Organic Semiconductor Micro

Organic Semiconductor Micro, Total:200 items.

The international standard classification for "Organic Semiconductor Micro" includes: Other semiconductor devices , Integrated circuits. Microelectronics .

The Chinese standard classification for "Organic Semiconductor Micro" includes: Microcircuit in general , Semiconductor integrated circuit , Semiconductor discrete devices in general , Electrical insulating material and its products .

Group Standards of the People's Republic of China

T/QGCML 4122-2024 Semiconductor chip sorting machine
T/EJCCCSE 362-2025 Iron core linear motors for semiconductor component testing equipment
T/CIET 765-2024 Thermally conductive silicone gel for semiconductor chip packaging

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 4937.39-2025 Semiconductor Devices - Mechanical and Climatic Test Methods - Part 39: Measurement of Moisture Diffusion Rate and Water Solubility of Organic Materials Used in Semiconductor Devices
GB/T 42836-2023 Microwave semiconductor integrated circuits—Frequency mixer
GB/T 32817-2016 Semiconductor devices - Micro-electromechanical devices - Generic specification for MEMS
GB/T 42709.19-2023 Semiconductor devices―Micro-electromechanical devices―Part 19:Electronic compasses
GB/T 41853-2022 Semiconductor devices—Micro-electromechanical devices—Wafer to wafer bonding strength measurement
GB/T 42837-2023 Microwave semiconductor integrated circuits—Amplifier
GB/T 42709.5-2023 Semiconductor devices—Micro-electromechanical devices—Part 5: RF MEMS switches

Professional Standard - Machinery

JB/T 7622-1994 Organosilicone Lacquer Intended to Be Used in Power Semiconductor Device Production Process

Jiangsu Provincial Standard of the People's Republic of China

DB32/T 4894-2024 MEMS semiconductor gas sensor performance testing method

British Standards Institution (BSI)

