Chip test

Chip test, Total:92 items.

The international standard classification for "Chip test" includes: Farming and forestry in general , General methods of tests and analysis for food products , Motion picture films. Cartridges , Other materials for the reinforcement of composites , Optoelectronics. Laser equipment , Veterinary medicine , Biology. Botany. Zoology , Laboratory medicine , Character sets and information coding .

The Chinese standard classification for "Chip test" includes: Plant quarantine, pest control , Basic standards and general methods , Photosensitive material , Fibre reinforced composites , Semiconductor emitting device , Basic standards and general methods , Medical apparatus and devices in general , Basic Subject in general , Data encryption , Microwave and millimeter wave diode and triode , Daily-use hardware .

Guangdong Provincial Standard of the People's Republic of China

DB44/T 1905-2016 UHF radio frequency identification (RFID) chip test method

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 28065-2011 Biochip detection of Ceratitis capitata(Wiedemann)
GB/T 31730-2015 Detection of genetically modified components in rice―Membrane-based array method
GB/T 31294-2014 The core to wind turbine blade―Test method for facing cleavage of sandwich panels
GB/T 19495.6-2004 Detection of genetically modified organisms and derived products-Gene-chip detection
GB/T 36357-2018 Technical specification for middle power light-emitting diode chips
GB/T 6848-1986 Dimensions of the cores for motion-picture film rolls
GB/T 41522-2022 Method of DNA microarray for detection of three canine viruses

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会

GB/T 33807-2017 Detection of genetically modified components in maize-Gene chip method
GB/T 35535-2017 Detection of genetically modified components in soybean and canola―Membrane-based gene-chip method
GB/T 33752-2017 Aldehyde slide for microarrays

Group Standards of the People's Republic of China

T/CIE 126-2021 Magnetic random access memory chip test method
T/SHAAV 017-2024 Canine respiratory pathogen detection microfluidic chip method
T/ZS 0646-2024 IC level flip chip die bonder
T/CESA 1121-2020 AI chips-Test metrics and test method of deep learning chips for terminal side
T/CASAS 030-2023 Measurement methods on GaN millimeter Wave front-end MMIC
T/CESA 1119-2020 AI chips-Test index and test method of deep learning chips for cloud side
T/QGCML 3140-2024 Chip testing intelligent warehouse management system
T/CSPSTC 11-2018 Rapid determination of pathogenic bacteria in food Biochip method
T/SBX 021-2019 Operation rules for automatic scribing and splitting of laser chips
T/CESA 1120-2020 AI chips-Test metrics and test method of deep learning chips for edge side
T/BFIA 007-2021 Security technical specification of CPU for financial security chip

Professional Standard - Password Professional Standards

GM/T 0008-2012 Cryptography test criteria for security IC

Professional Standard - Commodity Inspection

SN/T 2651-2010 Determination of pathogenic bacteria in meat and meat products-Gene chip method
SN/T 3152-2012 Determination of diarrheagenic Escherichia coli in food for export-GeneChip method
SN/T 2518-2010 Determination of Food Borne Viruses in Shellfish - Mnp-gene Chip Method

Professional Standard - Finance

JR/T 0098.2-2012 China Financial Mobile Payment-Test Specifications-Part 2:Security Chip

国家市场监督管理总局、中国国家标准化管理委员会

GB/T 36613-2018 Probe test method for light emitting diode chips

Fujian Provincial Standard of the People's Republic of China

DB35/T 1370-2013 Light-emitting diode chip point test method

Professional Standard - Medicine

YY/T 1152-2009 Aldehyde slide for biochips

未注明发布机构

JEDEC JESD49B.01-2023 Procurement Standard for Semiconductor Die Products Including Known Good Die (KGD)

Professional Standard - Light Industry

QB/T 2475-2000 Blade Cored Door Lock

RO-ASRO

STAS R 11682-1983 Mrtals chip removing process RESTS, CENTRING ELEMENTS CLAMPINGS Symbolization

IPC - Association Connecting Electronics Industries

IPC J-STD-012 CD-1996 Implementation of Flip Chip and Chip Scale Technology
IPC J-STD-013 CD-1996 Implementation of Flip Chip and Chip Scale Technology
IPC J-STD-012-1996 Implementation of Flip Chip and Chip Scale Technology
IPC/EIA J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps
IPC/EIA J-STD-028 CD-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps
IPC J-STD-027 CD-2003 Mechanical Outline Standard for Flip Chip and Chip Size Configurations

