Chip Test Requirements

Chip Test Requirements, Total:88 items.

The international standard classification for "Chip Test Requirements" includes: Integrated circuits. Microelectronics , Diagnostic equipment , Laboratory ware and related apparatus , Identification cards and related devices , Medical equipment , IT applications in transport and trade , Optoelectronics. Laser equipment .

The Chinese standard classification for "Chip Test Requirements" includes: Mobile communication equipment , Microcircuit in general , Medical apparatus and devices in general , Laboratory instrument and vacuum instrument in general , Data medium , Medical laboratory equipment , Computer application , Microwave and millimeter wave diode and triode .

Professional Standard - Post and Telecommunication

YD/T 4608.3-2024 5G network test data collection unified file interface technical requirements Part 3: Chip original frame collection requirements
YD/T 1886-2009 Security Requirements and Test Specification for SoC in Mobile Terminal

工业和信息化部

YD/T 1886-2015 Security requirements and test specification for system on chip in mobile terminal
YD/T 3944-2021 Evaluation method for artificial intelligence chip benchmark

Group Standards of the People's Republic of China

T/CSAE 222-2021 Battery electric passenger vehicle automotive grade integrated circuit general requirements
T/CIE 044-2017 Optical fiber core exchange robot technical requirements and test methods
T/TAF 224-2024 General technical requirements for smart terminal security chips
T/CSAE 224-2021 Functional safety requirement and test specification for communication integrated circuit in battery electric passenger vehicle
T/SHMHZQ 031-2022 Requirements for chip security of mobile terminals
T/GDRA 011-2019 Technical requirements for transformer core robot stacking
T/CESA 1120-2020 AI chips-Test metrics and test method of deep learning chips for edge side
T/CIE 126-2021 Magnetic random access memory chip test method
T/CESA 1119-2020 AI chips-Test index and test method of deep learning chips for cloud side
T/CSAE 223-2021 Functional safety requirement and test specification for control integrated circuit in battery electric passenger vehicle
T/CESA 1121-2020 AI chips-Test metrics and test method of deep learning chips for terminal side
T/CTS 11-2023 Technical requirements of data security chip for data recorder of vehicle
T/CSAE 260-2022 Technical specification and test method for visual perception computing chip of intelligent and connected vehicle
T/CASAS 030-2023 Measurement methods on GaN millimeter Wave front-end MMIC
T/QGCML 3140-2024 Chip testing intelligent warehouse management system
T/CESA 1248-2023 Technical requirement for chiplet interface bus
T/SZROBOT 0005-2023 Technical requirements for AI-chip enhanced edge vision module

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会

GB/T 35010.1-2018 Semiconductor die products—Part 1:Requirements for procurement and use
GB/T 35010.4-2018 Semiconductor die products—Part 4: Requirements for die users and suppliers
GB/T 34324-2017 Technical requirement of microarray biochip spotter
GB/T 35010.6-2018 Semiconductor die products—Part 6:Requirements for concerning thermal simulation
GB/T 33806-2017 Technical requirement of area fluorescent imaging microarray scanner
GB/T 35533-2017 General technical requirement for chromosomal abnormality detection microarray
GB/T 35010.5-2018 Semiconductor die products—Part 5:Requirements for concerning electrical simulation
GB/T 33805-2017 Technical requirement of laser confocal biochip scanner
GB/T 35891-2018 Technical requirement of microarray washer
GB/T 35895-2018 Technical requirement of microarray hybridizer

国家市场监督管理总局、中国国家标准化管理委员会

GB/T 41407-2022 Technical requirement of nucleic acid isothermal amplification analyzer based on microfluidic chips
GB/T 37720-2019 Identification card—Chip technical requirements for financial IC card

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 36136-2018 General requirements of DNA array-based M. tuberculosis drug resistance detection
GB/T 41521-2022 General technical requirement of microfluidic chip for multi-index nucleic acid isothermal amplification and detection
GB/T 29888-2013 General requirements of DNA array-based mycobacteria identification

Professional Standard - Urban Construction

CJ/T 306-2009 Requirement for chip technology of contactless CPU card in construction case

Professional Standard - Finance

JR/T 0098.2-2012 China Financial Mobile Payment-Test Specifications-Part 2:Security Chip

Guangdong Provincial Standard of the People's Republic of China

DB44/T 1905-2016 UHF radio frequency identification (RFID) chip test method

Professional Standard - Electron

SJ/T 11399-2009 Measurement methods for chips of light emitting diodes

未注明发布机构

DIN EN 1303:1998 Building hardware – Cylinders for locks – Requirements and test methods; German version

