GB/T 8446.1-2004 in English

SUPERSEDED

Heat sink for power semiconductor device—Part 1:Casting kind series

Issued on:2004-02-04
Implemented on:2004-08-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $180.00
$175.00

Standard No:	GB/T 8446.1-2004
Document status:	SUPERSEDED
Superseded by:	GB/T 8446.1-2022 Heat sinks for power semiconductor devices—Part 1: Radiators
Superseded on:	2022-10-01
Title in English:	Heat sink for power semiconductor device—Part 1:Casting kind series
Title in Chinese:	电力半导体器件用散热器第1部分：铸造类系列
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	2004-02-04
Implemented on:	2004-08-01
Superseding:	GB/T 8446.1-1987 Heat sink for power semiconductor device
ICS Classification:	31.080-Semiconductor devices
Chinese Classification:	K46-Power semiconductor device and parts
Professional Classification:	GB-National Standard
Related Keywords:	power semiconductor device part casting kind series scopethis part heat sink power semiconductor devices part
Related Topics:	thermal stress dispersion thermoelectric semiconductor quinone semiconductor Semiconductor generations are classified according to semiconductor GB/T 8446.1 GB/T 8446.1-1987 GB/T 8446.1-2004 GB/T 8446.1-2022 semiconductor radiator Semiconductor device Power semiconductor devices Semiconductor company file classification Manufacturing of special equipment for semiconductor devices Power semiconductor radiator

《GB/T 8446.1-2004电力半导体器件用散热器第1部分:铸造类系列》由TC60（全国电力电子系统和设备标准化技术委员会）归口，TC60SC6（全国电力电子系统和设备标准化技术委员会电力电子器件分会）执行，主管部门为中国电器工业协会。
GB/T8446的本部分规定了散热器的术语定义、型式尺寸、技术要求、检验规则和标志、包装等要求。本部分适用于电力半导体器件用，热阻在7．5℃／W至0．01℃／W的铸造类(包括挤压)散热器。形尺寸和安装尺寸符合本部分第5章规定的型材散热器也可参照使用。本部分不适用于热管类散热器。

Scope

This part of GB/T 8446 specifies the definition of terms, type and size, technical requirements, inspection rules, marking, packaging and other requirements of radiators. This part applies to cast (including extruded) radiators for power semiconductor devices with a thermal resistance of 7.5°C/W to 0.01°C/W. Profile radiators whose external dimensions and installation dimensions comply with the provisions in Chapter 5 of this part can also be used as a reference. This section does not apply to heat pipe radiators.

More samples: JJG 21-2008 DL/T 5154-2012 GB 50021-2001(2009)

Sample only — not a preview of GB/T 8446.1-2004

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