Microcomputer chip connection method

Microcomputer chip connection method, Total:84 items.

The international standard classification for "Microcomputer chip connection method" includes: Diagnostic equipment , Biology. Botany. Zoology , Optoelectronics. Laser equipment , Document imaging applications , Physicochemical methods of analysis , Farming and forestry in general , Integrated circuits. Microelectronics , Veterinary medicine .

The Chinese standard classification for "Microcomputer chip connection method" includes: Medical apparatus and devices in general , Environmental Condition and General Test Method , Microwave and millimeter wave diode and triode , Library, Archives, Literature and Information , Electron optics and other physical optics instrument , Plant quarantine, pest control , Semiconductor integrated circuit , Animal quarantine, veterinary and epidemic prevention , Dedicated processing equipment .

未注明发布机构

DIN EN IEC 63215-5 E:2022-06 Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices

Group Standards of the People's Republic of China

T/SHAAV 017-2024 Canine respiratory pathogen detection microfluidic chip method
T/ZZB Q031-2020 Rapid detection of pathogens in food — Microfluidic chip method
T/SHAAV 007-2021 Microfluidic chip method for seven zoonotic pathogens in dogs
T/CIE 134-2022 Test method for data retention time of magnetic random access memory chip
T/CI 156-2023 Method of DNA microarray for detection of important pathogens in cultured fish
T/SHAAV 016-2024 Feline respiratory pathogen detection microfluidic chip method
T/GDES 29-2019 The Method of Green Manufacturing Evaluation about LED Chips/Substrate
T/CI 157-2023 Method of DNA microarray for detection of important pathogens in cultured crustacean
T/CESA 1119-2020 AI chips-Test index and test method of deep learning chips for cloud side
T/CASAS 030-2023 Measurement methods on GaN millimeter Wave front-end MMIC
T/SHAAV 008-2021 Microfluidic chip method for detection of five zoonotic pathogens in cats
T/CIE 126-2021 Magnetic random access memory chip test method
T/ZACA 031-2020 Rapid detection of pathogens in food — Microfluidic chip method

国家质量监督检验检疫总局

SN/T 4864-2017 Transgenic maize detection—Taqman array card method

国家市场监督管理总局、中国国家标准化管理委员会

GB/T 36613-2018 Probe test method for light emitting diode chips
GB/T 38490-2021 Determination of high-throughput adaptive evolution for microorganisms—Microfluidic chip method
GB/T 35029-2018 Method based the microarray for mutation detetion of hereditary hearing loss

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 28065-2011 Biochip detection of Ceratitis capitata(Wiedemann)
GB/T 12355-1990 Micrographics-Splices of microfilm with image
GB/T 12355-2008 Micrographics - Splices of microfilm with image - Dimensions and Operational Constraints
GB/T 43748-2024 Microbeam analysis—Transmission electron microscopy—Method for measuring the thickness of functional thin films in integrated circuit chips

Jilin Provincial Standard of the People's Republic of China

DB22/T 3074-2019 Detection of Common Respiratory Pathogens-Microfluidic Chip Method

Professional Standard - Public Safety Standards

GA/T 1171-2014 Examination methods for similarity comparison of integrated circuit chips

Fujian Provincial Standard of the People's Republic of China

DB35/T 1370-2013 Light-emitting diode chip point test method

Professional Standard - Machinery

JB/T 6850-1993 Ultrasonic film splicer for microphotography

Professional Standard - Commodity Inspection

SN/T 4283.6-2015 Test method of microplate gene chip at frontier port-Part 6:Twelve food borne pathogenic bacteria
SN/T 4283.3-2015 Test method of microplate gene chip at frontier port-Part 3:Seven respiratory viruses
SN/T 4283.1-2015 Test method of microplate gene chip at frontier port-Part 1:General technical procedure

Professional Standard - Energy

NB/T 11588-2024 Test methods for sandwich materials used in wind turbine blades

海关总署

SN/T 5336-2020 Detection of classical swine fever virus and african swine fever virus-Microfluidic chip method

Sichuan Provincial Standard of the People's Republic of China

DB5132/T 88-2023 Yak meat PCR-membrane chip technology inspection method

Professional Standard - Electron

SJ/T 31184-1994 Requirements of readiness and methods of inspection and assessment for button stem welding machines

British Standards Institution (BSI)

BS EN IEC 63215-2:2023 Endurance test methods for die attach materials - Temperature cycling test method for die attach materials applied to discrete type power electronic devices
21/30439434 DC BS EN IEC 63215-5. Endurance test methods for die attach materials - Part 5. Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices
22/30383603 DC BS IEC 63215-4. Endurance test methods for die attach materials applied to power electronic devices - Part 4. Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices
BS EN 62024-1:2002 High frequency inductive components - Electrical characteristics and measuring methods - Nanohenry range chip inductor
BS EN 62024-1:2008 High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor
BS EN 2591-219:2002 Elements of electrical and optical connection - Test methods - Voltage strength for insulated terminal lugs and in-line splices
PD ES 59008-5-2:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types. Bare die with added connection structures
BS EN ISO 17279-3:2021 Welding. Micro joining of second generation high temperature superconductors. Test methods for joints
DD CEN/TS 1591-3:2007 Flanges and their joints. Design rules for gasketed circular flange connections - Calculation method for metal to metal contact type flanged joint
PD CEN/TR 1591-5:2012 Flanges and their joints. Design rules for gasketed circular flange connections. Calculation method for full face gasketed joints
20/30383597 DC BS EN IEC 63215-2. Endurance test methods for die attach materials applied to power electronics devices. Part 2. Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices

Association Francaise de Normalisation

NF EN IEC 63215-2:2023 Endurance test methods for chip attach materials - Part 2: Thermal cycle test method for chip attach materials, applied to discrete type power electronic devices

