, Total:434 items.

The international standard classification for "thermoelectric semiconductor" includes: Semiconductor devices in general , Plug-and-socket devices. Connectors , Measurement of force, weight and pressure , Other electromechanical components , Electromechanical components in general , Semiconductor devices , Electrical engineering (Vocabularies) , Mechanical structures for electronic equipment , Plastics and rubber insulating materials , Integrated circuits. Microelectronics , Testing of metals , Testing of metals in general , Rectifiers. Convertors. Stabilized power supply , Mechanical testing of metals , Electronic components in general , Semiconducting materials , Other electrical accessories , Optoelectronics. Laser equipment , Aerospace electric equipment and systems .

The Chinese standard classification for "thermoelectric semiconductor" includes: Power semiconductor device and parts , Transformer , Industrial automation and control device in general , Basic standards and general methods , Electrical insulating material and its products , Connector , Microcircuit in general , Metal physical property test method , Semiconductor integrated circuit , Metal nondestructive testing method , Semiconductor discrete devices in general , Semimetal and semiconductor material in general , Basic standards and general methods , Optoelectronic device assembly , Technical management , Technical management , Laser device , Electronic components .


Professional Standard - Machinery

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

  • GB/T 42835-2023 Semiconductor integrated circuits—System on chip(SoC)
  • GB/T 7092-1993 Outline dimensions of semiconductor integrated circuits
  • GB/T 15872-1995 Power supply interface for semiconductor equipment
  • GB/T 8446.1-1987 Heat sink for power semiconductor device
  • GB/T 13422-2013 Semiconductor converters—Electrical test methods
  • GB/T 42836-2023 Microwave semiconductor integrated circuits—Frequency mixer
  • GB 15651.4-2017 Semiconductor devices Discrete devices Part 5-4: Optoelectronic devices Semiconductor lasers
  • GB/T 8446.2-2004 Heat sink for power semiconductor device - Part 2: Measuring method of thermal resistance and imput fluid-output fluid pressure difference
  • GB/T 42736-2023 Heat-shinkable semiconductive polyolefin sleeving
  • GB/T 19403.1-2003 Semiconductor devices—Integrated Circuits—Part 11:Section 1:Internal visual examination for semiconductor integrated circuits (excluding hybrid circuits)
  • GB/T 13422-1992 Power semiconductor converters-Electrical test methods
  • GB/T 8446.1-2004 Heat sink for power semiconductor device—Part 1:Casting kind series
  • GB/T 12750-2006 Semiconductor devices―Integrated circuits―Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
  • GB/T 7423.3-1987 Heat sink of semiconductor devices--Heat sink, staggered fingers shapes
  • GB/T 14264-2024 Terminology of semiconductor materials
  • GB/T 14264-2009 Semiconductor materials - Terms and definitions
  • GB/T 42838-2023 Semiconductor integrated circuits—Measuring method of Holzer circuit
  • GB/T 3430-1989 The rule of type designation for semiconductor integrated circuits
  • GB/T 42837-2023 Microwave semiconductor integrated circuits—Amplifier
  • GB/T 17950-2000 Semiconductor converter - Part 6: Application guide for the protection of semiconductor converters against overcurrent by fuses
  • GB/T 2900.32-1994 Electrotechnical terminology - Power semiconductor device
  • GB/T 20521-2006 Semconductor devices Part 14-1: Semiconductor sensors - General and classification
  • GB/T 1550-1997 methods for measuring conductivity type of extrinsic semiconducting materials
  • GB/T 6616-2023 Test method for resistivity of semiconductor wafers and sheet resistance of semiconductor films—Noncontact eddy-current gauge
  • GB/T 20522-2006 Semiconductor devices Part 14-3: Semiconductor sensors - Pressure sensors
  • GB/T 8446.2-1987 Measuring method of thermal resistance and input fluid-output fluid pressure difference of heat sink for power semiconductor device
  • GB/T 7423.1-1987 Heat sink of semiconductor devices--Generic specification
  • GB/T 5839-1986 Rating systems for electronic tubes and semiconductor devise
  • GB/T 14862-1993 Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits
  • GB/T 2900.66-2004 Electrotechnical terminology - Semiconductor devices and integrated circuits
  • GB/T 15872-2013 Power supply interface for semiconductor equipment
  • GB 7423.3-1987 sink of semiconductor devices - Heat sink, staggered fingers shapes
  • GB/T 3859.2-1993 Semiconductor convertors Application guide
  • GB/T 7423.2-1987 Heat sink of semiconductor devices--Heat sink, Extruded shapes
  • GB/T 14113-1993 of packages for semiconductor integrated circuits
  • GB/T 3434-1986 Families and products of ECL circuits for semiconductor integrated circuits
  • GB/T 3859.3-1993 Semiconductor convertors—Transformers and reactors
  • GB 5839-1986 Rating systems for electronic tubes and semiconductor devise
  • GB/T 42974-2023 Semiconductor integrated circuits—Flash memory(FLASH)
  • GB/T 8446.3-1988 Insulators and fasteners for heat sink for power semiconductor device
  • GB 7423.1-1987 sink of semiconductor devices - Generic specification
  • GB/T 14264-1993 Semiconductor materials-Terms and definitions
  • GB/T 20515-2006 Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits
  • GB 12565-1990 Sectional Specification for Semiconductor Devices and Optoelectronic Devices
  • GB/T 8446.3-2004 Metallic materials - Wire - Wrapping test
  • GB 7423.2-1987 sink of semiconductor devices - Heat sink, Extruded shapes

国家市场监督管理总局、中国国家标准化管理委员会

  • GB/T 1550-2018 Test methods for conductivity type of extrinsic semiconducting materials
  • GB/T 37031-2018 Semiconductor lighting terminology
  • GB/T 8446.1-2022 Heat sinks for power semiconductor devices—Part 1: Radiators
  • GB/T 7092-2021 Outline dimensions of semiconductor integrated circuits
  • GB/T 8446.3-2022 Heat sinks for power semiconductor devices—Part 3: Insulators and fasteners
  • GB/T 8446.2-2022 Heat sinks for power semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop

Military Standard of the People's Republic of China-General Armament Department

  • GJB 597A-1996 General Specification for Semiconductor Integrated Circuits
  • GJB/Z 41.3-1993 Military semiconductor discrete device series spectrum semiconductor optoelectronic devices
  • GJB 8120-2013 General specification for semiconductor optoelectronic module
  • GJB 597B-2012 General specification for semiconductor integrated circuits
  • GJB 33/15-2011 Semiconductor optoelectronic device.Detail specification for type BT401 semiconductor infrared-emitting diode
  • GJB 1420B-2011 General specification for packages of semiconductor integrated circuits
  • GJB 8121-2013 General specification for semiconductor optoelectronic assembly
  • GJB 1420A-1999 General Specification for Semiconductor Integrated Circuit Enclosures
  • GJB 8119-2013 General specification for semiconductor optoelectronic device
  • GJB 33/17-2011 Semiconductor optoelectronic device.Detail specification for type GO11 semiconductor photocoupler
  • GJB 597/12A-1998 Detailed specifications for semiconductor integrated circuit HCMOS gate circuits
  • GJB 33/18-2011 Semiconductor optoelectronic device.Detail specification for type GO417 bidirectional analog switch semiconductor photocoupler
  • GJB 33/16-2011 Semiconductor optoelectronic device.Detail specification for type 3DU32 semiconductor phototransistor

机械电子工业部

  • JB 5781-1991 Technical conditions of profile radiators for power semiconductor devices
  • JB 5842-1991 Die positioning rings for power semiconductor devices
  • JB 5835-1991 Gate assembly for power semiconductor devices
  • JB 5843-1991 Connectors for power semiconductor devices

Guizhou Provincial Standard of the People's Republic of China

Professional Standard - Electron

  • SJ 1795-1981 Detail specification for 50-1000mA low current thyristors
  • SJ/T 11067-1996 Commonly used terms for semiconductor photoelectric materials and pyroelectric materials in infrared detecting materials
  • SJ 20788-2000 Measurment method for thermal impedance of semiconductor diodes
  • SJ 2433-1984 Bonding sheet for semiconductor tubes
  • SJ/T 11487-2015 Non-contact measurement method for the resistivity of semi-insulating semiconductor wafer
  • SJ/T 11395-2009 Semiconductor lighting terminology
  • SJ 20787-2000 Measurement method for thermal resistance of semiconductor bridge rectifieres
  • SJ/T 9534-1993 Grading standard of quality for semiconductor integrated circuits
  • SJ 20642-1997 Semiconductor opto-electronic module-General specification for
  • SJ/T 2215-2015 Measuring methods for semiconductor photocouplers
  • SJ 20786-2000 General specification for semiconductor opto-electronic assembly
  • SJ/T 11742-2019 Thermally conductive non-prepreg prepreg for printed circuit
  • SJ 50033/109-1996 Semiconductor optoelectronic devices - Detail specification for Types GJ903T and GJ9032T and GJ9034T semiconductor laser diodes
  • SJ 2247-1982 Outlines dimension for semiconductor optoelectronic devices
  • SJ/T 2214-2015 Measuring methods for semiconductor photodiode and phototransistor

