GB/T 37720-2019 in English
VALIDIdentification card—Chip technical requirements for financial IC card
- Issued on:2019-08-30
- Implemented on:2020-03-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
$136.00
《GB/T 37720-2019识别卡 金融IC卡芯片技术要求》由TC28（全国信息技术标准化技术委员会）归口，TC28SC17（全国信息技术标准化技术委员会卡及身份识别安全设备分会）执行，主管部门为国家标准化管理委员会。
Introduction
1. Basic requirements
The basic requirements for financial IC card chips include the following aspects:
| Technical requirements | Specific requirements |
|---|---|
| Cryptographic algorithm | Should support SM2, SM3, SM4 cryptographic algorithms to ensure the security of data transmission and storage. |
| Data storage space | Not less than 16 k bytes to meet the storage requirements of financial transaction data. |
| Operating voltage | Meet the requirements of JR/T0025.3-2013 to ensure the stability of the chip in different environments. |
| Random number generator | The generated random numbers should comply with the requirements of GB/T32915 to ensure the security of the encryption algorithm. |
2. Physical Characteristics
The physical characteristics of financial IC card chips include climate and environmental adaptability and electrostatic protection:
| Environmental Conditions | Parameter Requirements |
|---|---|
| Operating Temperature | -25 ℃～50 ℃ |
| Relative Humidity | 20%～93% |
| Atmospheric Pressure | 86 kPa~106 kPa |
3. Safety Requirements
The security of financial IC card chips is the core of ensuring data security, including:
- ROM anti-leakage, anti-interference, and anti-tampering: It has multiple protection capabilities to ensure the security of stored content.
- EEPROM and FLASH anti-leakage: Encryption technology is used to protect data storage.
- RAM anti-leakage: Prevent memory data from being illegally read.
4. Implementation Suggestions
In actual applications, it is recommended to take the following measures:
- Choose a chip supplier that meets the standards: Ensure that the chip performance and security meet national standards.
- Conduct strict testing and verification: Including environmental adaptability testing, electrostatic protection testing, etc.
- Establish a complete monitoring mechanism: Real-time monitoring of the chip operation status, timely detection and handling of abnormal situations.
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