electrical semiconductor material

electrical semiconductor material, Total:121 items.

The international standard classification for "electrical semiconductor material" includes: Semiconducting materials , Testing of metals in general , Electrical wires and cables , Testing of metals .

The Chinese standard classification for "electrical semiconductor material" includes: Semimetal and semiconductor material in general , Special electronic technology material , Metal physical property test method , Cable and its accessory , Technical management , Technical management , Power semiconductor device and parts .

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 1550-1997 methods for measuring conductivity type of extrinsic semiconducting materials
GB/T 31469-2015 Semiconductor materials cutting fluid
GB/T 14844-1993 of semiconductor materials
GB/T 3048.3-2007 Test methods for electrical properties of electric cables and wires—Part 3:Test of volume resistivity of semi conducting rubbers and plastics
GB/T 3048.3-1994 Test methods for determining electrical properties of electric cables and wires-Measurement of volumeresistivity of semi-conducting rubbers and plastics
GB/T 4298-1984 The activation analysis method for the determination of elemental impurities in semiconductor silicon materials
GB/T 14264-2009 Semiconductor materials - Terms and definitions
GB/T 14264-1993 Semiconductor materials－Terms and definitions
GB/T 14264-2024 Terminology of semiconductor materials

国家市场监督管理总局、中国国家标准化管理委员会

GB/T 1550-2018 Test methods for conductivity type of extrinsic semiconducting materials
GB/T 14844-2018 Designations of semiconductor materials

Professional Standard - Electron

SJ/T 11067-1996 Commonly used terms for semiconductor photoelectric materials and pyroelectric materials in infrared detecting materials
SJ/Z 3206.13-1989 General rules for emision spectrum analysis for semiconductor materials
SJ/T 10414-1993 Solder for semicoductor device
SJ/T 10414-2015 Solder for semiconductor device
SJ/T 11775-2021 Multi-wire saw used for semiconductor materials
SJ 20744-1999 General rule of infrared absorption spectral analysis for the impurity concentration in semiconductor materials

Group Standards of the People's Republic of China

T/SHDSGY 135-2023 New Energy Semiconductor Silicon Wafer Material Technology
T/CASME 798-2023 Specialized processing tools for semiconductor materials
T/ICMTIA CM0035-2023 Sealing gasket for semiconductor silicon material process device
T/CNIA 0143-2022 Ultrapure Resin Vessels for Trace Impurity Analysis of Semiconductor Materials
T/SHPTA 071.2-2023 Semi-conductive rubber for high voltage cable accessories-Part 2:Semi-conductive rubber

Professional Standard - Machinery

JB/T 8175-1999 Outline dimensions of extruded heat sink for power semiconductor devices
JB/T 5781-1991 Sectioned Radiator for Power Semiconductor Devices. Technical Specification

Shaanxi Provincial Standard of the People's Republic of China

DB61/T 1250-2019 General Specification for Sic (Silicon Carbide) Material Semiconductor Discrete Devices

Military Standard of the People's Republic of China-General Armament Department

GJB 33/17-2011 Semiconductor optoelectronic device.Detail specification for type GO11 semiconductor photocoupler
GJB/Z 41.3-1993 Military semiconductor discrete device series spectrum semiconductor optoelectronic devices
GJB 33/16-2011 Semiconductor optoelectronic device.Detail specification for type 3DU32 semiconductor phototransistor

Guizhou Provincial Standard of the People's Republic of China

DB52/T 796-2013 Industrial semiconductor electric detonator
DB52/T 844-2013 Semiconductor Current Regulator

未注明发布机构

DIN SPEC 1994 E:2016-07 Testing of materials for semiconductor technology - Determination of anions in weak acids

机械电子工业部

JB 5781-1991 Technical conditions of profile radiators for power semiconductor devices

British Standards Institution (BSI)