国家机械工业局

  • JB 9644-1999 Reactor for semiconductor electric transmission

Taiwan Provincial Standard of the People's Republic of China

  • CNS 13802.5-1997 Graphical Symbols for Diagrams (Semiconductors and Electron Tubes)
  • CNS 13802-5-1997 Graphical Symbols for Diagrams (Semiconductors and Electron Tubes)
  • CNS 7011-1981 Numbering of Electrodes in Multiple Electrode Semiconductor Devices and Designation of Units in Multiple Unit Semiconductor Devices
  • CNS 11900-1987 Fixed Ceramic Capacitors for Electronic Equipment (Semiconductor)

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会

  • GB/T 15651.4-2017 Semiconductor devices-Discrete devices-Part 5-4:Optoelectronic devices-Semiconductor lasers
  • GB/T 35010.6-2018 Semiconductor die products—Part 6:Requirements for concerning thermal simulation

Professional Standard - Aerospace

机械工业部

Professional Standard - Ferrous Metallurgy

  • YB/T 6113-2023 Silicon carbide heat conductor for electric heating furnace

Guangdong Provincial Standard of the People's Republic of China

Group Standards of the People's Republic of China

工业和信息化部

Jiangxi Provincial Standard of the People's Republic of China

  • DB3603/T 4-2022 Technical specifications for the manufacture of semiconducting glazes for electric porcelain

GOSTR

  • GOST 18577-1980 Thermoelectric semiconductor devices. Terms and definitions

SCC

  • BS PD IEC TR 63378-1:2021 Thermal standardization on semiconductor packages-Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
  • DANSK DS/EN 62830-2:2017 Semiconductor devices – Semiconductor devices for energy harvesting and generation – Part 2: Thermo power based thermoelectric energy harvesting
  • BS IEC 60747-14-3:2001 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-Pressure sensors
  • DIN EN 62830-2 E:2014 Draft Document - Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting (IEC 47/2190/CD:2014)
  • BS IEC 60747-14-1:2000 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-General and classification-Sensor generals and classification for semiconductor sensors
  • CEI EN 62416:2011 Semiconductor devices - Hot carrier test on MOS transistors
  • AS 1955.2:1978 Semiconductor convertors - Semiconductor self-commutated convertors
  • DANSK DS/EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
  • BS 3839:1965 Oxygen free high conductivity copper for electronic tubes and semiconductor devices
  • BS PD ES 59008-4-3:2000 Data requirements for semiconductor die. Specific requirements and recommendations-Thermal
  • CEI 3-17:2005 Segni grafici per schemi - Semiconduttori e tubi elettronici
  • IEC 60146:1973 Semiconductor convertors
  • DANSK DS/EN IEC 63244-1:2021 Semiconductor devices – Semiconductor devices for wireless power transfer and charging – Part 1: General requirements and specifications
  • CEI EN IEC 63244-1:2022 Semiconductor devices - Semiconductor devices for wireless power transfer and charging Part 1: General requirements and specifications
  • BS 3363:1961 Schedule of letter symbols for light-current semiconductor devices
  • CEI EN 62415:2011 Semiconductor devices - Constant current electromigration test
  • DIN IEC 60747-14-5 E:2008 Draft Document - Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor (IEC 47E/353/CD:2007)
  • DIN IEC 60747-10:1987 Semiconductor devices; generic specification for semiconductor devices and integrated circuits; identical with IEC 60747-10, edition 1984
  • DANSK DS/EN 62415:2010 Semiconductor devices - Constant current electromigration test
  • 12/30258683 DC BS EN 62779-1. Semiconductor devices. Semiconductor interface for human body communication. General requirements
  • MIL MIL-H-87111/5B-1986 HEAT SINKS, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, CLASS I (FORMED) (S/S BY MIL-H-87111/5C)
  • CEI EN IEC 63287-1:2022 Semiconductor devices - Generic semiconductor qualification guidelines Part 1: Guidelines for IC reliability qualification
  • CEI EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication Part 1: General requirements
  • BS PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices
  • 07/30164953 DC IEC 60747-14-5. Semiconductor devices. Discrete devices. Part 14-5. Semiconductor sensors. PN-junction semiconductor temperature sensor
  • DANSK DS/EN IEC 63287-1:2021 Semiconductor devices – Generic semiconductor qualification guidelines – Part 1: Guidelines for IC reliability qualification
  • 12/30261676 DC BS EN 62779-2. Semiconductor devices. Semiconductor interface for human body communication. Characterization of interfacing performances
  • AS 1102.5:1972 Graphical symbols for electrotechnology - Semiconductor devices
  • MIL MIL-DTL-19491J-2014 Semiconductor Devices, Packaging of
  • BS IEC 60747-1:2006 Semiconductor devices. General
  • CEI EN 62258-1:2011 Semiconductor devices - Semiconductor die products Part 1: Procurement and use
  • AENOR UNE 21017:1959 BARE, SEMI-RIGID COPPER CABLES FOR ELECTRICAL CONDUCTORS
  • AS C379.1:1970 Mechanical standardization of semiconductor devices - Preparation of drawings of semiconductor devices
  • DANSK DS/EN IEC 62969-1:2018 Semiconductor devices – Semiconductor interface for automotive vehicles – Part 1: General requirements of power interface for automotive vehicle sensors

