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Semiconductor raw material inspection standards

Semiconductor raw material inspection standards, Total:111 items.

The international standard classification for "Semiconductor raw material inspection standards" includes: Semiconducting materials , Testing of metals in general , Electrical wires and cables , Testing of metals , Aerospace electric equipment and systems , Marine engines and propulsion systems .

The Chinese standard classification for "Semiconductor raw material inspection standards" includes: Semimetal and semiconductor material in general , Special electronic technology material , Metal physical property test method , Cable and its accessory , Technical management , Technical management , Power semiconductor device and parts , Electronic components , Thermal Measurement , Marine boiler and steam engine .


General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

  • GB/T 31469-2015 Semiconductor materials cutting fluid
  • GB/T 14264-2009 Semiconductor materials - Terms and definitions
  • GB/T 14264-2024 Terminology of semiconductor materials
  • GB/T 14264-1993 Semiconductor materials-Terms and definitions
  • GB/T 3048.3-1994 Test methods for determining electrical properties of electric cables and wires-Measurement of volumeresistivity of semi-conducting rubbers and plastics
  • GB/T 14844-1993 of semiconductor materials
  • GB/T 1550-1997 methods for measuring conductivity type of extrinsic semiconducting materials

Professional Standard - Electron

  • SJ/T 10705-1996 Standard practice for inspection of surface quality of semiconductor lead-bonding wire
  • SJ/Z 3206.13-1989 General rules for emision spectrum analysis for semiconductor materials
  • SJ/T 10414-2015 Solder for semiconductor device
  • SJ/T 10414-1993 Solder for semicoductor device
  • SJ 20744-1999 General rule of infrared absorption spectral analysis for the impurity concentration in semiconductor materials
  • SJ/T 11775-2021 Multi-wire saw used for semiconductor materials
  • SJ/T 11067-1996 Commonly used terms for semiconductor photoelectric materials and pyroelectric materials in infrared detecting materials

国家市场监督管理总局、中国国家标准化管理委员会

Group Standards of the People's Republic of China

Professional Standard - Machinery

  • JB/T 7786-1995 Sampling Method for Test of Power Semiconductor Devices

Professional Standard - Aerospace

  • QJ 1908A-1998 Acceptance Uncovering Check Method of Semiconductor Devices

机械电子工业部

Shaanxi Provincial Standard of the People's Republic of China

  • DB61/T 514-2011 Inspection rules for raw materials for ground-use crystalline silicon photovoltaic modules
  • DB61/T 1250-2019 General Specification for Sic (Silicon Carbide) Material Semiconductor Discrete Devices

Taiwan Provincial Standard of the People's Republic of China

  • CNS 5077-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Terminal Strength)
  • CNS 6122-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices(Continuous Applying Voltage Test of Thyristors)
  • CNS 5547-1988 Environmental inspection method and durability inspection method of single semiconductor device – high temperature storage test
  • CNS 5070-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Cycle Test for Temperature)
  • CNS 6118-1988 Environmental inspection method and durability inspection method of single semiconductor device – low temperature storage test
  • CNS 5066-1983 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (General Rules)
  • CNS 5072-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Sealing Test)
  • CNS 5076-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Vibration Test)
  • CNS 5078-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Salt Mist Spray)
  • CNS 5073-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Shock Test)
  • CNS 5541-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Continuous Operation Test of Transistor)
  • CNS 6126-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (High Temperature for Applying Voltage Test of Thyristors)
  • CNS 6124-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices(Intermittent Applying Voltage Test of Thyristors)
  • CNS 5543-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Intermittent Operation Test of Transistor)
  • CNS 5069-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Thermal Shock)
  • CNS 6120-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices(Continuous Operation Test of Thyristors)
  • CNS 5074-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Free Fall)
  • CNS 5075-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Constant Acceleration)
  • CNS 6117-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Damp Heat Test)

National Metrological Verification Regulations of the People's Republic of China

Professional Standard - Speciality

  • ZB U41005-1990 Incoming Inspection of Raw Materials for Marine Auxiliary Boilers

Professional Standard-Ships

Professional Standard - Commodity Inspection

  • SN 0400.1-1995 Rules for inspection of canned food for export. Raw and supplementary materials

未注明发布机构

  • DIN 51061-2 E:2015-06 Testing of ceramic raw and finished materials - Part 2: Sampling of ceramic raw materials