BS IEC 62899-203:2024 Printed electronics - Materials. Semiconductor ink
BS IEC 62899-203:2018 Printed electronics. Materials. Semiconductor ink
BS IEC 62951-5:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for thermal characteristics of flexible materials
BS IEC 62951-4:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
BS IEC 60747-5-4:2022 Semiconductor devices - Optoelectronic devices. Semiconductor lasers
23/30450091 DC BS IEC 62899-203-2 Printed electronics. Materials - Semiconductor Ink- Space charge limited mobility measurement in printed organic semiconductive layers
BS IEC 60747-14-2:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
BS IEC 60747-14-2:2000 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
BS EN 62047-18:2013 Semiconductor devices. Micro-electromechanical devices. Bend testing methods of thin film materials
21/30428334 DC BS EN IEC 62899-203. Printed electronics. Part 203. Materials. Semiconductor ink
BS EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
BS IEC 60747-6:2000 Discrete semiconductor devices and integrated circuits - Thyristors
BS IEC 60747-6:2001 Discrete semiconductor devices and integrated circuits - Thyristors
BS EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Axial fatigue testing methods of thin film materials
BS EN 62047-10:2011 Semiconductor devices. Micro-electromechanical devices. Micro-pillar compression test for MEMS materials
BS IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Optoelectronic devices - Semiconductor lasers
BS EN 62047-21:2014 Semiconductor devices. Micro-electromechanical devices. Test method for Poisson's ratio of thin film MEMS materials
BS IEC 60747-14-1:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - General and classification - Sensor generals and classification for semiconductor sensors
BS IEC 60747-14-5:2010 Semiconductor devices - Semiconductor sensors - PN-junction semiconductor temperature sensor
BS IEC 60748-11:1991 Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits
BS IEC 60748-11:2000 Semiconductor devices - Integrated circuits - Sectional specification for semiconductor integrated circuits excluding hybrid circuits

RO-ASRO

STAS 6360-1974 SEMICONDUCTOR MATERIALS AND DEVICES Terminology

HU-MSZT

MSZ 771/5-1979 Mechanical properties of semiconductor materials
MSZ 9200/18-1980 Electronic signals. semiconductor

Indonesia Standards

SNI 19-0429-1989 Guide for sampling of liquid and semi solid materials
SNI 04-0109-1989 Copper wire bars for electrical conductor materials

International Electrotechnical Commission (IEC)

IEC 62899-203:2018 Printed electronics - Part 203: Materials - Semiconductor ink
IEC 62951-5:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials
IEC 60747-15:2003 Discrete semiconductor devices - Part 15: Isolated power semiconductor devices
IEC 60747-5-4:2022 Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers

IX-IX-IEC

IEC 62899-203:2024 RLV Printed electronics - Part 203: Materials - Semiconductor ink

German Institute for Standardization

DIN 50447:1995 Testing of materials for semiconductor technology - Contactless determination of the electrical sheet resistance of semiconductor layers with the eddy-current method
DIN 50448:1998 Testing of materials for semiconductor technology - Contactless determination of the electrical resistivity of semi-insulating semi-conductor slices using a capacitive probe
DIN 50445:1992 Testing of materials for semiconductor technology; contactless determination of the electrical resistivity of semiconductor slices with the eddy current method; homogeneously doped semiconductor wafers
DIN 50439:1982 Testing of materials for semiconductor technology; determination of the dopant concentration profile of single crystalline semiconductor material by means of the capacitancevoltage method and mercury contact
DIN 50441-1:1996 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 1: Thickness and thickness variation
DIN 50441-2:1998 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 2: Testing of edge profile
DIN EN 62047-10:2012-03 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011
DIN EN 62047-2:2007-02 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006); German version EN 62047-2:2006
DIN SPEC 1994:2017-02 Testing of materials for semiconductor technology - Determination of anions in weak acids

KR-KS

KS C IEC 62899-203-2023 Printed electronics — Part 203: Materials — Semiconductor ink
KS C IEC 62047-22-2016 Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
KS C IEC 62047-18-2016 Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials

RU-GOST R

GOST 22622-1977 Semiconductor materials. Terms and definitions
GOST R 50471-1993 Semiconductor photoemitters. Measuring method for halfintensity angle

