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Database: 365,228(8 Aug 2026)
  1. HOME
  2. Standards for tablet core

tablet core

tablet core, Total:296 items.

The international standard classification for "tablet core" includes: Motion picture films. Cartridges , Laboratory medicine , Photographic paper, films and cartridges , Integrated circuits. Microelectronics , Biology. Botany. Zoology , Measurement of force, weight and pressure , Semiconducting materials , Optoelectronics. Laser equipment , Pesticides and other agrochemicals , Insecticides , Identification cards and related devices , Health care technology (Vocabularies) , Character sets and information coding , Products of the chemical industry in general .

The Chinese standard classification for "tablet core" includes: Photosensitive material , Medical apparatus and devices in general , Basic standards and general methods for photosensitive material , Microcircuit in general , Basic Subject in general , Material and component for instrument and meter , Compound semiconductor material , Microwave and millimeter wave diode and triode , Pesticide , Data medium , Daily-use hardware , Projector and slide projector , Data encryption , Semiconductor integrated circuit , Dye .

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

Group Standards of the People's Republic of China

Professional Standard - Medicine

Professional Standard - Light Industry

Taiwan Provincial Standard of the People's Republic of China

  • CNS 13625-1995 Product Specifications for Round Polished Monocrystalline Gallium Arsenide Wafers
  • CNS 13808-1997 Epitaxial Wafers for Light Emitting Diodes
  • CNS 13622-1997 Fixed chip resistor for use in electronic equipment

未注明发布机构

Professional Standard - Machinery

Professional Standard - Password Professional Standards

Professional Standard - Electron

  • SJ/T 10416-1993 Generic Apecification for chip for semiconductor discrete devices
  • SJ 21210-2016 Technological verification procedures for flip chip bonder
  • SJ/T 11486-2015 Technical specification for low power light. emitting diode chips
  • SJ/T 11734-2019 Detailed Specification of Chip Scale Package (CSP) LED Blank

Fujian Provincial Standard of the People's Republic of China

Professional Standard - Agriculture

Shanxi Provincial Standard of the People's Republic of China

  • DB1404/T 20-2021 Classification of UVC LED Chip Specifications for Disinfection

Professional Standard - Public Safety Standards

  • GA/T 1171-2014 Examination methods for similarity comparison of integrated circuit chips

Professional Standard - Chemical Industry

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

German Institute for Standardization

Indonesia Standards

British Standards Institution (BSI)

  • BS PD ES 59008-5-3:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types-Minimally-packaged die
  • PAS 62084-1998 Implementation of Flip Chip and Chip Scale Technology (Edition 1.0; No Replacement)
  • BS PD IEC/TR 62258-4:2007 Semiconductor die products-Questionnaire for die users and suppliers
  • BS PD CLC/TR 62258-4:2013 Semiconductor die products. Questionnaire for die users and suppliers
  • BS ISO 1039:1996 Cinematography. Cores for motion-picture and magnetic film rolls. Dimensions
  • BS ISO 1039:1995 Cinematography - Cores for motion-picture and magnetic film rolls - Dimensions
  • 05/30127455 DC IEC 62258-4 ED.1. Semiconductor die products. Part 4. Questionnaire for die users and suppliers
  • PD ES 59008-5-3:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types. Minimally-packaged die
  • BS PD ES 59008-2:1999 Data requirements for semiconductor die-Vocabulary
  • PD ES 59008-5-2:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types. Bare die with added connection structures
  • BS 5550-5.12.1:1990 Cinematography. Common to more than one film gauge. Miscellaneous-Specification for the dimensions of cores for motion-picture and magnetic film rolls

International Organization for Standardization (ISO)

  • ISO 1039:1995 Cinematography - Cores for motion-picture and magnetic film rolls - Dimensions
  • ISO 1039:1988 Cinematography; cores for motion-picture and magnetic film rolls; dimensions
  • ISO 3641:1976 Cinematography; Motion-picture camera cartridge, 8 mm Type S Model II; Cartridge fit and take-up core drive; Dimensions and specifications
  • ISO 7943-3:1987 Photography; Overhead projectors; Part 3 : Film rolls, cores and winders; Dimensions
  • ISO 3654:1978 Title missing - Legacy paper document
  • ISO 3654:1983 Cinematography; Motion-picture camera cartridge, 8-mm Type S, Model I; Cartridge-camera interface and take-up core drive; Dimensions and specifications

Magyar Szabványügyi Testület

  • MSZ 14593/4-1979 Dissolving cores for road vehicles, tablet dissolving cores (dissolving tablets)
  • MNOSZ 14595-1952 Automotive disintegrable chips 24v50 and 80a

