Semiconductor raw material inspection standards
Semiconductor raw material inspection standards, Total:111 items.
The international standard classification for "Semiconductor raw material inspection standards" includes: Semiconducting materials , Testing of metals in general , Electrical wires and cables , Testing of metals , Aerospace electric equipment and systems , Marine engines and propulsion systems .
The Chinese standard classification for "Semiconductor raw material inspection standards" includes: Semimetal and semiconductor material in general , Special electronic technology material , Metal physical property test method , Cable and its accessory , Technical management , Technical management , Power semiconductor device and parts , Electronic components , Thermal Measurement , Marine boiler and steam engine .
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
- GB/T 31469-2015 Semiconductor materials cutting fluid
- GB/T 14264-2009 Semiconductor materials - Terms and definitions
- GB/T 14264-2024 Terminology of semiconductor materials
- GB/T 14264-1993 Semiconductor materials-Terms and definitions
- GB/T 3048.3-1994 Test methods for determining electrical properties of electric cables and wires-Measurement of volumeresistivity of semi-conducting rubbers and plastics
- GB/T 14844-1993 of semiconductor materials
- GB/T 1550-1997 methods for measuring conductivity type of extrinsic semiconducting materials
Professional Standard - Electron
- SJ/T 10705-1996 Standard practice for inspection of surface quality of semiconductor lead-bonding wire
- SJ/Z 3206.13-1989 General rules for emision spectrum analysis for semiconductor materials
- SJ/T 10414-2015 Solder for semiconductor device
- SJ/T 10414-1993 Solder for semicoductor device
- SJ 20744-1999 General rule of infrared absorption spectral analysis for the impurity concentration in semiconductor materials
- SJ/T 11775-2021 Multi-wire saw used for semiconductor materials
- SJ/T 11067-1996 Commonly used terms for semiconductor photoelectric materials and pyroelectric materials in infrared detecting materials
国家市场监督管理总局、中国国家标准化管理委员会
- GB/T 1550-2018 Test methods for conductivity type of extrinsic semiconducting materials
- GB/T 14844-2018 Designations of semiconductor materials
Group Standards of the People's Republic of China
- T/CANSI 2-2018 Receiving inspection of raw materials for marine boilers
- T/ICMTIA CM0035-2023 Sealing gasket for semiconductor silicon material process device
- T/CASME 798-2023 Specialized processing tools for semiconductor materials
- T/SHDSGY 135-2023 New Energy Semiconductor Silicon Wafer Material Technology
Professional Standard - Machinery
- JB/T 7786-1995 Sampling Method for Test of Power Semiconductor Devices
Professional Standard - Aerospace
- QJ 1908A-1998 Acceptance Uncovering Check Method of Semiconductor Devices
机械电子工业部
- JB 3375-1991 Factory inspection of boiler raw materials
Shaanxi Provincial Standard of the People's Republic of China
- DB61/T 514-2011 Inspection rules for raw materials for ground-use crystalline silicon photovoltaic modules
- DB61/T 1250-2019 General Specification for Sic (Silicon Carbide) Material Semiconductor Discrete Devices
Taiwan Provincial Standard of the People's Republic of China
- CNS 5077-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Terminal Strength)
- CNS 6122-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices(Continuous Applying Voltage Test of Thyristors)
- CNS 5547-1988 Environmental inspection method and durability inspection method of single semiconductor device – high temperature storage test
- CNS 5070-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Cycle Test for Temperature)
- CNS 6118-1988 Environmental inspection method and durability inspection method of single semiconductor device – low temperature storage test
- CNS 5066-1983 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (General Rules)
- CNS 5072-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Sealing Test)
- CNS 5076-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Vibration Test)
- CNS 5078-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Salt Mist Spray)
- CNS 5073-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Shock Test)
- CNS 5541-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Continuous Operation Test of Transistor)
- CNS 6126-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (High Temperature for Applying Voltage Test of Thyristors)
- CNS 6124-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices(Intermittent Applying Voltage Test of Thyristors)
- CNS 5543-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Intermittent Operation Test of Transistor)
