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The main technology of the chip

The main technology of the chip, Total:34 items.

The international standard classification for "The main technology of the chip" includes: Identification cards and related devices , Medical equipment , Laboratory ware and related apparatus , Diagnostic equipment , IT applications in transport and trade , Character sets and information coding .

The Chinese standard classification for "The main technology of the chip" includes: Data medium , Code, character set and character recognition , Medical laboratory equipment , Laboratory instrument and vacuum instrument in general , Medical apparatus and devices in general , Computer application , Data encryption .


Group Standards of the People's Republic of China

  • T/SZROBOT 0005-2023 Technical requirements for AI-chip enhanced edge vision module
  • T/CIET 718-2024 Technical specification of vehicle main control chip safety wake-up system
  • T/HBAEPI 001-2024 General technical requirements for microfluidic chips used for water quality detection
  • T/SHMHZQ 031-2022 Requirements for chip security of mobile terminals
  • T/GDRA 011-2019 Technical requirements for transformer core robot stacking
  • T/CESA 1248-2023 Technical requirement for chiplet interface bus
  • T/CTS 11-2023 Technical requirements of data security chip for data recorder of vehicle
  • T/TAF 224-2024 General technical requirements for smart terminal security chips

国家市场监督管理总局、中国国家标准化管理委员会

  • GB/T 41407-2022 Technical requirement of nucleic acid isothermal amplification analyzer based on microfluidic chips
  • GB/T 37720-2019 Identification card—Chip technical requirements for financial IC card
  • GB/T 37045-2018 Information technology—Biometrics—Fingerprint processing chip technical requirements

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会

Professional Standard - Urban Construction

  • CJ/T 306-2009 Requirement for chip technology of contactless CPU card in construction case

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

  • GB/T 22186-2016 Information security techniques―Security technical requirements for IC card chip with CPU

Professional Standard - Electron

  • SJ/T 11486-2015 Technical specification for low power light. emitting diode chips

工业和信息化部

  • YD/T 1886-2015 Security requirements and test specification for system on chip in mobile terminal

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

SCC

  • BS PD ES 59008-5-3:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types-Minimally-packaged die

CENELEC - European Committee for Electrotechnical Standardization

  • ES 59008-5-3-2001 Data Requirements for Semiconductor Die - Part 5-3: Particular Requirements and Recommendations for Die Types - Minimally-Packaged Die

IPC - Association Connecting Electronics Industries

British Standards Institution (BSI)

  • PD ES 59008-5-3:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types. Minimally-packaged die

GOST

IEC - International Electrotechnical Commission

  • PAS 62084-1998 Implementation of Flip Chip and Chip Scale Technology (Edition 1.0; No Replacement)

Association Francaise de Normalisation

RU-GOST R

  • GOST R 56828.11-2015 Best available techniques. Guidelines for the development of main environmental issues description paragraph in the information and technical reference book on the best available techniques