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

Danish Standards Foundation

  • DS/ES 59008-5-1:2001 Data requirements for semiconductor die - Part 5-1: Particular requirements and recommendations for die types - Bare die
  • DS/CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
  • DANSK DS/CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
  • DANSK DS/EN 59008-5-2:2001 Data requirements for semiconductor die - Part 5-2: Particular requirements and recommendations for die types - Bare die with added connection structures

European Committee for Electrotechnical Standardization（CENELEC）

  • ES 59008-5-1-2001 Data Requirements for Semiconductor Die Part 5-1: Particular Requirements and Recommendations for Die Types - Bare Die
  • ES 59008-5-3-2001 Data Requirements for Semiconductor Die - Part 5-3: Particular Requirements and Recommendations for Die Types - Minimally-Packaged Die
  • CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
  • CLC/TR 62258-4-2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers

Military Standards (MIL-STD)

Defense Logistics Agency

(U.S.) Telecommunications Industries Association

  • J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps (IPC/EIA J-STD-028)
  • TIA J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps IPC/EIA J-STD-028

American National Standards Institute （ANSI)

GCC Standardization Organization

U.S. Air Force

Czech Standards Institute (UNMZ)

The Directorate General of Specifications and Metrology (DGSM)

Comitato Elettrotecnico Italiano

Kingdom of Bahrain Testing and Metrology Directorate

Association Francaise de Normalisation

Thai Industrial Standards Institute (TISI)

Society of Motion Picture and Television Engineers (SMPTE)

  • SMPTE 197-2003 Motion-Picture Film (8-mm Type S) - 50-ft Model 1 Sound Camera Cartridge - Cartridge, Cartridge-Camera Interface, and Take-Up Core
  • SMPTE 159.1-2001 Motion-Picture Film (8-mm Type S) - Model 1 Camera Cartridge - Cartridge-Camera Interface and Take-up Core Drive

Association of German Mechanical Engineers

Electronic Industrial Alliance (U.S.)

  • EIA EIA-763-2002 Bare Die and Chip Scale Packages Taped in 8 mm & 12 mm Carrier Tape for Automatic Handling

Japanese Industrial Standards Committee (JISC)

  • JIS K 7556:1985 Dimensions of cores for motion-picture raw stock and magnetic sound recording films

International Electrotechnical Commission (IEC)

  • IEC TR 62258-4:2012 Produits de puces de semiconducteurs – Partie 4: Questionnaire destiné aux utilisateurs et fournisseurs de puces (Edition 2.0)
  • IECQ CS 033200-TW0004-2019 Anti-Sulfurated Thick Film Chip Resistors (RMS series standard)

Quality and Standards Authority of Ethiopia (QSAE)

  • ES 534-2000 Disintegration test of pharmaceutical tablets uncoated tablets
  • ES 535-2000 Disintegration test of pharmaceutical tablets and coated tablets

Swedish Institute for Standards

Gosstandart of Russia

Canadian Standards Association (CSA)

Institute of Electrical and Electronics Engineers (IEEE)

Korean Agency for Technology and Standards (KATS)

U.S. Military Regulations and Norms

Society of Automotive Engineers (SAE)

Electronic Components, Assemblies and Materials Association

  • IS-763-1998 Bare Die and Chip Scale Packages Taped in 8 mm & 12 mm Carrier Tape for Automatic Handling
  • EIA/IS-535BAAE-1998 Detail Specification for Low ESR Molded Tantalum Chip
  • 540AC00-1991 "Blank Detail Specification for Chip Carrier Sockets for Plastic Chip Carrier (PCC) Packages with ""J"" Type Leads for Use in Electronic Equipment"
  • 540AA00-1991 Blank Detail Specification for Chip Carrier Sockets for Leadless Type A@ B or D Chip Carriers for Use in Electronic Equipment
  • ECA EIA_IS-535BAAE-1998 Detail Specification for Low ESR Molded Tantalum Chip
  • ECA EIA/IS-535BAAE-1998 Detail Specification for Low ESR Molded Tantalum Chip

Electronic Components, Assemblies and Materials Association

  • ECA 540AC00-1991 Blank Detail Specification for Chip Carrier Sockets for Plastic Chip Carrier (PCC) Packages with"J" Type Leads for Use in Electronic Equipment

General Motors Corporation (GM)

Bureau of Indian Standards

  • IS/ISO 1039-1995 Cinematography - Cores For Motion-Picture And Magnetic Film Rolls Dimensions Adoption Of Iso 1039: 1995

Coated Tablets Requirements for Tablet Cores,Tablets do not disintegrate,tablet tablet,Coated Tablets,Chip friability,Effect of core moisture,tablet core,Terahertz Core Moxibustion Tablets,microfluidic chip

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