GB/T 8446.2-2004 in English

《GB/T 8446.2-2004电力半导体器件用散热器 第2部分:热阻和流阻测试方法》由TC60（全国电力电子系统和设备标准化技术委员会）归口，TC60SC6（全国电力电子系统和设备标准化技术委员会电力电子器件分会）执行，主管部门为中国电器工业协会。
GB／T8446的本部分给出了测试散热器热阻和流阻的原理，规定了风冷、自冷和水冷散热器的测试系统要求，测试条件和基本测量程序。
本部分适用于电力半导体器件用铸造类(包括挤压)散热器、型材类散热器和热管类散热器的热阻和流阻的测试。

1 Scope


This part of GB/T 8446 gives the principles for measuring the thermal resistance and flow resistance of heat sink and specifies the testing system requirements, testing conditions and basic measurement procedures for air-cooling, self-cooling and water-cooling heat sinks.
This part is applicable to the testing of thermal resistance and flow resistance for the cast (including extruded) heat sinks, profile heat sinks and heat tube heat sinks for power semiconductor device.

2 Principles and Heating Current

2.1 Principles

The thermal resistance of heat sink is a measure of the heat sink's capability for dissipating the heat from the tube core of semiconductor device. Its value is defined as: in thermal balance, the ratio of the temperature difference between the specified point on the heat sink worktop and the specified point of cooling medium to the dissipation power for such temperature difference between the two points, see Formula (1).

Foreword i
1 Scope
2 Principles and Heating Current
2.1 Principles
2.2 Heating Current
3 Requirements and Instructions for Testing System
3.1 General Principles of Testing System
3.2 Testing System for Air-cooling Heat Sink
3.3 Testing System for Self-Cooling Heat Sink
3.4 Testing System for Water-Cooling Heat Sink
4 Test Conditions
4.1 Size of Heating Power
4.2 Installation Force for Heat Sink and Heating Device
4.3 Cooling Conditions of Heat Sink
4.4 Position for Measuring the Temperature of Reference Point
5 Measurements and Calculations
5.1 Preparations for Measurement
5.2 Regulating and Controlling Conditions
5.3 Measurement and Recording of Intermediate Parameters
5.4 Calculation of P and