BS EN 62047-5:2011 Semiconductor devices. Micro-electromechanical devices. RF MEMS switches
BS EN 62047-20:2014 Semiconductor devices. Micro-electromechanical devices. Gyroscopes
BS EN 62047-4:2010 Semiconductor devices. Micro-electromechanical devices. Generic specification for MEMS
BS EN 62047-19:2013 Semiconductor devices. Micro-electromechanical devices. Electronic compasses
BS IEC 62951-7:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor
BS EN 62047-1:2016 Semiconductor devices. Micro-electromechanical devices. Terms and definitions
BS EN 62047-1:2006 Semiconductor devices - Micro-electromechanical devices - Terms and definitions
BS IEC 62047-53:2025 Semiconductor devices. Micro-electromechanical devices - MEMS electrothermal transfer device
12/30256751 DC BS EN 62047-20. Semiconductor devices. Micro-electromechanical devices. Gyroscopes
BS IEC 62047-41:2021 Semiconductor devices. Micro-electromechanical devices. RF MEMS circulators and isolators
BS EN 62047-5:2011(2012) Semiconductor devices — Micro - electromechanical devices Part 5 : RF MEMS switches
BS EN 62047-10:2011 Semiconductor devices. Micro-electromechanical devices. Micro-pillar compression test for MEMS materials
BS IEC 62047-40:2021 Semiconductor devices. Micro-electromechanical devices. Test methods of micro-electromechanical inertial shock switch threshold
BS IEC 62899-203-2:2025 Printed electronics - Materials. Semiconductor ink. Space charge limited mobility measurement in printed organic semiconductive layers
BS EN 60747-16-4:2004+A2:2017 Semiconductor devices - Microwave integrated circuits. Switches
BS IEC 62047-33:2019 Semiconductor devices. Micro-electromechanical devices - MEMS piezoresistive pressure-sensitive device
23/30450091 DC BS IEC 62899-203-2 Printed electronics. Materials - Semiconductor Ink- Space charge limited mobility measurement in printed organic semiconductive layers
BS EN 60747-16-4:2004+A1:2011 Semiconductor devices. Microwave integrated circuits. Switches
BS EN 60747-16-3:2002+A2:2017 Semiconductor devices - Microwave integrated circuits. Frequency converters
BS EN IEC 60747-16-6:2019 Semiconductor devices. Microwave integrated circuits. Frequency multipliers
BS EN 60747-16-5:2013 Semiconductor devices. Microwave integrated circuits. Oscillators
BS EN IEC 60747-16-9:2024 Semiconductor devices - Microwave integrated circuits. Phase shifters
BS EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
BS EN 60747-16-1:2002+A2:2017 Semiconductor devices - Microwave integrated circuits. Amplifiers
BS EN IEC 60749-39:2022 Semiconductor devices. Mechanical and climatic test methods. Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
BS EN 62047-22:2014 Semiconductor devices. Micro-electromechanical devices. Electromechanical tensile test method for conductive thin films on flexible substrates
BS EN 60747-16-1:2002+A1:2007 Semiconductor devices — Part 16-1: Microwave integrated circuits — Amplifiers
BS IEC 62047-29:2017 Semiconductor devices. Micro-electromechanical devices - Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
BS EN IEC 62435-7:2021 Electronic components. Long-term storage of electronic semiconductor devices. Micro-electromechanical devices
BS EN 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Thin film standard test piece for tensile testing
BS EN 60747-16-5:2013+A1:2020 Semiconductor devices - Microwave integrated circuits. Oscillators
BS EN 62047-18:2013 Semiconductor devices. Micro-electromechanical devices. Bend testing methods of thin film materials
BS EN 60747-16-3:2002 Discrete semiconductor devices and integrated circuits - Microwave integrated circuits - Frequency converters
BS EN 62047-26:2016 Semiconductor devices. Micro-electromechanical devices. Description and measurement methods for micro trench and needle structures
07/30172155 DC BS EN 62047-5. Semiconductor devices. Micro-electromechanical devices. Part 5. RF MEMS switches
BS IEC 60747-4:2007+A1:2017 Semiconductor devices. Discrete devices - Microwave diodes and transistors
11/30249344 DC BS EN 62047-19. Semiconductor devices. Micro-electromechanical devices. Part 19. Electronic compasses
BS EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
BS IEC 60747-4:2008 Semiconductor devices - Discrete devices - Microwave diodes and transistors
BS IEC 62047-30:2017 Semiconductor devices. Micro-electromechanical devices - Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
BS IEC 60747-14-5:2010 Semiconductor devices - Semiconductor sensors - PN-junction semiconductor temperature sensor
BS EN 60747-16-4:2004 Discrete semiconductor devices - Microwave integrated circuits - Switches
BS IEC 60747-4:2007 Semiconductor devices. Discrete devices. Microwave diodes and transistors
BS EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Axial fatigue testing methods of thin film materials
10/30211442 DC BS EN 62047-10. Semiconductor devices. Micro electromechanical devices. Part 10. Micro-pillar compression test for MEMS materials
BS IEC 62047-42:2022 Semiconductor devices. Micro-electromechanical devices - Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever

GCC Standardization Organization

GSO IEC 62047-5:2014 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
GSO IEC 62047-20:2021 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
GSO IEC 62047-4:2013 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
GSO IEC 62047-19:2021 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
GSO IEC 62047-1:2014 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
GSO IEC 62047-10:2014 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
GSO IEC 60747-15:2025 Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
GSO IEC 62047-40:2023 Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold
GSO IEC 62047-9:2014 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
GSO IEC 62047-41:2023 Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators
GSO IEC 60749-39:2014 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

Comitato Elettrotecnico Italiano

CEI EN 62047-20:2016 Semiconductor devices - Micro-electromechanical devices Part 20: Gyroscopes
CEI EN 62047-19:2014 Semiconductor devices - Micro-electromechanical devices Part 19: Electronic compasses
CEI EN 62047-5:2015 Semiconductor devices - Micro-electromechanical devices Part 5: RF MEMS switches
CEI EN 62047-4:2011 Semiconductor devices - Micro-electromechanical devices Part 4: Generic specification for MEMS
CEI EN 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
CEI EN 62047-10:2012 Semiconductor devices - Microelectromechanical devices Part 10: Micro-pillar compression test for MEMS materials
CEI EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

Kingdom of Bahrain Testing and Metrology Directorate

BH GSO IEC 62047-20:2022 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
BH GSO IEC 62047-19:2022 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
BH GSO IEC 62047-5:2016 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
BH GSO IEC 62047-10:2016 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
BH GSO IEC 62047-4:2016 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
BH GSO IEC 62047-40:2023 Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold
BH GSO IEC 62047-41:2023 Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators

European Committee for Electrotechnical Standardization（CENELEC）

EN 62047-20:2014 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
EN 62047-5:2012 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
EN 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
EN 62047-19:2013 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
EN 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
EN 62047-4:2010 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

Spanish Association for Standardization (UNE)

UNE-EN 62047-20:2014 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes (Endorsed by AENOR in November of 2014.)
UNE-EN 62047-19:2013 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (Endorsed by AENOR in November of 2013.)
UNE-EN 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches (Endorsed by AENOR in November of 2011.)
UNE-EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (Endorsed by AENOR in December of 2011.)
UNE-EN 62047-4:2010 Semiconductor devices - Micro-electromechanical devices -- Part 4: Generic specification for MEMS (Endorsed by AENOR in February of 2011.)
UNE-EN 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (Endorsed by AENOR in May of 2016.)

Swedish Institute for Standards

SS-EN 62047-20:2014 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
SS-EN 62047-5:2012 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
SS-EN 62047-10:2012 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
SS-EN 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
SS-EN 62047-4:2011 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specifications for MEMS
SS-EN 62047-19:2013 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses

Danish Standards Foundation

DANSK DS/EN 62047-20:2014 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
DS/EN 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
DANSK DS/EN 62047-19:2013 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
DS/EN 62047-19:2013 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
DS/EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
DANSK DS/EN 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
DS/EN 62047-4:2010 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
DS/EN 62047-1:2006 Semiconductor devices – Micro-electromechanical devices – Part 1: Terms and definitions
DANSK DS/EN 62047-4:2010 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
DANSK DS/EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
DANSK DS/EN 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
DANSK DS/EN IEC 60749-39:2022 Semiconductor devices – Mechanical and climatic test methods – Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
DANSK DS/IEC 62899-203-2:2025 Printed electronics – Part 203-2: Materials – Semiconductor ink – Space charge limited mobility measurement in printed organic semiconductive layers

International Electrotechnical Commission (IEC)

IEC 62047-20:2014 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
IEC 62047-4:2008 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specifications for MEMS
IEC 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
IEC 62951-7:2019 Semiconductor devices – Flexible and stretchable semiconductor devices – Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor (Edition 1.0)
IEC 62047-4:2025 PRV Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
IEC 62047-4:2026 RLV Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
IEC 62047-5:2011/COR1:2012 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches; Corrigendum 1
IEC 62047-4:2026 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
IEC 62047-1:2005 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
IEC 62047-19:2013 Dispositifs à semiconducteurs – Dispositifs microélectromécaniques – Partie 19: Compas électroniques (Edition 1.0)
IEC 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
IEC 62047-10:2011 Semiconductor devices – Micro-electromechanical devices – Part 10: Micro-pillar compression test for MEMS materials (Edition 1.0)
IEC 62047-53:2025 PRV Semiconductor devices - Micro-electromechanical devices - Part 53: MEMS electrothermal transfer device
IEC 62047-33:2019 Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device
IEC 62047-40:2021 Semiconductor devices - Micro-electromechanical devices - Part 40: Test methods of micro-electromechanical inertial shock switch threshold
IEC 62047-50:2025 PRV Semiconductor devices - Micro-electromechanical devices - Part 50: MEMS capacitive microphones
IEC 62047-53:2025 Semiconductor devices - Micro-electromechanical devices - Part 53: MEMS electrothermal transfer device
IEC 62047-10:2011/COR1:2012 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials; Corrigendum 1
IEC 60749-39:2021 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
IEC 60749-39:2021 RLV Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC 62899-203-2:2025 Printed electronics - Part 203-2: Materials - Semiconductor ink - Space charge limited mobility measurement in printed organic semiconductive layers
IEC 62047-9:2011/COR1:2012 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

