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Database: 365,228(8 Aug 2026)

Semiconductor chip geometry measurement

Semiconductor chip geometry measurement, Total:14 items.

The international standard classification for "Semiconductor chip geometry measurement" includes: .

The Chinese standard classification for "Semiconductor chip geometry measurement" includes: .


German Institute for Standardization

  • DIN 50441-2:1998 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 2: Testing of edge profile
  • DIN 50441-1:1996 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 1: Thickness and thickness variation
  • DIN 50441-5:2001 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 5: Terms of shape and flatness deviation
  • DIN 50441-4:1999 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 4: Slice diameter, diamter variation, flat diameter, flat length, flat depth
  • DIN 50441-3:1985 Testing of materials for semiconductor technology; measurement of the geometric dimensions of semiconductor slices; determination of flatness deviation of polished slices by means of the multiple beam interference
  • DIN V VDE V 0126-18-2-1:2007 Solar wafers - Part 2-1: Measuring the geometric dimensions of silicon wafers - Wafer thickness
  • DIN EN 62258-1:2011-04*VDE 0884-101:2011-04 Semiconductor die products
  • DIN V VDE V 0126-18-2-1:2007-06 Solar wafers - Part 2-1: Measuring the geometric dimensions of silicon wafers - Wafer thickness

American National Standards Institute (ANSI)

Magyar Szabványügyi Testület

RO-ASRO

Society of Automotive Engineers (SAE)