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Database: 365,228(8 Aug 2026)

The future of chip technology

The future of chip technology, Total:110 items.

The international standard classification for "The future of chip technology" includes: Laboratory medicine , Biology. Botany. Zoology , Identification cards and related devices , Laboratory ware and related apparatus , Medical equipment , Optoelectronics. Laser equipment , Health care technology (Vocabularies) .

The Chinese standard classification for "The future of chip technology" includes: Basic Subject in general , Data medium , Laboratory instrument and vacuum instrument in general , Code, character set and character recognition , Medical laboratory equipment , Semiconductor emitting device , Medical apparatus and devices in general .


Professional Standard - Post and Telecommunication

  • YD/T 2328-2011 Fundamental characteristics and requirements of future packet based networks

Professional Standard - Electron

  • SJ/T 11486-2015 Technical specification for low power light. emitting diode chips
  • SJ 21210-2016 Technological verification procedures for flip chip bonder

Group Standards of the People's Republic of China

  • T/CIET 1163-2025 General technical requirements for digital workshops in future factories
  • T/CTS 11-2023 Technical requirements of data security chip for data recorder of vehicle
  • T/CSSTI 0001-2023 Classification and Coding of Technologies for Future Technology Monitoring Information Part 1: Biotechnology
  • T/CTS 11-2022 Data Security Chip Technology Requirements for Vehicle Recorders
  • T/SXS 004-2024 5G filter chip-level package technical specification
  • T/CEC 801.1-2023 Technical specification for safety chips for power applications Part 1: Terminology
  • T/TAF 224-2024 General technical requirements for smart terminal security chips
  • T/SHMHZQ 031-2022 Requirements for chip security of mobile terminals
  • T/CESA 1248-2023 Technical requirement for chiplet interface bus
  • T/HBAS 081-2024 Visible light chip test system technical requirements
  • T/CIET 1103-2025 Liquid metal chip cooling technology requirements
  • T/SLEIA 0004-2024 Technical specifications for long-term storage of integrated circuit chips
  • T/CSSTI 0002-2023 Classification and Coding of Technologies for Future Technology Monitoring Information Part2:Intelligent Manufacturing
  • T/CSB 0003-2024 General Terminology for Organ Chips
  • T/QGCML 733-2023 Technical specification for automatic chip programming machine
  • T/GDEIIA 17-2021 Microwave Oven Special Chip Integrated Design Standard
  • T/CSSTI 0003-2023 Classification and Coding of Technologies for Future Technology Monitoring Information Part 3: Artificial Intelligence
  • T/CIET 1151-2025 Technical Specifications for Ion Implantation Equipment for Chip Manufacturing

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

Sichuan Provincial Standard of the People's Republic of China

Professional Standard - Medicine

American Water Works Association (AWWA)

  • AWWA 51741 Leaping Into the Future With New Technology
  • AWWA 51562 Treatment Technology: Meeting Future Regulatory Requirements
  • AWWA CSC59674 Technology for Our Customer: Moving Toward the Future
  • AWWA ACE70692 Leaning into the Future: Using Information Technology to Support Workforce Development
  • AWWA ACE99504 Strategic Information Technology Planning: Our Future Depends on it
  • AWWA WSP57736 Preparing for the Future: Denver Water's Implementation of AMR Technology
  • AWWA ACE54402 Integration of Operational Support Technologies in Seattle: Current Experience and Vision for the Future

American Gear Manufacturers Association

  • 11FTM19-2011 Convoloid Gearing Technology - The Shape Of The Future

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

Society of Automotive Engineers (SAE)

  • SAE T-135-2018 Electric Flight Technology: The Unfolding of a New Future
  • SAE R-444-2015 Wireless Charging Technology and The Future of Electric Transportation
  • SAE T-114-2003 Fuel Cell Powered Vehicles Automotive Technology of the Future-Update
  • SAE EPR2024008-2024 Emergence of Quantum Computing Technologies in Automotive Applications: Opportunities and Future Use Cases

British Standards Institution (BSI)

American Concrete Institute

  • ACI SP-144-1994 Concrete Technology Past@ Present@ and Future (Out of Print)
  • ACI SP-254-2008 Nanotechnology of Concrete: Recent Developments and Future Perspectives

International Telecommunication Union (ITU)

The Institution of Engineering and Technology (IET)

  • MOB WIRL COMM-2004 Mobile and Wireless Communications: Key Technologies and Future Applications

International Organization for Standardization (ISO)

  • ISO 1039:1988 Cinematography; cores for motion-picture and magnetic film rolls; dimensions
  • ISO/IEC TR 15440:2016 Information technology - Future keyboards and other input devices and entry methods
  • ISO/IEC 10857:1994 Information technology - Microprocessor systems - Futurebus+ - Logical protocol specification
  • ISO/IEC 14536:1995 Information technology - Microprocessor systems - Futurebus+<(hoch)TM>, Profile M (military)
  • ISO 1039:1975 Cinematography — Cores for motion-picture and magnetic film rolls — Dimensions
  • ISO/IEC TR 29181-5:2014 Information technology - Future Network - Problem statement and requirements - Part 5: Security
  • ISO/IEC TR 29181-4:2013 Information technology.Future Network.Problem statement and requirements.Part 4: Mobility

German Institute for Standardization

Institute of Electrical and Electronics Engineers (IEEE)

  • IEEE 896.1-1994 Information technology - Microprocessor systems - Futurebus+ - Logical protocol specification

Czech Standards Institute (UNMZ)

  • CSN 64 6210-1989 Plastics. Unplasticized polyvinylchloride foils. Technical requirements

American National Standards Institute (ANSI)

  • ANSI/IEEE Std896.1:1994 Information technology - Microprocessor systems - futurebus+- logical protocol specification

Korean Agency for Technology and Standards (KATS)

  • KS X 5018-1997(2007) INFORMATION TECHNOLOGY - MICROPROCESSOR SYSTEMS - FUTUREBUS+ - LOGICAL PROTOCOL SPECIFICATION

Gosstandart of Russia

  • GOST R 58210-2018 Information technology. Future Network. Problem statement and requirements. Part 1. Overall aspects
  • GOST 30065-1993 Hubs for films and magnetic tapes. Specifications

Defense Logistics Agency

The Directorate General of Specifications and Metrology (DGSM)

Canadian Standards Association (CSA)

GCC Standardization Organization

European Telecommunications Standards Institute (ETSI)

  • ETSI TS 103 194 V1.1.1 (2014-10)-2014 Network Technologies (NTECH); Autonomic network engineering for the self-managing Future Internet (AFI); Scenarios, Use Cases and Requirements for Autonomic/Self-Managing Future Internet

Danish Standards Foundation