German Institute for Standardization

  • DIN 50447:1995 Testing of materials for semiconductor technology - Contactless determination of the electrical sheet resistance of semiconductor layers with the eddy-current method
  • DIN 50445:1992 Testing of materials for semiconductor technology; contactless determination of the electrical resistivity of semiconductor slices with the eddy current method; homogeneously doped semiconductor wafers
  • DIN 50443-1:1988 Testing of materials for use in semiconductor technology; detection of crystal defects and inhomogeneities in silicon single crystals by X-ray topography
  • DIN 50442-1:1981 Testing of semi-conductive inorganic materials; determination of the surface structure of circular monocrystalline semi-conductive slices; as-cut and lapped slices
  • DIN 50454-3:1994 Testing of materials for semiconductor technology - Determination of the dislocation etch pits density in monocrystals of III-V-compound semiconductors - Part 3: Gallium phosphide
  • DIN 50454-2:1994 Testing of materials for semiconductor technology - Determination of the dislocation etch pits density in monocrystals of III-V-compound semiconductors - Part 2: Indium phosphide
  • DIN 50433-2:1976 Testing of semi-conducting inorganic materials; determining the orientation of single crystals by means of optical reflection figure
  • DIN 50446:1995 Testing of materials for semiconductor technology - Determination of defect types and defect densities of silicon epitaxial layers
  • DIN 50441-2:1998 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 2: Testing of edge profile
  • DIN 50441-1:1996 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 1: Thickness and thickness variation
  • DIN 51064:1981 Testing of ceramic raw and semi-finished materials; determination of fire resistance of refractory bricks under load (DFB)
  • DIN 50454-1:2000 Testing of materials for semiconductor technology - Determination of dislocations in monocrystals of III-V-compound semi-conductors - Part 1: Gallium arsenide
  • DIN 50448:1998 Testing of materials for semiconductor technology - Contactless determination of the electrical resistivity of semi-insulating semi-conductor slices using a capacitive probe
  • DIN 50433-3:1982 Testing of materials for semiconductor technology; determination of the orientation of single crystals by means of Laue back scattering
  • DIN 50449-1:1997 Testing of materials for semiconductor technology - Determination of impurity content in semiconductors by infrared absorption - Part 1: Carbon in gallium arsenide
  • DIN 50438-1:1995 Testing of materials for semiconductor technology - Determination of impurity content in silicon by infrared absorption - Part 1: Oxygen
  • DIN 50439:1982 Testing of materials for semiconductor technology; determination of the dopant concentration profile of single crystalline semiconductor material by means of the capacitancevoltage method and mercury contact
  • DIN 50433-1:1976 Testing of semi-conducting inorganic materials; determining the orientation of single crystals by means of X-ray diffraction
  • DIN 50452-3:1995 Testing of materials for semiconductor technology - Test method for particle analysis in liquids - Part 3: Calibration of optical particle counters
  • DIN 50452-1:1995 Testing of materials for semiconductor technology - Test method for particle analysis in liquids - Part 1: Microscopic determination of particles
  • DIN 51061:2017 Testing of ceramic raw and finished materials - Sampling of ceramic raw materials
  • DIN 50438-2:1982 Testing of materials for semiconductor technology; determination of impurty content in silicon by infrared absorption; carbon
  • DIN 50449-2:1998 Testing of materials for semiconductor technology - Determination of impurity content in semiconductors by infrared absorption - Part 2: Boron in gallium arsenide
  • DIN 50453-1:1990 Testing of materials for semiconductor technology; determination of etch rates of etching mixtures; silicium monocrystals; gravimetric method
  • DIN 50451-1:2003 Testing of materials for semiconductor technology - Determination of trace elements in liquids - Part 1: Silver (Ag), gold (Au), calcium (Ca), copper (Cu), iron (Fe), potassium (K) and sodium (Na) in nitric acid by AAS
  • DIN 50441-3:1985 Testing of materials for semiconductor technology; measurement of the geometric dimensions of semiconductor slices; determination of flatness deviation of polished slices by means of the multiple beam interference
  • DIN 50434:1986 Testing of materials for semiconductor technology; detection of crystal defects in monocrystalline silicon using etching techniques on {111} and {100} surfaces
  • DIN 50450-2:1991 Testing of materials for semiconductor technology; determination of impurities in carrier gases and doping gases; determination of oxygen impurity in N<(Index)2>, Ar, He, Ne and H<(Index)2> by using a galvanic cell
  • DIN 51061-2:2004 Testing of ceramic raw and finished materials - Part 2: Sampling of ceramic raw materials
  • DIN 50452-2:1991 Testing of materials for semiconductor technology; test method for particle analysis in liquids; determination of particles with optical particle counters

RO-ASRO

HU-MSZT

Indonesia Standards

British Standards Institution (BSI)

  • BS IEC 62899-203:2024 Printed electronics - Materials. Semiconductor ink
  • BS IEC 62899-203:2018 Printed electronics. Materials. Semiconductor ink
  • BS IEC 62951-5:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for thermal characteristics of flexible materials
  • BS EN 60749-3:2002 Semiconductor devices - Mechanical and climatic test methods - External visual examination
  • BS EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
  • BS EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
  • BS EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Axial fatigue testing methods of thin film materials
  • BS EN 62047-10:2011 Semiconductor devices. Micro-electromechanical devices. Micro-pillar compression test for MEMS materials
  • BS EN 62047-21:2014 Semiconductor devices. Micro-electromechanical devices. Test method for Poisson's ratio of thin film MEMS materials

Japanese Industrial Standards Committee (JISC)

  • JIS K 1466:1995 Testing methods for hydrofluoric acid of semi-conductor grade
  • JIS C 2525:1999 Testing method for conductor-resistance and resistivity of metallic resistance materials

IN-BIS

International Electrotechnical Commission (IEC)

  • IEC 62951-5:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials
  • IEC 62899-203:2018 Printed electronics - Part 203: Materials - Semiconductor ink
  • IEC 63364-1:2022 Semiconductor devices - Semiconductor devices for IoT system - Part 1: Test method of sound variation detection

SE-SIS

American National Standards Institute (ANSI)

SCC

IX-IX-IEC

American Society for Testing and Materials (ASTM)

  • ASTM D6095-99 Standard Test Method for Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
  • ASTM D6095-05 Standard Test Method for Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
  • ASTM E1161-03 Standard Test Method for Radiologic Examination of Semiconductors and Electronic Components

KR-KS

Korean Agency for Technology and Standards (KATS)

  • KS C IEC 60749-39-2006(2016) Semiconductor devices-Mechanical and climatic test methods-Part 39:Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components