Organic Semiconductor Materials

Organic Semiconductor Materials, Total:83 items.

The international standard classification for "Organic Semiconductor Materials" includes: Semiconducting materials , Testing of metals in general , Testing of metals .

The Chinese standard classification for "Organic Semiconductor Materials" includes: Technical management , Technical management , Semimetal and semiconductor material in general , Special electronic technology material , Metal physical property test method , Electrical insulating material and its products .

Professional Standard - Electron

SJ/T 10414-1993 Solder for semicoductor device
SJ/Z 3206.13-1989 General rules for emision spectrum analysis for semiconductor materials
SJ/T 10414-2015 Solder for semiconductor device
SJ/T 11775-2021 Multi-wire saw used for semiconductor materials
SJ/T 11067-1996 Commonly used terms for semiconductor photoelectric materials and pyroelectric materials in infrared detecting materials
SJ 20744-1999 General rule of infrared absorption spectral analysis for the impurity concentration in semiconductor materials

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 1550-1997 methods for measuring conductivity type of extrinsic semiconducting materials
GB/T 14264-2024 Terminology of semiconductor materials
GB/T 14264-1993 Semiconductor materials－Terms and definitions
GB/T 31469-2015 Semiconductor materials cutting fluid
GB/T 14264-2009 Semiconductor materials - Terms and definitions
GB/T 14844-1993 of semiconductor materials
GB/T 17410-2008(英文版) Organic heat transfer material heaters

Group Standards of the People's Republic of China

T/ICMTIA CM0035-2023 Sealing gasket for semiconductor silicon material process device
T/SHDSGY 135-2023 New Energy Semiconductor Silicon Wafer Material Technology
T/QGCML 4122-2024 Semiconductor chip sorting machine
T/CASME 798-2023 Specialized processing tools for semiconductor materials

国家市场监督管理总局、中国国家标准化管理委员会

GB/T 14844-2018 Designations of semiconductor materials
GB/T 1550-2018 Test methods for conductivity type of extrinsic semiconducting materials

Professional Standard - Machinery

JB/T 7622-1994 Organosilicone Lacquer Intended to Be Used in Power Semiconductor Device Production Process

British Standards Institution (BSI)

BS EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
BS EN IEC 60749-39:2022 Semiconductor devices. Mechanical and climatic test methods. Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
23/30450091 DC BS IEC 62899-203-2 Printed electronics. Materials - Semiconductor Ink- Space charge limited mobility measurement in printed organic semiconductive layers
BS IEC 62899-203:2024 Printed electronics - Materials. Semiconductor ink
20/30425840 DC BS EN IEC 60749-39. Semiconductor devices. Mechanical and climatic test methods. Part 39. Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
BS IEC 62899-203:2018 Printed electronics. Materials. Semiconductor ink
BS IEC 62951-7:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor
BS IEC 62951-5:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for thermal characteristics of flexible materials
BS EN 62047-18:2013 Semiconductor devices. Micro-electromechanical devices. Bend testing methods of thin film materials
BS EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
BS EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Axial fatigue testing methods of thin film materials
BS EN 62047-10:2011 Semiconductor devices. Micro-electromechanical devices. Micro-pillar compression test for MEMS materials
BS EN 62047-21:2014 Semiconductor devices. Micro-electromechanical devices. Test method for Poisson's ratio of thin film MEMS materials

SCC

CEI EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
DANSK DS/EN IEC 60749-39:2022 Semiconductor devices – Mechanical and climatic test methods – Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
CEI EN 60749-39:2007 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solublity in organic materials used for semiconductor components
DANSK DS/EN 60749-39:2006 Semiconductor devices – Mechanical and climatic test methods -- Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
DIN EN IEC 60749-39:2023 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2021); German version EN IEC 60749-39:2022
BS PD ES 59008-3:1999 Data requirements for semiconductor die-Mechanical, material and connectivity requirements
SPC GB/T 14844-2018 Designations of semiconductor materials (TEXT OF DOCUMENT IS IN CHINESE)
DIN EN IEC 60749-39 E:2021 Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 47/2652/CDV:2020); English version prEN IEC 60...