- CNS 5069-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Thermal Shock)
- CNS 6120-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices(Continuous Operation Test of Thyristors)
- CNS 5074-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Free Fall)
- CNS 5075-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Constant Acceleration)
- CNS 6117-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Damp Heat Test)
National Metrological Verification Regulations of the People's Republic of China
- JJG 363-1984 Semiconductor Themistor Themometer
Professional Standard - Speciality
- ZB U41005-1990 Incoming Inspection of Raw Materials for Marine Auxiliary Boilers
Professional Standard-Ships
- CB/T 3924-2002 Receiving inspection of materials for marine boilers
Professional Standard - Commodity Inspection
- SN 0400.1-1995 Rules for inspection of canned food for export. Raw and supplementary materials
未注明发布机构
- DIN 51061-2 E:2015-06 Testing of ceramic raw and finished materials - Part 2: Sampling of ceramic raw materials
German Institute for Standardization
- DIN 50447:1995 Testing of materials for semiconductor technology - Contactless determination of the electrical sheet resistance of semiconductor layers with the eddy-current method
- DIN 50445:1992 Testing of materials for semiconductor technology; contactless determination of the electrical resistivity of semiconductor slices with the eddy current method; homogeneously doped semiconductor wafers
- DIN 50443-1:1988 Testing of materials for use in semiconductor technology; detection of crystal defects and inhomogeneities in silicon single crystals by X-ray topography
- DIN 50442-1:1981 Testing of semi-conductive inorganic materials; determination of the surface structure of circular monocrystalline semi-conductive slices; as-cut and lapped slices
- DIN 50454-3:1994 Testing of materials for semiconductor technology - Determination of the dislocation etch pits density in monocrystals of III-V-compound semiconductors - Part 3: Gallium phosphide
- DIN 50454-2:1994 Testing of materials for semiconductor technology - Determination of the dislocation etch pits density in monocrystals of III-V-compound semiconductors - Part 2: Indium phosphide
- DIN 50433-2:1976 Testing of semi-conducting inorganic materials; determining the orientation of single crystals by means of optical reflection figure
- DIN 50446:1995 Testing of materials for semiconductor technology - Determination of defect types and defect densities of silicon epitaxial layers
- DIN 50441-2:1998 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 2: Testing of edge profile
- DIN 50441-1:1996 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 1: Thickness and thickness variation
- DIN 51064:1981 Testing of ceramic raw and semi-finished materials; determination of fire resistance of refractory bricks under load (DFB)
- DIN 50454-1:2000 Testing of materials for semiconductor technology - Determination of dislocations in monocrystals of III-V-compound semi-conductors - Part 1: Gallium arsenide
- DIN 50448:1998 Testing of materials for semiconductor technology - Contactless determination of the electrical resistivity of semi-insulating semi-conductor slices using a capacitive probe
- DIN 50433-3:1982 Testing of materials for semiconductor technology; determination of the orientation of single crystals by means of Laue back scattering
- DIN 50449-1:1997 Testing of materials for semiconductor technology - Determination of impurity content in semiconductors by infrared absorption - Part 1: Carbon in gallium arsenide
- DIN 50438-1:1995 Testing of materials for semiconductor technology - Determination of impurity content in silicon by infrared absorption - Part 1: Oxygen
- DIN 50439:1982 Testing of materials for semiconductor technology; determination of the dopant concentration profile of single crystalline semiconductor material by means of the capacitancevoltage method and mercury contact
- DIN 50433-1:1976 Testing of semi-conducting inorganic materials; determining the orientation of single crystals by means of X-ray diffraction
- DIN 50452-3:1995 Testing of materials for semiconductor technology - Test method for particle analysis in liquids - Part 3: Calibration of optical particle counters
- DIN 50452-1:1995 Testing of materials for semiconductor technology - Test method for particle analysis in liquids - Part 1: Microscopic determination of particles
- DIN 51061:2017 Testing of ceramic raw and finished materials - Sampling of ceramic raw materials
- DIN 50438-2:1982 Testing of materials for semiconductor technology; determination of impurty content in silicon by infrared absorption; carbon