British Standards Institution (BSI)

  • PD IEC TR 63378-1:2021 Thermal standardization on semiconductor packages. Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
  • BS IEC 62830-2:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation. - Part 2: Thermo power based thermoelectric energy harvesting
  • BS IEC 60747-5-4:2022 Semiconductor devices - Optoelectronic devices. Semiconductor lasers
  • BS EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
  • BS IEC 60747-14-2:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
  • BS IEC 60747-14-2:2000 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
  • BS IEC 60747-6:2000 Discrete semiconductor devices and integrated circuits - Thyristors
  • BS IEC 60747-6:2001 Discrete semiconductor devices and integrated circuits - Thyristors
  • BS IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Optoelectronic devices - Semiconductor lasers
  • BS IEC 60747-14-1:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - General and classification - Sensor generals and classification for semiconductor sensors
  • BS IEC 60747-14-5:2010 Semiconductor devices - Semiconductor sensors - PN-junction semiconductor temperature sensor
  • BS IEC 62830-5:2021 Semiconductor devices. Semiconductor devices for energy harvesting and generation. Test method for measuring generated power from flexible thermoelectric devices
  • 22/30443234 DC BS EN 63378-3. Thermal standardization on semiconductor packages - Part 3. Thermal circuit simulation models of semiconductor packages for transient analysis
  • BS IEC 62951-5:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for thermal characteristics of flexible materials
  • BS IEC 60748-11:1991 Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits
  • BS IEC 60748-11:2000 Semiconductor devices - Integrated circuits - Sectional specification for semiconductor integrated circuits excluding hybrid circuits
  • BS IEC 62951-4:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
  • 23/30469010 DC BS EN IEC 63378-3. Thermal standardization on semiconductor packages - Part 3. Thermal circuit simulation models of discrete semiconductor packages for transient analysis
  • BS IEC 60747-14-4:2011 Semiconductor devices. Discrete devices. Semiconductor accelerometers
  • BS IEC 60747-14-3:2009 Semiconductor devices - Semiconductor sensors - Pressure sensors
  • BS IEC 62951-6:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for sheet resistance of flexible conducting films
  • BS EN 60747-15:2004 Discrete semiconductor devices. Isolated power semiconductor devices
  • BS EN 62779-1:2016 Semiconductor devices. Semiconductor interface for human body communication. General requirements
  • BS EN IEC 62969-1:2018 Semiconductor devices. Semiconductor interface for automotive vehicles. General requirements of power interface for automotive vehicle sensors
  • BS IEC 62899-203:2024 Printed electronics - Materials. Semiconductor ink
  • BS IEC 60747-8-4:2004 Discrete semiconductor devices - Metal-oxide semiconductor field-effect transistors (MOSFETs) for power switching applications
  • 18/30355426 DC BS EN 62830-5. Semiconductor devices. Semiconductor devices for energy harvesting and generation. Part 5. Test method for measuring generated power from flexible thermoelectric devices
  • 19/30404095 DC BS EN IEC 60747-5-4. Semiconductor devices. Part 5-4. Optoelectronic devices. Semiconductor lasers
  • BS 6493-2.1:1985 Semiconductor devices - Integrated circuits - General
  • BS IEC 60748-1:2002 Semiconductor devices - Integrated circuits - General
  • BS EN IEC 63244-1:2021 Semiconductor devices. Semiconductor devices for wireless power transfer and charging. General requirements and specifications
  • BS EN 60747-15:2012 Semiconductor devices. Discrete devices. Isolated power semiconductor devices
  • BS QC 790101:1992 Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits. Internal visual examination for semiconductor integr...
  • BS IEC 62830-7:2021 Semiconductor devices. Semiconductor devices for energy harvesting and generation. Linear sliding mode triboelectric energy harvesting
  • BS IEC 60747-14-1:2010 Semiconductor devices - Semiconductor sensors - Generic specification for sensors
  • 23/30473272 DC BS IEC 60747-5-4 AMD 1. Semiconductor devices - Part 5-4. Optoelectronic devices. Semiconductor lasers
  • BS IEC 62779-4:2020 Semiconductor devices. Semiconductor interface for human body communication - Capsule endoscope
  • BS IEC 62951-1:2017 Semiconductor devices. Flexible and stretchable semiconductor devices - Bending test method for conductive thin films on flexible substrates
  • 23/30469486 DC BS EN IEC 63378-2. Thermal standardization on semiconductor packages - Part 2. 3D thermal simulation models of discrete semiconductor packages for steady-state analysis
  • BS EN 62415:2010 Semiconductor devices - Constant current electromigration test
  • BS EN IEC 60747-5-5:2020 Semiconductor devices. Optoelectronic devices. Photocouplers
  • BS 3839:1978 Specification for oxygen-free high-conductivity copper for electronic tubes and semiconductor devices
  • 13/30264600 DC BS EN 60747-14-8. Semiconductor devices. Part 14-8. Semiconductor sensors. Capacitive degradation sensor of liquid
  • BS EN 62779-2:2016 Semiconductor devices. Semiconductor interface for human body communication. Characterization of interfacing performances
  • BS IEC 60748-2:1998 Semiconductor devices. Integrated circuits. Digital integrated circuits
  • BS EN 62258-6:2006 Semiconductor die products - Requirements for information concerning thermal simulation
  • PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices
  • BS IEC 60748-5:1997 Semiconductor devices - Integrated circuits - Semicustom integrated circuits
  • BS IEC 62899-203:2018 Printed electronics. Materials. Semiconductor ink
  • BS IEC 60748-2:1997 Semiconductor devices - Integrated circuits - Digital integrated circuits
  • BS EN 60747-16-4:2004+A2:2017 Semiconductor devices - Microwave integrated circuits. Switches
  • BS IEC 60747-1:2006+A1:2010 Semiconductor devices - General
  • BS IEC 60748-4:1997 Semiconductor devices. Integrated circuits. Interface integrated circuits
  • BS EN 62047-19:2013 Semiconductor devices. Micro-electromechanical devices. Electronic compasses
  • BS IEC 62951-9:2022 Semiconductor devices. Flexible and stretchable semiconductor devices - Performance testing methods of one transistor and one resistor (1T1R) resistive memory cells
  • 18/30363340 DC BS IEC 62779-4. Semiconductor devices. Semiconductor interface for human body communication. Part 4. Semiconductor interface for capsule endoscopy using human body communication

