GB/T 36613-2018 in English
VALIDProbe test method for light emitting diode chips
- Issued on:2018-09-17
- Implemented on:2019-01-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
$156.00
《GB/T 36613-2018发光二极管芯片点测方法》由339-1（工业和信息化部（电子））归口，主管部门为工业和信息化部（电子）。
Introduction
1. Background of standard formulation and analysis of technological evolution
With the rapid development of semiconductor lighting technology, the quality of light-emitting diode (LED) chips, as core components, directly determines the application effect of LED devices. In order to ensure the reliability and stability of LED chips in large-scale production, GB/T 36613-2018 "Light-emitting diode chip point test method" came into being. Based on previous industry practice experience and combined with the development needs of modern semiconductor testing technology, this standard has formulated a series of scientific and standardized test conditions and methods.
2. Standard framework comparison table
| Standard dimension | GB/T 36613—2018 | SJ/T 11394—2009 | SJ/T 11399—2009 |
|---|---|---|---|
| Scope of application | Visible light LED chip, ultraviolet and infrared can be referenced | Semiconductor light emitting diode test method | LED chip optical parameter test method |
| Test accuracy | ±3% | ±5% | ±2% |
| Drive mode | Pulse drive transient test | DC/AC hybrid drive | Fixed current drive |
| Light receiver type | Integrating sphere, three-hole light microscope | Spectrophotometer | Imaging spectrometer |
3. Chip test conditions and steps
The test conditions include standard atmospheric conditions (temperature range: 15~35℃, humidity: 45%~75%, air pressure: 86~106kPa) and strict conditions of arbitration test (temperature ±1℃, humidity 48%~52%). The test steps cover machine parameter setting, chip placement and connection, wafer scanning and automatic spot measurement.
4. Detailed interpretation of optoelectronic parameters
Forward voltage: The transient forward current and pulse width must be appropriate, and shall be implemented in accordance with 5.2.1 of SJ/T11394-2009. The reverse voltage and reverse current test methods are similar, and focus on the control of test accuracy.
5. Implementation suggestions
Clean environment management: The test must be carried out in a clean environment of no less than 100,000 levels, and the machine and probes must be cleaned regularly.
Equipment calibration: The point measurement system should be calibrated regularly, and the probes should be replaced when the deviation between the reference sample and the standard value exceeds 3%.
Staff training: Operators must be familiar with the chip testing process and error control methods to ensure the accuracy of the data.
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