SCC

SPC GB/T 1550-2018 Test methods for conductivity type of extrinsic semiconducting materials (TEXT OF DOCUMENT IS IN CHINESE)
SPC GB/T 14844-2018 Designations of semiconductor materials (TEXT OF DOCUMENT IS IN CHINESE)
BS IEC 60747-14-3:2001 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-Pressure sensors
DANSK DS/EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
DANSK DS/EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
BS IEC 60747-14-1:2000 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-General and classification-Sensor generals and classification for semiconductor sensors
CEI EN 62047-10:2012 Semiconductor devices - Microelectromechanical devices Part 10: Micro-pillar compression test for MEMS materials
CEI EN 62047-2:2007 Semiconductor devices - Micro-electromechanical devices Part 2: Tensile testing method of thin film materials
CEI EN 62047-18:2014 Semiconductor devices - Micro-electromechanical devices Part 18: Bend testing methods of thin film materials
BS PD ES 59008-3:1999 Data requirements for semiconductor die-Mechanical, material and connectivity requirements

American Society for Testing and Materials (ASTM)

ASTM D6095-99 Standard Test Method for Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
ASTM D3004-02 Standard Specification for Extruded Crosslinked and Thermoplastic Semi-Conducting, Conductor and Insulation Shielding Materials
ASTM D3004-08(2020) Standard Specification for Crosslinked and Thermoplastic Extruded Semi-Conducting, Conductor, and Insulation Shielding Materials
ASTM D6095-05 Standard Test Method for Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
ASTM D3004-97 Standard Specification for Extruded Crosslinked and Thermoplastic Semi-Conducting, Conductor and Insulation Shielding Materials

GSO

GSO IEC 60747-15:2014 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
BH GSO IEC 62047-10:2016 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
OS GSO IEC 62047-2:2014 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
GSO IEC 62047-2:2014 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
GSO IEC 62047-10:2014 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
OS GSO IEC 62047-10:2014 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
BH GSO IEC 62047-2:2016 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

CZ-CSN

CSN 35 8701-1975 Terminology of semiconductors and semiconductor devices

Underwriters Laboratories (UL)

UL 1557-2011 Electrically isolated semiconductor devices
UL 1557-1993 Electrically isolated semiconductor devices
UL 1557-2006 UL Standard for Safety Electrically Isolated Semiconductor Devices Fourth Edition; Reprint with Revisions through and Including 6/26/2006
UL 1557-1997 Electrically isolated semiconductor devices

American National Standards Institute （ANSI)

ANSI/ASTM D6095:2012 Test Method for Longitudinal Measurement of Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
ANSI/ASTM D3004:2008 Specification for Extruded Crosslinked and Thermoplastic Semi-conducting, Conductor and Insulation Shielding Materials

Association Francaise de Normalisation

NF C96-015:2005 Discrete semiconductor devices - Part 15: isolated power semiconductor devices
NF EN 62047-18:2014 Semiconductor devices - Microelectromechanical devices - Part 18: bending test methods for thin film materials
NF EN 62047-2:2006 Semiconductor devices - Microelectromechanical devices - Part 2: tensile testing methods for thin film materials

Korean Agency for Technology and Standards (KATS)

KS C IEC 62047-22-2021 Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
KS C IEC 62047-22:2016 Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
KS C IEC 62047-18-2021 Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
KS C IEC 62047-18:2016 Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
KS C IEC 62047-18-2016(2021) Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
KS C IEC 62047-22-2016(2021) Semiconductor devices ― Micro-electromechanical devices ― Part 18: Bend testing methods of thin film materials
KS C 6520-2021 Components and materials of semiconductor process —Measurement of wear characteristics by plasma

ES-UNE

UNE-EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (Endorsed by AENOR in December of 2011.)

Danish Standards Foundation

DS/EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

PL-PKN

PN T01305-1992 Semiconductor devices. Integrated circuits. Sectional specificatiion for semiconductor integrated circuits excluding hybrid circuits

ICEA - Insulated Cable Engineers Association Inc.

T-32-645-2012 Test Method for Establishing Volume Resistivity Compatibility of Water Blocking Components With Extruded Semiconducting Shield Materials

VE-FONDONORMA

NORVEN 64-8-1967 Resistance of metallic materials in circuit conductors