Defense Logistics Agency

PH-BPS

  • PNS IEC 62830-2:2021 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting

GSO

  • GSO IEC 62830-2:2021 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
  • BH GSO IEC 62830-2:2022 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
  • GSO IEC 60747-15:2014 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
  • GSO IEC 60747-14-5:2015 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
  • GSO IEC 60747-5-4:2014 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
  • OS GSO IEC 60747-5-4:2014 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
  • BH GSO IEC 60747-5-4:2016 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
  • OS GSO IEC 60748-11:2014 Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
  • GSO IEC 60748-11:2014 Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
  • GSO IEC 60747-14-2:2014 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
  • GSO IEC 60748-5:2015 Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits
  • BH GSO IEC 60747-14-2:2016 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
  • BH GSO IEC 60748-11-1:2016 Semiconductor devices - Integrated circuits - Part 11-1: Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
  • GSO IEC 60748-11-1:2014 Semiconductor devices - Integrated circuits - Part 11-1: Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
  • BH GSO IEC 60747-14-4:2016 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
  • OS GSO IEC 60747-14-4:2014 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
  • OS GSO IEC 60747-14-3:2014 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors

CZ-CSN

CU-NC

  • NC 66-13-1984 Electronics. Thermal Dissipators for Semiconductors Quality Specifications

AIA/NAS - Aerospace Industries Association of America Inc.

  • NAS4121-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Formed
  • NAS4122-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Extruded
  • NAS4119-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Press-On Type
  • NAS4124-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Dual Link
  • NAS4118-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Retainer Clip Type
  • NAS4120-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Encapsulating Type@ TO-5
  • NAS4119-2011 HEAT SINK@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ PRESS-ON TYPE (Rev 1)
  • NAS4121-2012 HEAT SINK@ ELECTRICAL@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ FORMED (Rev 1)
  • NAS4122-2013 HEAT SINK@ ELECTRICAL-ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ EXTRUDED (REV 1)
  • NAS4124-2012 HEAT SINK@ ELECTRICAL/ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ DUAL LINK (Rev 1)
  • NAS4123-1995 Heat Sink@ Electrical-Electronic Component@ Semiconductor Devices@ for Dual Inline Packages (DIP)
  • NAS4118-2012 HEAT SINK@ ELECTRICAL@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ RETAINER CLIP TYPE (Rev 1)
  • NAS4120-2012 HEAT SINK@ ELECTRICAL@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ ENCAPSULATING TYPE@ TO-5 (Rev 1)

Aerospace Industries Association

  • AIA NAS 4122-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Extruded
  • AIA NAS 4119-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Press-On Type
  • AIA NAS 4124-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Dual Link
  • AIA NAS 4121-1996 Heat Sink, Electrical-Electronic Component, Semiconductor Devices, Formed FSC 5999
  • AIA NAS 4118-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Retainer Clip Type
  • AIA NAS 4120-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Encapsulating Type, TO-5
  • AIA NAS 4123-1995 Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (DIP)