International Electrotechnical Commission (IEC)

IEC 63215-2:2023 Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices

Defense Logistics Agency

DLA DSCC-VID-V62/05615 REV A-2012 MICROCIRCUIT, LINEAR, INTERCONNECT EXTENDER CHIPSET WITH LVDS, MONOLITHIC SILICON
DLA SMD-5962-92061 REV G-2008 MICROCIRCUIT, HYBRID, DIGITAL, MULTICHIP, DUAL CHANNEL, DRIVER-RECEIVER
DLA SMD-5962-92061 REV F-2003 MICROCIRCUIT, HYBRID, DIGITAL, MULTICHIP, DUAL CHANNEL, DRIVER-RECEIVER
DLA SMD-5962-90976-1992 MICROCIRCUIT, CHMOS SINGLE-CHIP, 8-BIT MICROCONTROLLER WITH 256 BYTES OF ON CHIP DATA RAM, MONOLITHIC SILICON
DLA MS24699 REV B-2005 SHAFT, CONNECTOR, RACK AND PANEL, MINIATURE

European Committee for Electrotechnical Standardization（CENELEC）

EN IEC 63215-2:2023 Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices

Institute of Electrical and Electronics Engineers (IEEE)

IEEE 1496-2000 SBus - Chip and module interconnect bus
IEEE 1496-1993 Standard for a chip and module interconnect bus: SBus

German Institute for Standardization

DIN EN IEC 63215-5:2022-06 Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices (IEC 91/1770/CD:2021); Text in German and English / N...
DIN EN 2591-219:2003 Aerospace series - Elements of electrical and optical connection; Test methods - Part 219: Voltage strength for insulated terminal lugs and in-line splices; German and English version EN 2591-219:2002

SCC

BS PD ES 59008-3:1999 Data requirements for semiconductor die-Mechanical, material and connectivity requirements
DANSK DS/EN IEC 63215-2:2023 Endurance test methods for die attach materials – Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices
DIN EN IEC 63215-5 E:2022 Draft Document - Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices (IEC 91/1770/CD:2021); Text in Germa...
DANSK DS/EN 59008-5-2:2001 Data requirements for semiconductor die - Part 5-2: Particular requirements and recommendations for die types - Bare die with added connection structures
BS PD CEN/TR 1591-5:2012 Flanges and their joints. Design rules for gasketed circular flange connections-Calculation method for full face gasketed joints
BS EN 1591-1:2001+A1:2009 Flanges and their joints. Design rules for gasketed circular flange connections-Calculation method

American National Standards Institute （ANSI)

ANSI/IEEE 1101.1:2008 Standard for Mechanical Core Specifications for Microcomputers Using IEC 60603-2 Connectors
ANSI/SCTE 312007-2008 Test Method for Measuring Diameter Over Core

SAE - SAE International

SAE ARP843-1964 Chip Detector@ Electrical Connection@ Remote Indicating
SAE ARP843A-2001 Chip Detector@ Electrical Connection@ Remote Indicating

Society of Automotive Engineers (SAE)

SAE ARP843A-2012 Chip Detector, Electrical Connection, Remote Indicating
SAE ARP843-1995 CHIP DETECTOR, ELECTRICAL CONNECTION, REMOTE INDICATING
SAE ARP843B-2021 Chip Detector, Electrical Connection, Remote Indicating

IPC - Association Connecting Electronics Industries

IPC 7711 3.3.3-1998 Chip Removal (Bottom Termination) Hot Air Method
IPC TM-650 2.1.1D-1998 Microsectioning@ Manual Method
IPC TM-650 2.1.1E-2004 Microsectioning@ Manual Method

ES-UNE

UNE-EN IEC 63215-2:2023 Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices (Endorsed by Asociación Española de Normalización in January of 2024.)

European Association of Aerospace Industries

AECMA PREN 2591-B19-1993 Aerospace Series Elements in Electrical and Optical Connection Test Methods Part B19 - Voltage Strength for Lugs and in-Line Splices
AECMA PREN 2591-219-1995 Aerospace Series Elements of Electrical and Optical Connection Test Methods Part 219: Voltage Strength for Insulated Terminal Lugs and In-Line Splices Edition P 1

WRC - Welding Research Council

BULLETIN 271-1981 METHODS OF ANALYSIS OF BOLTED FLANGED CONNECTIONS – A REVIEW ; GASKET LEAKAGE BEHAVIOR TRENDS

Korean Agency for Technology and Standards (KATS)

KS R ISO 4141-4:2004 Road vehicles-Multi-core connecting cables-Part 4:Articulation test method and requirements for coiled cable assemblies
KS R ISO 4141-4:2014 Road vehicles — Multi-core connecting cables — Part 4: Test methods and requirements for coiled cable assemblies

Society of Motion Picture and Television Engineers (SMPTE)

SMPTE 159.1-2001 Motion-Picture Film (8-mm Type S) - Model 1 Camera Cartridge - Cartridge-Camera Interface and Take-up Core Drive
SMPTE 197-2003 Motion-Picture Film (8-mm Type S) - 50-ft Model 1 Sound Camera Cartridge - Cartridge, Cartridge-Camera Interface, and Take-Up Core

FI-SFS

SFS N.1.8-1962 Traktorit Voimanottoakselin kytkinkappale

European Committee for Standardization (CEN)

EN ISO 17279-3:2021 Welding - Micro joining of second generation high temperature superconductors - Part 3: Test methods for joints (ISO 17279-3:2021)

International Organization for Standardization (ISO)

ISO 17279-3:2021 Welding - Micro joining of second generation high temperature superconductors - Part 3: Test methods for joints

RU-GOST R

GOST 24692-1981 35-mm reflex cameras. Bayonet sizes

Others: