Coated Tablets Requirements for Tablet Cores

Coated Tablets Requirements for Tablet Cores, Total:62 items.

The international standard classification for "Coated Tablets Requirements for Tablet Cores" includes: Laboratory medicine , Integrated circuits. Microelectronics , Identification cards and related devices , Laboratory ware and related apparatus , Medical equipment , Photographic paper, films and cartridges , Diagnostic equipment , IT applications in transport and trade .

The Chinese standard classification for "Coated Tablets Requirements for Tablet Cores" includes: Basic Subject in general , Microcircuit in general , Data medium , Laboratory instrument and vacuum instrument in general , Medical laboratory equipment , Basic standards and general methods for photosensitive material , Medical apparatus and devices in general , Semiconductor integrated circuit , Computer application .

Group Standards of the People's Republic of China

T/QGCML 2533-2023 Stirring device for tablet coating
T/SHMHZQ 031-2022 Requirements for chip security of mobile terminals
T/CI 075-2022 Digital SOC chip for IPC (network camera) application
T/CTS 11-2023 Technical requirements of data security chip for data recorder of vehicle
T/CSAE 222-2021 Battery electric passenger vehicle automotive grade integrated circuit general requirements
T/GDRA 011-2019 Technical requirements for transformer core robot stacking
T/HBAEPI 001-2024 General technical requirements for microfluidic chips used for water quality detection
T/HBAS 081-2024 Visible light chip test system technical requirements
T/CIET 1103-2025 Liquid metal chip cooling technology requirements
T/SZROBOT 0005-2023 Technical requirements for AI-chip enhanced edge vision module
T/CESA 1248-2023 Technical requirement for chiplet interface bus
T/TAF 224-2024 General technical requirements for smart terminal security chips

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 34324-2017 Technical requirement of microarray biochip spotter
GB/T 35895-2018 Technical requirement of microarray hybridizer
GB/T 33805-2017 Technical requirement of laser confocal biochip scanner
GB/T 41407-2022 Technical requirement of nucleic acid isothermal amplification analyzer based on microfluidic chips
GB/T 44831-2024 General technical requirements of skin-on-a-chip
GB/T 6848-2008 Cinematography—Cores for motion-picture and magnetic film rolls—Dimensions
GB/T 35010.4-2018 Semiconductor die products—Part 4: Requirements for die users and suppliers
GB/T 35010.6-2018 Semiconductor die products—Part 6:Requirements for concerning thermal simulation
GB/T 35891-2018 Technical requirement of microarray washer
GB/T 37720-2019 Identification card—Chip technical requirements for financial IC card

未注明发布机构

JEDEC JESD49B.01-2023 Procurement Standard for Semiconductor Die Products Including Known Good Die (KGD)

Professional Standard - Public Safety Standards

GA/T 1171-2014 Examination methods for similarity comparison of integrated circuit chips

Professional Standard - Post and Telecommunication

YD/T 3975-2021 5G network slicing technical requi rements for End-to-End interworki ng based on IP bearer network
YD/T 3974-2021 5G network slicing technica I requirements for end- to- -end forward ing and control plane interworking based on SPN transport network

Professional Standard - Urban Construction

CJ/T 306-2009 Requirement for chip technology of contactless CPU card in construction case

British Standards Institution (BSI)

BS PD ES 59008-5-3:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types-Minimally-packaged die
PD ES 59008-5-3:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types. Minimally-packaged die
BS PD ES 59008-1:2000 Data requirements for semiconductor die-General requirements
BS PD CLC/TR 62258-4:2013 Semiconductor die products. Questionnaire for die users and suppliers
PD ES 59008-5-2:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types. Bare die with added connection structures
BS PD ES 59008-2:1999 Data requirements for semiconductor die-Vocabulary
BS PD ES 59008-4-3:2000 Data requirements for semiconductor die. Specific requirements and recommendations-Thermal
BS PD ES 59008-3:1999 Data requirements for semiconductor die-Mechanical, material and connectivity requirements
BS PD ES 59008-4-4:2000 Data requirements for semiconductor die. Specific requirements and recommendations-Electrical simulation
PD ES 59008-4-1:2001 Data requirements for semiconductor die. Specific requirements and recommendations. Test and quality
BS PD ES 59008-4-1:2001 Data requirements for semiconductor die. Specific requirements and recommendations-Test and quality
BS PD ES 59008-4-2:2001 Data requirements for semiconductor die. Specific requirements and recommendations-Handling and storage
BS EN ISO 14889:2009 Ophthalmic optics - Spectacle lenses - Fundamental requirements for uncut finished lenses
PAS 62084-1998 Implementation of Flip Chip and Chip Scale Technology (Edition 1.0; No Replacement)
BS PD ES 59008-5-1:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types-Bare die

CENELEC - European Committee for Electrotechnical Standardization

ES 59008-5-1-2001 Data Requirements for Semiconductor Die Part 5-1: Particular Requirements and Recommendations for Die Types - Bare Die
ES 59008-5-3-2001 Data Requirements for Semiconductor Die - Part 5-3: Particular Requirements and Recommendations for Die Types - Minimally-Packaged Die
ES 59008-4-3-1999 Data Requirements for Semiconductor Die Part 4-3: Specific Requirements and Recommendations - Thermal

Danish Standards Foundation

DS/ES 59008-5-1:2001 Data requirements for semiconductor die - Part 5-1: Particular requirements and recommendations for die types - Bare die
DANSK DS/EN 59008-5-2:2001 Data requirements for semiconductor die - Part 5-2: Particular requirements and recommendations for die types - Bare die with added connection structures

ET-QSAE

ES 535-2000 Disintegration test of pharmaceutical tablets and coated tablets
ES 534-2000 Disintegration test of pharmaceutical tablets uncoated tablets

ANSI - American National Standards Institute

IT4.23-2001 Photography (Processing) - Roll and Dental Films - Requirements for Film Clips and Hangers

American Society for Testing and Materials (ASTM)

ASTM F3159-15 Standard Safety Specification for Liquid Laundry Packets
ASTM F3159-15e1 Standard Safety Specification for Liquid Laundry Packets

IPC - Association Connecting Electronics Industries

IPC J-STD-012 CD-1996 Implementation of Flip Chip and Chip Scale Technology
IPC J-STD-013 CD-1996 Implementation of Flip Chip and Chip Scale Technology
IPC J-STD-012-1996 Implementation of Flip Chip and Chip Scale Technology
IPC J-STD-027 CD-2003 Mechanical Outline Standard for Flip Chip and Chip Size Configurations

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

IPC SM-784-1990 Guidelines for Chip-on- Board Technology Implementation
IPC J-STD-027-2003 Mechanical Outline Standard for Flip Chip and Chip Size Configurations

Ente Nazionale Italiano di Unificazione

UNI EN ISO 14889:2004 Ophthalmic optics - Spectacle lenses - Fundamental requirements for uncut finished lenses

German Institute for Standardization

DIN 15583-2:1983 Requirements on motion-picture films and sound records; motion-picture prints for optical projection

European Committee for Standardization (CEN)

prEN ISO 14889 rev Ophthalmic optics — Spectacle lenses — Fundamental requirements for uncut finished lenses

Magyar Szabványügyi Testület

MSZ 14593/4-1979 Dissolving cores for road vehicles, tablet dissolving cores (dissolving tablets)

Others: Coated Tablets Requirements for Tablet Cores