International Electrotechnical Commission (IEC)

  • IEC 62830-2:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
  • IEC TR 63378-1:2021 Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
  • IEC 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
  • IEC 60747-15:2003 Discrete semiconductor devices - Part 15: Isolated power semiconductor devices
  • IEC 60747-5-4:2022 Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
  • IEC 60747-15:2010 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
  • IEC 60747-14-5:2010 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
  • IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
  • IEC 62951-4:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
  • IEC 60748-11:1990 Semiconductor devices; integrated circuits; part 11: sectional specification for semiconductor integrated circuits excluding hybrid circuits
  • IEC 62830-5:2021 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 5: Test method for measuring generated power from flexible thermoelectric devices
  • IEC 62951-5:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials
  • IEC 60747-14-2:2000 Semiconductor devices - Part 14-2: Semiconductor sensors; Hall elements
  • IEC 62951-6:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films
  • IEC 60748-5:1997 Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits
  • IEC 60748-11:1990/AMD2:1999 Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits; Amendment 2
  • IEC 60747-14-4:2011 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
  • IEC 62415:2010 Semiconductor devices - Constant current electromigration test
  • IEC 60747-14-1:2000 Semiconductor devices - Part 14-1: Semiconductor sensors; General and classification
  • IEC 60748-11-1:1992 Semiconductor devices; integrated circuits; part 11; section 1: internal visual examination for semiconductor integrated circuits excluding hybrid circuits
  • IEC 60747-14-3:2001 Semiconductor devices - Part 14-3: Semiconductor sensors; Pressure sensors
  • IEC 60748-11:1990/AMD1:1995 Amendment 1 - Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
  • IEC 60747-14-3:2009 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
  • IEC 63244-1:2021 Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications
  • IEC 62779-4:2020 Semiconductor devices - Semiconductor interface for human body communication - Part 4: Capsule endoscope
  • IEC 62969-1:2017 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors

Aerospace Industries Association/ANSI Aerospace Standards

  • AIA/NAS NAS 4124-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Dual Link
  • AIA/NAS NAS 4122-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Extruded
  • AIA/NAS NAS 4119-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Press-On Type
  • AIA/NAS NAS4120-2012 HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, ENCAPSULATING TYPE, TO-5
  • AIA/NAS NAS4121-2012 HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FORMED (Rev 1)
  • AIA/NAS NAS 4120-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Encapsulating Type, TO-5
  • AIA/NAS NAS 4118-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Retainer Clip Type
  • AIA/NAS NAS 4123-1995 Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (DIP)
  • AIA/NAS NAS4118-2012 HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, RETAINER CLIP TYPE (Rev 1)
  • AIA/NAS NAS4123-2012 HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP)
  • AIA/NAS NAS 4121-1996 Heat Sink, Electrical-Electronic Component, Semiconductor Devices, Formed FSC 5999

HU-MSZT

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

  • JEDEC JESD51-1-1995 Integrated Circuit Thermal Measurement Method - Electrical Test Method (Single Semiconductor Device)
  • JEDEC JESD51-1995 Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device)
  • JEDEC JEB5-A-1970 Methods of Measurement for Semiconductor Logic Gating Microcircuits

RU-GOST R

  • GOST 19656.15-1984 Semiconductor UHF diodes. Measurement methods of thermal resistance and pulse thermal resistance
  • GOST R 50471-1993 Semiconductor photoemitters. Measuring method for halfintensity angle
  • GOST 26284-1984 Semiconductor power converters. Conventional designations
  • GOST 4.137-1985 Product-quality index system. Power semiconductor devices. Nomenclature of indices
  • GOST 26567-1985 Semiconductor energy converters. Test methods
  • GOST 18986.10-1974 Semiconductor diodes. Methods for measuring inductance
  • GOST 12.2.007.11-1975 Occupation safety standards system. Semiconductor converters of electric energy. Safety requirements
  • GOST R IEC 60748-11-1-2001 Semiconductor devices integrated circuits. Part 11. Section 1. Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
  • GOST 18986.4-1973 Semiconductor diodes. Methods for measuring capacitance
  • GOST 20859.1-1989 Power semiconductor devices. General technical requirements
  • GOST 23414-1984 Semiconductor power converters. Terms and definitions
  • GOST 30617-1998 Power semiconductor modules. General specifications

Underwriters Laboratories (UL)

  • UL 1557-2011 Electrically isolated semiconductor devices
  • UL 1557-1993 Electrically isolated semiconductor devices
  • UL 1557-2006 UL Standard for Safety Electrically Isolated Semiconductor Devices Fourth Edition; Reprint with Revisions through and Including 6/26/2006
  • UL 1557-1997 Electrically isolated semiconductor devices

