Commonly Used Semiconductor Materials
Commonly Used Semiconductor Materials, Total:45 items.
The international standard classification for "Commonly Used Semiconductor Materials" includes: Semiconducting materials , Testing of metals , Testing of metals in general .
The Chinese standard classification for "Commonly Used Semiconductor Materials" includes: Technical management , Technical management , Semimetal and semiconductor material in general , Special electronic technology material , Metal physical property test method .
Professional Standard - Electron
- SJ/T 10414-1993 Solder for semicoductor device
- SJ/T 10414-2015 Solder for semiconductor device
- SJ/Z 3206.13-1989 General rules for emision spectrum analysis for semiconductor materials
- SJ/T 11067-1996 Commonly used terms for semiconductor photoelectric materials and pyroelectric materials in infrared detecting materials
- SJ/T 11775-2021 Multi-wire saw used for semiconductor materials
- SJ 20744-1999 General rule of infrared absorption spectral analysis for the impurity concentration in semiconductor materials
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
- GB/T 31469-2015 Semiconductor materials cutting fluid
- GB/T 14844-2018 Designations of semiconductor materials
- GB/T 1550-1997 methods for measuring conductivity type of extrinsic semiconducting materials
- GB/T 1550-2018 Test methods for conductivity type of extrinsic semiconducting materials
- GB/T 14264-2024 Terminology of semiconductor materials
- GB/T 14264-1993 Semiconductor materials－Terms and definitions
- GB/T 46227-2025 Test method for transmittance of semiconductor single crystal materials
- GB/T 14264-2009 Semiconductor materials - Terms and definitions
- GB/T 14844-1993 of semiconductor materials
- SPC GB/T 14844-2018 Designations of semiconductor materials (TEXT OF DOCUMENT IS IN CHINESE)
Group Standards of the People's Republic of China
- T/CIET 722-2024 High purity sputtering targets for semiconductors
- T/CNIA 0143-2022 Ultrapure Resin Vessels for Trace Impurity Analysis of Semiconductor Materials
- T/CASME 798-2023 Specialized processing tools for semiconductor materials
- T/SHDSGY 135-2023 New Energy Semiconductor Silicon Wafer Material Technology
- T/ICMTIA CM0035-2023 Sealing gasket for semiconductor silicon material process device
- T/CIET 723-2024 Technical Specifications for Semiconductor CMP Polishing Materials
Shaanxi Provincial Standard of the People's Republic of China
- DB61/T 1250-2019 General Specification for Sic (Silicon Carbide) Material Semiconductor Discrete Devices
Defense Logistics Agency
- DLA MIL-PRF-19500 N-2005 SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
Magyar Szabványügyi Testület
- MSZ 771/5-1979 Mechanical properties of semiconductor materials
- MNOSZ 700-10.lap-1955 STMicroelectronics is a very high temperature distillation
Indonesia Standards
- SNI 19-0429-1989 Guide for sampling of liquid and semi solid materials
National Standardisation Body (ASRO)
- STAS 6360-1974 SEMICONDUCTOR MATERIALS AND DEVICES Terminology
American Society for Testing and Materials (ASTM)
- ASTM F42-02 Test methods for conductivity types of semiconductor materials
- ASTM F43-99 Semiconductor material resistivity test method
Association Francaise de Normalisation
- NF T51-223:1985 Plastics. Semi-cristalline materials. Determination of the conventional melting temperature by thermal analyse.
British Standards Institution (BSI)
- BS IEC 62899-203:2024 Printed electronics - Materials. Semiconductor ink
- BS IEC 62899-203:2018 Printed electronics. Materials. Semiconductor ink
- BS IEC 62951-5:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for thermal characteristics of flexible materials
German Institute for Standardization
- DIN 50447:1995 Testing of materials for semiconductor technology - Contactless determination of the electrical sheet resistance of semiconductor layers with the eddy-current method
- DIN 50439:1982-10 Testing of materials for semiconductor technology; determination of the dopant concentration profile of single crystalline semiconductor material by means of the capacitancevoltage method and mercury contact
- DIN 50445:1992 Testing of materials for semiconductor technology; contactless determination of the electrical resistivity of semiconductor slices with the eddy current method; homogeneously doped semiconductor wafers
- DIN 50448:1998 Testing of materials for semiconductor technology - Contactless determination of the electrical resistivity of semi-insulating semi-conductor slices using a capacitive probe
- DIN 50439:1982 Testing of materials for semiconductor technology; determination of the dopant concentration profile of single crystalline semiconductor material by means of the capacitancevoltage method and mercury contact
International Electrotechnical Commission (IEC)
- IEC 62899-203:2024 Printed electronics – Part 203: Materials – Semiconductor ink
- IEC 62899-203:2018 Printed electronics - Part 203: Materials - Semiconductor ink
- IEC 62899-203:2024 RLV Printed electronics - Part 203: Materials - Semiconductor ink
Swedish Institute for Standards
- SS-EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
American National Standards Institute （ANSI)
- ANSI/ASTM D3004:2008 Specification for Extruded Crosslinked and Thermoplastic Semi-conducting, Conductor and Insulation Shielding Materials
Korean Agency for Technology and Standards (KATS)
- KS C 6520-2021 Components and materials of semiconductor process —Measurement of wear characteristics by plasma
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