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

JEDEC JESD51-4-1997 Thermal Test Chip Guideline (Wire Bond Type Chip) Errata - September 1997; Replaces JEP129: 1997
JEDEC JESD22-B109B-2014 Flip Chip Tensile Pull
JEDEC JESD22-B109A-2009 Flip Chip Tensile Pull
JEDEC JESD22-B109-2002 Flip Chip Tensile Pull
JEDEC JESD51-50-2012 Overview of Methodologies for the Thermal Measurement of Single- and Multi-Chip, Single- and Multi-PN-Junction Light-Emitting Diodes (LEDs)

Indonesia Standards

SNI 01-4304-1996 Pineapples chips
SNI 01-4306-1996 Sweet potatoes chips

SCC

MIL MIL-PRF-83446/21A-2006 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
MIL MIL-PRF-83446/32A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
MIL MIL-PRF-83446/29-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
BS PD ES 59008-5-3:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types-Minimally-packaged die
MIL MIL-PRF-83446/32-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
MIL MIL-PRF-83446/29A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
MIL MIL-PRF-83446/28-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, PHENOLIC CORE
MIL MIL-PRF-83446/23A-2006 COILS, RADIO FREQUENCY, CHIP, FIXED, PHENOLIC CORE
MIL MIL-PRF-83446/31A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, PHENOLIC CORE
MIL MIL-PRF-83446/31-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, PHENOLIC CORE
BS PD IEC/TR 62258-4:2007 Semiconductor die products-Questionnaire for die users and suppliers
MIL MIL-PRF-83446/30A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
MIL MIL-PRF-83446/33A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
BS PD 6598:1996 Measurement techniques for the characterization of the European mini test chip
MIL MIL-PRF-83446/22A-2006 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
MIL MIL-PRF-83446/30-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
MIL MIL-PRF-83446/33-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE

Defense Logistics Agency

DLA MIL-PRF-83446/24 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Iron Core
DLA MIL-PRF-83446/21 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Iron Core
DLA MIL-PRF-83446/20 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Phenolic Core
DLA MIL-PRF-83446/23 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Phenolic Core
DLA MIL-PRF-83446/25 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Ferrite Core
DLA MIL-PRF-83446/30 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Ferrite Core
DLA MIL-PRF-83446/22 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Ferrite Core

(U.S.) Ford Automotive Standards

FORD FLTM BI 007-1-2001 CHIP RESISTANCE TEST FOR PAINTED PANELS
FORD FLTM EU-BI 007-1-2001 CHIP RESISTANCE TEST FOR PAINTED PANELS

HU-MSZT

MSZ 14593/4-1979 Dissolving cores for road vehicles, tablet dissolving cores (dissolving tablets)

Danish Standards Foundation

DS/ES 59008-5-1:2001 Data requirements for semiconductor die - Part 5-1: Particular requirements and recommendations for die types - Bare die

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

IPC J-STD-027-2003 Mechanical Outline Standard for Flip Chip and Chip Size Configurations
IPC SMC-WP-003-1993 Chip Mounting Technology (CMT)

German Institute for Standardization

DIN 15531:1976 Cores for motion-picture and magnetic film

CENELEC - European Committee for Electrotechnical Standardization

ES 59008-5-1-2001 Data Requirements for Semiconductor Die Part 5-1: Particular Requirements and Recommendations for Die Types - Bare Die
ES 59008-5-3-2001 Data Requirements for Semiconductor Die - Part 5-3: Particular Requirements and Recommendations for Die Types - Minimally-Packaged Die

IEC - International Electrotechnical Commission

PAS 62084-1998 Implementation of Flip Chip and Chip Scale Technology (Edition 1.0; No Replacement)

Society of Automotive Engineers (SAE)

SAE ARP843-1995 CHIP DETECTOR, ELECTRICAL CONNECTION, REMOTE INDICATING
SAE ARP843B-2021 Chip Detector, Electrical Connection, Remote Indicating
SAE ARP843A-2012 Chip Detector, Electrical Connection, Remote Indicating

British Standards Institution (BSI)

PD 6598-1996 Measurement techniques for the characterization of the European mini test chip
BS PD CLC/TR 62258-4:2013 Semiconductor die products. Questionnaire for die users and suppliers