Association Francaise de Normalisation

  • NF C96-015:2005 Discrete semiconductor devices - Part 15: isolated power semiconductor devices
  • NF EN 62416:2010 Semiconductor Devices – Hot Carrier Testing on MOS Transistors
  • NF C80-202*NF EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
  • NF C96-015*NF EN 60747-15:2013 Semiconductor devices - Discrete devices - Part 15 : isolated power semiconductor devices
  • NF C96-045:1992 Semiconductors devices. Integrated circuits. Part 11 : sectional specification for semiconducteur integrated circuits excluding hybrid circuits
  • NF C86-010:1986 Semiconductor devices. Harmonized system of quality assessment for electronic components. Discrete semiconductor devices. Generic specification.
  • NF C80-201*NF EN 62415:2010 Semiconductor devices - Constant current electromigration test.
  • NF EN 62415:2010 Dispositifs à semiconducteurs - Essai d'électromigration en courant constant
  • NF EN IEC 63287-1:2021 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Integrated circuit reliability qualification guidelines
  • NF C96-779-1*NF EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1 : general requirements
  • NF C86-503:1986 Semiconductor devices. Harmonized system of quality assessment for electronic components. Phototransistors, photodarlington transistors and phototrasistor-arrays. Blank detail specification CECC 20 003.
  • NF EN IEC 63244-1:2021 Semiconductor devices - Semiconductor devices for power transfer and wireless charging - Part 1: general requirements and specifications
  • NF C63-244-1*NF EN IEC 63244-1:2021 Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1 : general requirements and specifications
  • NF EN 62258-6:2006 Semiconductor die products - Part 6: requirements for thermal simulation information
  • NF EN IEC 62969-3:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Harvesting piezoelectric shock energy for automotive sensors

PL-PKN

  • PN T01305-1992 Semiconductor devices. Integrated circuits. Sectional specificatiion for semiconductor integrated circuits excluding hybrid circuits

European Committee for Electrotechnical Standardization(CENELEC)

  • EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
  • EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
  • EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
  • EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
  • EN IEC 63244-1:2021 Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications

IECQ - IEC: Quality Assessment System for Electronic Components

  • PQC 82-1989 Semiconductors for Use in Electronic Equipment: Sectional Specification: Semiconductor Integrated Circuits Excluding Hybrid Circuits

SE-SIS

ES-UNE

  • UNE-EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors (Endorsed by AENOR in September of 2010.)
  • UNE-EN 62415:2010 Semiconductor devices - Constant current electromigration test (Endorsed by AENOR in September of 2010.)

Danish Standards Foundation

  • DS/EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
  • DS/IEC 748-11/A1,2:2001 Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
  • DS/EN 62415:2010 Semiconductor devices - Constant current electromigration test
  • DS/EN IEC 63244-1:2021 Semiconductor devices – Semiconductor devices for wireless power transfer and charging – Part 1: General requirements and specifications

German Institute for Standardization

  • DIN EN 62416:2010-12 Semiconductor devices - Hot carrier test on MOS transistors (IEC 62416:2010); German version EN 62416:2010
  • DIN IEC 60747-11:1992 Semiconductor devices; sectional specification for semiconductor devices; identical with IEC 60747-11:1985
  • DIN 50448:1998 Testing of materials for semiconductor technology - Contactless determination of the electrical resistivity of semi-insulating semi-conductor slices using a capacitive probe
  • DIN EN 62415:2010-12 Semiconductor devices - Constant current electromigration test (IEC 62415:2010); German version EN 62415:2010
  • DIN 50447:1995 Testing of materials for semiconductor technology - Contactless determination of the electrical sheet resistance of semiconductor layers with the eddy-current method
  • DIN 50445:1992 Testing of materials for semiconductor technology; contactless determination of the electrical resistivity of semiconductor slices with the eddy current method; homogeneously doped semiconductor wafers

CENELEC - European Committee for Electrotechnical Standardization

  • EN 60747-15:2004 Discrete semiconductor devices Part 15: Isolated power semiconductor devices
  • EN 62415:2010 Semiconductor devices - Constant current electromigration test

Korean Agency for Technology and Standards (KATS)