SCC

BS PD ES 59008-5-3:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types-Minimally-packaged die
BS PD ES 59008-4-1:2001 Data requirements for semiconductor die. Specific requirements and recommendations-Test and quality
BS PD ES 59008-1:2000 Data requirements for semiconductor die-General requirements
DANSK DS/EN 59008-5-2:2001 Data requirements for semiconductor die - Part 5-2: Particular requirements and recommendations for die types - Bare die with added connection structures
BS PD ES 59008-2:1999 Data requirements for semiconductor die-Vocabulary
BS PD ES 59008-4-3:2000 Data requirements for semiconductor die. Specific requirements and recommendations-Thermal
BS PD ES 59008-3:1999 Data requirements for semiconductor die-Mechanical, material and connectivity requirements
AENOR UNE-EN 1303:2016 Building fittings. Cylinders for locks. Requirements and test methods.
UNE-EN 1303:2006 Building hardware - Cylinders for locks - Requirements and test methods
DANSK DS/EN 1303:2015 Building hardware - Cylinders for locks - Requirements and test methods
AENOR UNE-EN 1303/AC:2008 Building fittings. Cylinders for locks. Requirements and test methods.
BS PD ES 59008-4-4:2000 Data requirements for semiconductor die. Specific requirements and recommendations-Electrical simulation
NS-EN 1303:2015 Building hardware — Cylinders for locks — Requirements and test methods
NS-EN 1303:2005 Building hardware — Cylinders for locks — Requirements and test methods
NS-EN 1303:1998 Building hardware — Cylinders for locks — Requirements and test methods
BS PD ES 59008-4-2:2001 Data requirements for semiconductor die. Specific requirements and recommendations-Handling and storage
DIN EN 1303 E:2013 Draft Document - Building hardware - Cylinders for locks - Requirements and test methods; German version prEN 1303:2013
BS DD ENV 50219:1996 Description of the reliability test structures of the European mini test chip
BS PD 6598:1996 Measurement techniques for the characterization of the European mini test chip
BS PD ES 59008-5-1:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types-Bare die
BS PD 6595:1996 Parameter extraction techniques for the European mini test chip
BS DD ENV 50218:1996 Description of a parametrized European mini test chip

CENELEC - European Committee for Electrotechnical Standardization

ES 59008-5-1-2001 Data Requirements for Semiconductor Die Part 5-1: Particular Requirements and Recommendations for Die Types - Bare Die
ES 59008-5-3-2001 Data Requirements for Semiconductor Die - Part 5-3: Particular Requirements and Recommendations for Die Types - Minimally-Packaged Die
ES 59008-4-3-1999 Data Requirements for Semiconductor Die Part 4-3: Specific Requirements and Recommendations - Thermal

Danish Standards Foundation

DS/ES 59008-5-1:2001 Data requirements for semiconductor die - Part 5-1: Particular requirements and recommendations for die types - Bare die
DS/ES 59008-4-1:2001 Data requirements for semiconductor die - Part 4-1: Specific requirements and recommendations - Test and quality
DS/EN 61854:2001 Overhead lines - Requirements and tests for spacers

British Standards Institution (BSI)

PD ES 59008-4-1:2001 Data requirements for semiconductor die. Specific requirements and recommendations. Test and quality
PD ES 59008-5-3:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types. Minimally-packaged die
PD ES 59008-5-2:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types. Bare die with added connection structures
BS EN 1303:2015 Building hardware. Cylinders for locks. Requirements and test methods
PD 6598-1996 Measurement techniques for the characterization of the European mini test chip
BS EN IEC 61854:2020 Overhead lines. Requirements and tests for spacers

(U.S.) Ford Automotive Standards

FORD FLTM EU-BI 007-1-2001 CHIP RESISTANCE TEST FOR PAINTED PANELS
FORD FLTM BI 007-1-2001 CHIP RESISTANCE TEST FOR PAINTED PANELS

Association Francaise de Normalisation

NF EN 1303:2015 Building hardware - Lock cylinders - Requirements and test methods
NF C11-204*NF EN IEC 61854:2020 Overhead lines - Requirements and tests for spacers

ES-UNE

UNE-EN 1303:2016 Building hardware - Cylinders for locks - Requirements and test methods

German Institute for Standardization

DIN EN 1303:2015-08 Building hardware - Cylinders for locks - Requirements and test methods; German version EN 1303:2015
DIN 86076:2007-06 Gasket sheets for ship building - Requirements and tests
DIN 47627:1986-04 Solderless coreconnections in sleeves for telecommunication cables; requirements, tests

PL-PKN

PN M54832-02-1992 Diaphragm gasmeters Re?uirements and tests
PN M55552-1986 Metal cutting machin? tools Test pieces for accuracy test General r??uirements

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

JEDEC JESD51-4-1997 Thermal Test Chip Guideline (Wire Bond Type Chip) Errata - September 1997; Replaces JEP129: 1997

European Committee for Electrotechnical Standardization（CENELEC）

EN IEC 61854:2020 Overhead lines - Requirements and tests for spacers

AENOR

UNE-EN 61854:1999 OVERHEAD LINES. REQUIREMENTS AND TESTS FOR SPACERS