- DIN 50449-2:1998 Testing of materials for semiconductor technology - Determination of impurity content in semiconductors by infrared absorption - Part 2: Boron in gallium arsenide
- DIN 50453-1:1990 Testing of materials for semiconductor technology; determination of etch rates of etching mixtures; silicium monocrystals; gravimetric method
- DIN 50451-1:2003 Testing of materials for semiconductor technology - Determination of trace elements in liquids - Part 1: Silver (Ag), gold (Au), calcium (Ca), copper (Cu), iron (Fe), potassium (K) and sodium (Na) in nitric acid by AAS
- DIN 50441-3:1985 Testing of materials for semiconductor technology; measurement of the geometric dimensions of semiconductor slices; determination of flatness deviation of polished slices by means of the multiple beam interference
- DIN 50434:1986 Testing of materials for semiconductor technology; detection of crystal defects in monocrystalline silicon using etching techniques on {111} and {100} surfaces
- DIN 50450-2:1991 Testing of materials for semiconductor technology; determination of impurities in carrier gases and doping gases; determination of oxygen impurity in N<(Index)2>, Ar, He, Ne and H<(Index)2> by using a galvanic cell
- DIN 51061-2:2004 Testing of ceramic raw and finished materials - Part 2: Sampling of ceramic raw materials
- DIN 50452-2:1991 Testing of materials for semiconductor technology; test method for particle analysis in liquids; determination of particles with optical particle counters
RO-ASRO
- STAS 6360-1974 SEMICONDUCTOR MATERIALS AND DEVICES Terminology
HU-MSZT
- MSZ 771/5-1979 Mechanical properties of semiconductor materials
- MSZ MI 16950/2-1977 Heat detection of electrical insulation materials. Guiding Principles
- MSZ 10038-1962 Raw material testing. laboratory ingredients
- MNOSZ 700-16.lap-1955 Detection of Nickel Content in Semiconductors
- MNOSZ 700-18.lap-1956 Detection of chlorine content in semiconductors
Indonesia Standards
- SNI 19-0429-1989 Guide for sampling of liquid and semi solid materials
British Standards Institution (BSI)
- BS IEC 62899-203:2024 Printed electronics - Materials. Semiconductor ink
- BS IEC 62899-203:2018 Printed electronics. Materials. Semiconductor ink
- BS IEC 62951-5:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for thermal characteristics of flexible materials
- BS EN 60749-3:2002 Semiconductor devices - Mechanical and climatic test methods - External visual examination
- BS EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
- BS EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
- BS EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Axial fatigue testing methods of thin film materials
- BS EN 62047-10:2011 Semiconductor devices. Micro-electromechanical devices. Micro-pillar compression test for MEMS materials
- BS EN 62047-21:2014 Semiconductor devices. Micro-electromechanical devices. Test method for Poisson's ratio of thin film MEMS materials
Japanese Industrial Standards Committee (JISC)
- JIS K 1466:1995 Testing methods for hydrofluoric acid of semi-conductor grade
- JIS C 2525:1999 Testing method for conductor-resistance and resistivity of metallic resistance materials
IN-BIS
- IS 6534-1971 Guidelines for grading and inspecting timber
International Electrotechnical Commission (IEC)
- IEC 62951-5:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials
- IEC 62899-203:2018 Printed electronics - Part 203: Materials - Semiconductor ink
- IEC 63364-1:2022 Semiconductor devices - Semiconductor devices for IoT system - Part 1: Test method of sound variation detection
SE-SIS
- SIS SEN 01 26 51-1969 Symbols for electrical diagrams Semi-conductors
American National Standards Institute (ANSI)
- ANSI/IEEE 300:1988 Test Procedures for Semiconductor Charged-Particle Detectors
- ANSI/ASTM E1161:1996 Test Method for Radiologic Examination of Semiconductors and Electronic Components
SCC
- SPC GB/T 14844-2018 Designations of semiconductor materials (TEXT OF DOCUMENT IS IN CHINESE)
IX-IX-IEC
- IEC 62899-203:2024 RLV Printed electronics - Part 203: Materials - Semiconductor ink
American Society for Testing and Materials (ASTM)
- ASTM D6095-99 Standard Test Method for Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
- ASTM D6095-05 Standard Test Method for Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
- ASTM E1161-03 Standard Test Method for Radiologic Examination of Semiconductors and Electronic Components
KR-KS
- KS C IEC 62899-203-2023 Printed electronics — Part 203: Materials — Semiconductor ink
Korean Agency for Technology and Standards (KATS)
- KS C IEC 60749-39-2006(2016) Semiconductor devices-Mechanical and climatic test methods-Part 39:Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components