Association Francaise de Normalisation

NF C96-050-20*NF EN 62047-20:2014 Semiconductor devices - Micro-electromechanical devices - Part 20 : gyroscopes
NF EN 62047-20:2014 Semiconductor devices - Microelectromechanical devices - Part 20: Gyroscopes
NF EN 62047-12:2012 Semiconductor devices - Microelectromechanical devices - Part 12: method of testing bending fatigue of thin-film materials using resonance vibrations of microelectromechanical system structures (M...
NF EN 62047-19:2014 Semiconductor devices - Microelectromechanical devices - Part 19: Electronic compasses
NF EN 62047-5:2012 Semiconductor devices - Microelectromechanical devices - Part 5: MEMS-RF switches
NF C96-050-4*NF EN 62047-4:2011 Semiconductor devices - Micro-electromechanical devices - Part 4 : generic specifications for MEMS.
NF C96-050-5*NF EN 62047-5:2012 Semiconductor devices - Micro-electromechanical devices - Part 5 : RF MEMS switches.
NF EN 62047-1:2016 Semiconductor devices - Microelectromechanical devices - Part 1: Terms and definitions
NF C96-050-19*NF EN 62047-19:2014 Semiconductor devices - Micro-electromechanical devices - Part 19 : electronic compasses
NF EN 62047-4:2011 Semiconductor devices - Microelectromechanical devices - Part 4: Generic specification for MEMS
NF C96-050-1:2006 Semiconductor devices - Micro- electromechanical devices - Part 1 : terms and definitions.
NF C96-050-10*NF EN 62047-10:2012 Semiconductor devices - Micro-electromechanical devices - Part 10: micro-pillar compression test for MEMS materials
NF C96-050-1*NF EN 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1 : terms and definitions
NF EN 62047-26:2016 Semiconductor devices - Microelectromechanical devices - Part 26: description and measurement methods for microtrench and microneedle structures
NF C96-022-39:2006 Semiconductor devices - Mechanical and climatic test methods - Part 39 : measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
NF C96-050-9*NF EN 62047-9:2012 Semiconductor devices - Micro-electromechanical devices - Part 9 : wafer to wafer bonding strength measurement for MEMS.
NF C96-022-39*NF EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Part 39 : measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

German Institute for Standardization

DIN EN 62047-19:2014-04 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (IEC 62047-19:2013); German version EN 62047-19:2013
DIN EN 62047-10:2012-03 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011
DIN EN 62047-5:2012-03 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches (IEC 62047-5:2011); German version EN 62047-5:2011
DIN EN 62047-20 E:2012-07 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
DIN EN 62047-4:2011-03 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010
DIN EN 62047-1:2016-12 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 62047-1:2016); German version EN 62047-1:2016 / Note: DIN EN 62047-1 (2006-10) remains valid alongside this standard until 2019-02-10.
DIN EN 62047-19 E:2011-11 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
DIN EN 62047-20:2015-04 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes (IEC 62047-20:2014); German version EN 62047-20:2014
DIN EN 62047-1 E:2014-05 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
DIN EN IEC 62969-2:2018-09*VDE 0884-69-2:2018-09 Semiconductor devices – Semiconductor interface for automotive vehicles
DIN EN IEC 62969-4:2019-03*VDE 0884-69-4:2019-03 Semiconductor devices – Semiconductor interface for automotive vehicles
DIN EN 62779-1:2017-01*VDE 0884-79-1:2017-01 Semiconductor devices – Semiconductor interface for human body communication
DIN EN IEC 62969-1:2018-08*VDE 0884-69-1:2018-08 Semiconductor devices – Semiconductor interface for automotive vehicles
DIN EN 62779-3:2017-03*VDE 0884-79-3:2017-03 Semiconductor devices – Semiconductor interface for human body communication
DIN EN IEC 62969-3:2018-12*VDE 0884-69-3:2018-12 Semiconductor devices – Semiconductor interface for automotive vehicles
DIN EN 62779-2:2017-01*VDE 0884-79-2:2017-01 Semiconductor devices – Semiconductor interface for human body communication

Japanese Industrial Standards Committee (JISC)

