chip chip
chip chip, Total:27 items.
The international standard classification for "chip chip" includes: Health care technology (Vocabularies) , Optoelectronics. Laser equipment , Measurement of force, weight and pressure , Farming and forestry in general , Diagnostic equipment , Veterinary medicine , General methods of tests and analysis for food products .
The Chinese standard classification for "chip chip" includes: Medical apparatus and devices in general , Microwave and millimeter wave diode and triode , Material and component for instrument and meter , Plant quarantine, pest control , Basic standards and general methods , Mobile communication equipment .
Professional Standard - Medicine
- YY/T 0692-2008 Fundamental terms for biochips
Fujian Provincial Standard of the People's Republic of China
- DB35/T 1193-2011 Semiconductor LED chip
- DB35/T 1370-2013 Light-emitting diode chip point test method
Professional Standard - Electron
- SJ/T 10416-1993 Generic Apecification for chip for semiconductor discrete devices
- SJ/T 11486-2015 Technical specification for low power light. emitting diode chips
- SJ/T 11399-2009 Measurement methods for chips of light emitting diodes
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
- GB/T 28856-2012 Silicon piezoresistive pressure-sensitive chip
- GB/T 31730-2015 Detection of genetically modified components in rice―Membrane-based array method
- GB/T 29888-2013 General requirements of DNA array-based mycobacteria identification
- GB/T 28065-2011 Biochip detection of Ceratitis capitata(Wiedemann)
- GB/T 41522-2022 Method of DNA microarray for detection of three canine viruses
Guangdong Provincial Standard of the People's Republic of China
- DB44/T 1905-2016 UHF radio frequency identification (RFID) chip test method
Professional Standard - Post and Telecommunication
- YD/T 1886-2009 Security Requirements and Test Specification for SoC in Mobile Terminal
IPC - Association Connecting Electronics Industries
- IPC J-STD-013 CD-1996 Implementation of Flip Chip and Chip Scale Technology
- IPC J-STD-012 CD-1996 Implementation of Flip Chip and Chip Scale Technology
- IPC J-STD-012-1996 Implementation of Flip Chip and Chip Scale Technology
- IPC/EIA J-STD-028 CD-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps
- IPC/EIA J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps
- IPC J-STD-027 CD-2003 Mechanical Outline Standard for Flip Chip and Chip Size Configurations
Institute of Interconnecting and Packaging Electronic Circuits (IPC)
- IPC J-STD-027-2003 Mechanical Outline Standard for Flip Chip and Chip Size Configurations
- IPC J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps IPC/EIA J-STD-028
IEC - International Electrotechnical Commission
- PAS 62084-1998 Implementation of Flip Chip and Chip Scale Technology (Edition 1.0; No Replacement)
TIA - Telecommunications Industry Association
- J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps (IPC/EIA J-STD-028)
(U.S.) Telecommunications Industries Association
- TIA J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps IPC/EIA J-STD-028
SCC
- BS PD IEC/TR 62258-4:2007 Semiconductor die products-Questionnaire for die users and suppliers
Electronic Industrial Alliance (U.S.)
- EIA EIA-763-2002 Bare Die and Chip Scale Packages Taped in 8 mm & 12 mm Carrier Tape for Automatic Handling
ECIA - Electronic Components Industry Association
- IS-763-1998 Bare Die and Chip Scale Packages Taped in 8 mm & 12 mm Carrier Tape for Automatic Handling
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