Korean Agency for Technology and Standards (KATS)

KS C IEC 60749-39-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C IEC 60749-39-2021 Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C IEC 60749-39-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C IEC 60749-39:2006 Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

International Electrotechnical Commission (IEC)

IEC 60749-39:2021 RLV Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC 60749-39:2021 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC 62899-203:2018 Printed electronics - Part 203: Materials - Semiconductor ink

HU-MSZT

MSZ 771/5-1979 Mechanical properties of semiconductor materials

RO-ASRO

STAS 6360-1974 SEMICONDUCTOR MATERIALS AND DEVICES Terminology
STAS 7146-1991 Organic dyes. Semi-wool dyes

Indonesia Standards

SNI 19-0429-1989 Guide for sampling of liquid and semi solid materials

German Institute for Standardization

DIN EN 60749-39:2007-01 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006); German version EN 60749-39:2006 / Note: To be r...
DIN EN 60749-39:2007 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006); German version EN 60749-39:2006
DIN EN IEC 60749-39:2021-07 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 47/2652/CDV:2020); English version prEN IEC 60749-39:2020 / Not...
DIN 50447:1995 Testing of materials for semiconductor technology - Contactless determination of the electrical sheet resistance of semiconductor layers with the eddy-current method
DIN 50442-1:1981 Testing of semi-conductive inorganic materials; determination of the surface structure of circular monocrystalline semi-conductive slices; as-cut and lapped slices
DIN 50445:1992 Testing of materials for semiconductor technology; contactless determination of the electrical resistivity of semiconductor slices with the eddy current method; homogeneously doped semiconductor wafers
DIN 50441-1:1996 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 1: Thickness and thickness variation
DIN 50448:1998 Testing of materials for semiconductor technology - Contactless determination of the electrical resistivity of semi-insulating semi-conductor slices using a capacitive probe
DIN EN IEC 60749-39:2023-10 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2021); German version EN IEC 60749-39:2022 / Note: DIN...

GSO

GSO IEC 60749-39:2014 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
OS GSO IEC 60749-39:2014 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

Association Francaise de Normalisation

NF C96-022-39*NF EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Part 39 : measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
NF C96-022-39*NF EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39 : measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
NF EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39: measurement of moisture diffusivity and water solubility in organic materials used in semiconductor components

Danish Standards Foundation

DS/EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods -- Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

ES-UNE

UNE-EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (Endorsed by Asociación Española de Normalización in March of 2022.)
UNE-EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods -- Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006). (Endorsed by AENOR in November of 2006.)

European Committee for Electrotechnical Standardization（CENELEC）

EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

Lithuanian Standards Office

LST EN 60749-39-2006 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006)

Building Officials and Code Administrators International(U.S.)

BOCA ARTICLE 18 NFPC COMM-1990 Semiconductor Fabrication Facilities Using Hazardous Production Materials
BOCA ARTICLE 18 NFPC-1990 Semiconductor Fabrication Facilities Using Hazardous Production Materials Eighth Edition

AT-OVE/ON

OVE EN IEC 60749-39:2020 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 47/2652/CDV) (english version)

Society of Automotive Engineers (SAE)

SAE AMS3682D-1992 COATING MATERIAL, ELECTRICALLY CONDUCTIVE Silver - Organic Resin
SAE AMS3682C-1991 COATING MATERIAL, ELECTRICALLY CONDUCTIVE Silver - Organic Resin
SAE AMS3682B-1977 COATING MATERIAL, ELECTRICALLY CONDUCTIVE Silver - Organic Resin

SAE - SAE International

SAE AMS3682E-1995 COATING MATERIAL@ ELECTRICALLY CONDUCTIVE SILVER - ORGANIC RESIN

IX-IX-IEC

IEC 62899-203:2024 RLV Printed electronics - Part 203: Materials - Semiconductor ink

IEC - International Electrotechnical Commission

IEC 62951-7:2019 Semiconductor devices – Flexible and stretchable semiconductor devices – Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor (Edition 1.0)

RU-GOST R

GOST 16922-1971 Organic dye-stuffs, intermediates, auxiliary compounds for textiles. Test methods