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Database: 365,228(8 Aug 2026)
  1. HOME
  2. Standards for v6 chip

v6 chip

v6 chip, Total:353 items.

The international standard classification for "v6 chip" includes: Motion picture films. Cartridges , Biology. Botany. Zoology , Photographic paper, films and cartridges , Measurement of force, weight and pressure , Semiconducting materials , Other materials for the reinforcement of composites , Farming and forestry in general , General methods of tests and analysis for food products , Veterinary medicine , Health care technology (Vocabularies) , Laboratory medicine , Integrated circuits. Microelectronics , Laboratory ware and related apparatus , Optoelectronics. Laser equipment , Character sets and information coding , Identification cards and related devices , Microbiology in general .

The Chinese standard classification for "v6 chip" includes: Photosensitive material , Basic Subject in general , Basic standards and general methods for photosensitive material , Material and component for instrument and meter , Compound semiconductor material , Fibre reinforced composites , Plant quarantine, pest control , Basic standards and general methods , Medical apparatus and devices in general , Daily-use hardware , Microcircuit in general , Laboratory instrument and vacuum instrument in general , Microwave and millimeter wave diode and triode , Data encryption , Projector and slide projector , Data medium , Semiconductor integrated circuit , Medical laboratory equipment .

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

Professional Standard - Medicine

Professional Standard - Light Industry

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会

未注明发布机构

Group Standards of the People's Republic of China

Taiwan Provincial Standard of the People's Republic of China

  • CNS 13808-1997 Epitaxial Wafers for Light Emitting Diodes
  • CNS 13622-1997 Fixed chip resistor for use in electronic equipment
  • CNS 13625-1995 Product Specifications for Round Polished Monocrystalline Gallium Arsenide Wafers

工业和信息化部

Fujian Provincial Standard of the People's Republic of China

Professional Standard - Electron

  • SJ/T 11399-2009 Measurement methods for chips of light emitting diodes
  • SJ/T 11734-2019 Detailed Specification of Chip Scale Package (CSP) LED Blank
  • SJ/T 11486-2015 Technical specification for low power light. emitting diode chips
  • SJ/T 10416-1993 Generic Apecification for chip for semiconductor discrete devices

Professional Standard - Password Professional Standards

Professional Standard - Machinery

  • JB/T 8259.1-2014 Overhead Projectors - Part 1: Film Rolls, Cores and Winders Dimensions
  • JB/T 8259.3-1999 Overhead projectors film rolls， cores and winders dimensions

国家市场监督管理总局、中国国家标准化管理委员会

  • GB/T 37720-2019 Identification card—Chip technical requirements for financial IC card
  • GB/T 36613-2018 Probe test method for light emitting diode chips

Professional Standard - Public Safety Standards

  • GA/T 1171-2014 Examination methods for similarity comparison of integrated circuit chips

Shanxi Provincial Standard of the People's Republic of China

  • DB1404/T 20-2021 Classification of UVC LED Chip Specifications for Disinfection

Sichuan Provincial Standard of the People's Republic of China

Guangdong Provincial Standard of the People's Republic of China

Professional Standard - Commodity Inspection

  • SN/T 1543-2005 GeneChip methods for identification of foodborne pathogens

IPC - Association Connecting Electronics Industries

Indonesia Standards

SCC

Defense Logistics Agency

CENELEC - European Committee for Electrotechnical Standardization

  • ES 59008-5-1-2001 Data Requirements for Semiconductor Die Part 5-1: Particular Requirements and Recommendations for Die Types - Bare Die
  • ES 59008-5-3-2001 Data Requirements for Semiconductor Die - Part 5-3: Particular Requirements and Recommendations for Die Types - Minimally-Packaged Die

SE-SIS

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

HU-MSZT

Danish Standards Foundation

  • DS/ES 59008-5-1:2001 Data requirements for semiconductor die - Part 5-1: Particular requirements and recommendations for die types - Bare die
  • DS/CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers

German Institute for Standardization

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

IEC - International Electrotechnical Commission

  • PAS 62084-1998 Implementation of Flip Chip and Chip Scale Technology (Edition 1.0; No Replacement)
  • IEC TR 62258-4:2012 Produits de puces de semiconducteurs – Partie 4: Questionnaire destiné aux utilisateurs et fournisseurs de puces (Edition 2.0)

American National Standards Institute （ANSI)

TIA - Telecommunications Industry Association

  • J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps (IPC/EIA J-STD-028)

CZ-CSN

U.S. Air Force

British Standards Institution (BSI)

  • BS PD CLC/TR 62258-4:2013 Semiconductor die products. Questionnaire for die users and suppliers
  • PD ES 59008-5-3:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types. Minimally-packaged die
  • BS ISO 1039:1996 Cinematography. Cores for motion-picture and magnetic film rolls. Dimensions
  • BS ISO 1039:1995 Cinematography - Cores for motion-picture and magnetic film rolls - Dimensions
  • PD 6598-1996 Measurement techniques for the characterization of the European mini test chip
  • PD ES 59008-5-2:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types. Bare die with added connection structures
  • PD 6595-1996 Parameter extraction techniques for the European mini test chip
  • DD ENV 50218-1996 Description of a parametrized European mini test chip

International Organization for Standardization (ISO)

  • ISO 1039:1995 Cinematography - Cores for motion-picture and magnetic film rolls - Dimensions
  • ISO 1039:1988 Cinematography; cores for motion-picture and magnetic film rolls; dimensions
  • ISO 7943-3:1987 Photography; Overhead projectors; Part 3 : Film rolls, cores and winders; Dimensions

(U.S.) Telecommunications Industries Association

  • TIA J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps IPC/EIA J-STD-028

GSO

Association Francaise de Normalisation

(U.S.) Ford Automotive Standards

European Committee for Electrotechnical Standardization（CENELEC）

  • CLC/TR 62258-4-2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
  • CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers

RU-GOST R

Electronic Industrial Alliance (U.S.)

  • EIA EIA-763-2002 Bare Die and Chip Scale Packages Taped in 8 mm & 12 mm Carrier Tape for Automatic Handling

Canadian Standards Association (CSA)

Korean Agency for Technology and Standards (KATS)

Institute of Electrical and Electronics Engineers (IEEE)

ECIA - Electronic Components Industry Association

  • IS-763-1998 Bare Die and Chip Scale Packages Taped in 8 mm & 12 mm Carrier Tape for Automatic Handling
  • 540AA00-1991 Blank Detail Specification for Chip Carrier Sockets for Leadless Type A@ B or D Chip Carriers for Use in Electronic Equipment
  • 540AC00-1991 "Blank Detail Specification for Chip Carrier Sockets for Plastic Chip Carrier (PCC) Packages with ""J"" Type Leads for Use in Electronic Equipment"
  • EIA/IS-535BAAE-1998 Detail Specification for Low ESR Molded Tantalum Chip
  • 540A000-A-1990 Sectional Specification for Sockets for Chip Carriers for Use in Electronic Equipment
  • EIA-540AAAA-1990 "Detail Specification for Chip Carrier Sockets for Leadless Type A (1.27 mm (.050"") Spacing) Chip Carriers for Use in Electronic Equipment"

U.S. Military Regulations and Norms

General Motors Corporation (GM)

Japanese Industrial Standards Committee (JISC)

  • JIS K 7556:1985 Dimensions of cores for motion-picture raw stock and magnetic sound recording films

Electronic Components, Assemblies and Materials Association

Society of Automotive Engineers (SAE)

SAE - SAE International

Electronic Components, Assemblies and Materials Association

  • ECA 540AC00-1991 Blank Detail Specification for Chip Carrier Sockets for Plastic Chip Carrier (PCC) Packages with"J" Type Leads for Use in Electronic Equipment

Society of Motion Picture and Television Engineers (SMPTE)

  • SMPTE 159.1-2001 Motion-Picture Film (8-mm Type S) - Model 1 Camera Cartridge - Cartridge-Camera Interface and Take-up Core Drive
  • SMPTE 197-2003 Motion-Picture Film (8-mm Type S) - 50-ft Model 1 Sound Camera Cartridge - Cartridge, Cartridge-Camera Interface, and Take-Up Core

RO-ASRO

  • STAS 6550-1971 Radio components CONTROLLING SHAFT HEADS Types and basic dinensions

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