JIS C 5630-20:2015 Semiconductor devices -- Micro-electromechanical devices -- Part 20: Gyroscopes
JIS C 5630-19:2014 Semiconductor devices -- Micro-electromechanical devices -- Part 19: Electronic compasses
JIS C 5630-1:2008 Semiconductor devices -- Micro-electromechanical devices -- Part 1: Terms and definitions
JIS C 5630-1:2017 Semiconductor devices -- Micro-electromechanical devices -- Part 1: Terms and definitions
JIS K 0315:2022 Method for measuring reducing trace gases by semiconductor-type trace gas measuring equipment

The Directorate General of Specifications and Metrology (DGSM)

OS GSO IEC 62047-5:2014 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
OS GSO IEC 62047-4:2013 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
OS GSO IEC 62047-1:2014 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
OS GSO IEC 62047-10:2014 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
OS GSO IEC 60749-39:2014 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

Gosstandart of Russia

GOST R 71081-2023 Microwave semiconductor diodes. Parameters system

Defense Logistics Agency

DLA SMD-5962-94532-1994 MICROCIRCUIT, CMOS, 64-BIT MICROPROCESSOR
DLA SMD-5962-88568-1988 MICROCIRCUITS, DIGITAL, NMOS, SINGLE COMPONENT, 8-BIT MICROCOMPUTER, MONOLITHIC SILICON
DLA SMD-5962-96665 REV D-2005 MICROCIRCUIT, DIGITAL, RADIATION HARDENED, CMOS, HEX VOLTAGE LEVEL SHIFTER FOR TTL-TO-CMOS OR CMOS-TO- CMOS OPERATION, MONOLITHIC SILICON
DLA SMD-5962-83013 REV D-1995 MICROCIRCUIT, DIGITAL, CMOS, 8-BIT MICROPROCESSOR, CPU, MONOLITHIC SILICON
DLA SMD-5962-06208-2006 MICROCIRCUIT, DIGITAL, CMOS, DIGITAL SIGNAL PROCESSOR, MONOLITHIC SILICON

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

JEDEC JEB5-A-1970 Methods of Measurement for Semiconductor Logic Gating Microcircuits

Korean Agency for Technology and Standards (KATS)

KS C IEC 60749-39-2021 Semiconductor devices － Mechanical and climatic test methods － Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C IEC 60749-39-2006(2021) Semiconductor devices － Mechanical and climatic test methods － Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C IEC 60749-39-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C IEC 60747-4-1:2002 Semiconductor devices － Discrete devices － Part 4 － 1: Microwave diodes and transistors － Microwave field effect transistors － Blank detail specification
KS C IEC 60749-39:2006 Semiconductor devices － Mechanical and climatic test methods － Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

Standard Association of Australia （SAA）

AS C379.1:1970 Mechanical standardization of semiconductor devices - Preparation of drawings of semiconductor devices

Czech Standards Institute (UNMZ)

CSN 35 8737-1975 Semiconductor devices. Diodes. Measurement of differential rosistanoe
CSN 35 8701-1975 Terminology of semiconductors and semiconductor devices

Lithuanian Standards Office

LST EN 62047-5-2011 Semiconductor devices - Micro-electromechanical devices -- Part 5: RF MEMS switches (IEC 62047-5:2011)
LST EN 62047-10-2011 Semiconductor devices - Micro-electromechanical devices -- Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011)
LST EN 62047-4-2011 Semiconductor devices - Micro-electromechanical devices -- Part 4: Generic specification for MEMS (IEC 62047-4:2008)

Asociación Española de Normalización (AENOR)

AENOR UNE-EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

Others: Organic Semiconductor Photocatalysis,Organic Semiconductor Materials,Organic Semiconductor Micro,Microplates of various organic compounds,Oxidative Microcoulometric Method for Organohalogen Content in Petroleum Products,Photocatalysis of Organic Semiconductor Materials,Organic semiconductor single crystal,Solid Phase Microextraction of Volatile Organic Compounds,Properties of Organic Semiconductor Materials,organic semiconductor x-ray,Organic semiconductors are unstable,New Organic Micropollutants,Organic semiconductors are unstable,Absorption Spectra of Organic Semiconductors,organic semiconductor laser,organic single crystal semiconductor,Organic semiconductor single crystal,semiconductor microneedle