  • KS C IEC 60050-521-2002(2022) Semiconductor devices and integrated circuits
  • KS C IEC 60050-521-2002(2017) Semiconductor devices and integrated circuits
  • KS C IEC 60050-521-2022 Semiconductor devices and integrated circuits
  • KS C IEC 60748-11:2004 Semiconductor devices-Integrated circuits-Part 11:Sectional specification for semiconductor integrated circuits excluding hybrid circuits
  • KS C 2607-1980 TESTING METHODS OF SEMICONDUCTOR
  • KS C 2607-1974(2000) TESTING METHODS OF SEMICONDUCTOR
  • KS C IEC 60748-11:2020 Semiconductor devices — Integrated circuits — Part 11:Sectional specification for semiconductor integrated circuits excluding hybrid circuits
  • KS C IEC 60748-5:2019 Semiconductor devices — Integrated circuits —Part 5: Semicustom integrated circuits
  • KS C IEC 60748-5:2021 Semiconductor devices — Integrated circuits —Part 5: Semicustom integrated circuits
  • KS C IEC 60748-11-1-2020 Semiconductor devices-Integrated circuits-Part 11-1:Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
  • KS C 2607-2002 TESTING METHODS OF SEMICONDUCTOR
  • KS C IEC 60748-11-1:2004 Semiconductor devices-Integrated circuits-Part 11-1:Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
  • KS C IEC 60748-5:2003 Semiconductor devices-Integrated circuits-Part 5:Semicustom integrated circuits
  • KS R 5012-2003 MOUNTING DIMENSIONS OF SEMICONDUCTOR TYPE CHARGING ALTERNATORS FOR AUTOMOBILES
  • KS C IEC 60747-14-1:2003 Semiconductor devices-Part 14-1:Semiconductor sensors-General and classification
  • KS C IEC 60748-11-1-2004(2020) Semiconductor devices-Integrated circuits-Part 11-1:Internal visual examination for semiconductor integrated circuits excluding hybrid circuits

ECIA - Electronic Components Industry Association

  • EIA CB-5:1969 Recommended Test Procedure for Semiconductor Thermal Dissipating Devices

NEMA - National Electrical Manufacturers Association

JP-JEITA

  • JEITA ED7500A-2-2006 Standard for the dimensions of semiconductor devices (Discrete semiconductor devices)

RO-ASRO

  • STAS 11418-1980 Semiconductor devices UNIJUNCTION TRANSISTORS Terminology
  • STAS 12123/1-1982 Semiconductor devices RECTIFIER DIODES Measuring methods for electrical and thermal characteristics
  • STAS 11381/13-1981 Graphical symbols for electrical diagrams SEMICONDUCTOR DEVICES
  • STAS 6693/2-1975 Semiconductor devices TRANSISTORS Methods for measuring electrical properties

National Fire Protection Association (NFPA)

YU-JUS

Electronic Components, Assemblies and Materials Association

  • ECA CB 5-1969 Recommended Test Procedure for Semiconductor Thermal Dissipating Devices

BELST

  • STB 2365-2014 Cooling radiators of semiconductor devices. Methods of calculation
  • STB 2340-2013 Cooling radiators of semiconductor devices. General specifications

American Society for Testing and Materials (ASTM)

  • ASTM D6095-99 Standard Test Method for Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
  • ASTM D6095-05 Standard Test Method for Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
  • ASTM D3004-02 Standard Specification for Extruded Crosslinked and Thermoplastic Semi-Conducting, Conductor and Insulation Shielding Materials
  • ASTM D3004-08(2020) Standard Specification for Crosslinked and Thermoplastic Extruded Semi-Conducting, Conductor, and Insulation Shielding Materials
  • ASTM D3004-97 Standard Specification for Extruded Crosslinked and Thermoplastic Semi-Conducting, Conductor and Insulation Shielding Materials
  • ASTM D6095-12 Standard Test Method for Longitudinal Measurement of Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
  • ASTM D6095-12(2023) Standard Test Method for Longitudinal Measurement of Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials

Lithuanian Standards Office

  • LST EN 62416-2010 Semiconductor devices - Hot carrier test on MOS transistors (IEC 62416:2010)

IEEE - The Institute of Electrical and Electronics Engineers@ Inc.

ZA-SANS

  • SANS 60146-6:1992 Semiconductor convertors Part 6: Application guide for the protection of semiconductor convertors against overcurrent by fuses

KR-KS

  • KS C IEC 60748-5-2021 Semiconductor devices — Integrated circuits —Part 5: Semicustom integrated circuits
  • KS C IEC 60748-11-2020 Semiconductor devices — Integrated circuits — Part 11:Sectional specification for semiconductor integrated circuits excluding hybrid circuits
  • KS C IEC 60748-5-2019 Semiconductor devices — Integrated circuits —Part 5: Semicustom integrated circuits

FI-SFS

  • SFS 5327-1987 Glossary of electronic technology. Semiconductor components and overall circuits

GOST

American National Standards Institute (ANSI)

  • ANSI/ASTM D6095:2012 Test Method for Longitudinal Measurement of Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
  • ANSI/UL 1557-2013 Standard for Safety for Electrically Isolated Semiconductor Devices

IN-BIS

US-Unspecified Preparing Activity

BE-NBN

IEC - International Electrotechnical Commission

  • IEC 60146-2:1974 Semiconductor Convertors Part 2: Semiconductor Self-Commutated Convertors (Edition 1.0)