What are the commonly used semiconductor materials?

What are the commonly used semiconductor materials?, Total:88 items.

The international standard classification for "What are the commonly used semiconductor materials?" includes: Semiconducting materials , Testing of metals in general , Testing of metals .

The Chinese standard classification for "What are the commonly used semiconductor materials?" includes: Technical management , Technical management , Semimetal and semiconductor material in general , Special electronic technology material , Metal physical property test method , Electrical insulating material and its products .

Professional Standard - Electron

SJ 20744-1999 General rule of infrared absorption spectral analysis for the impurity concentration in semiconductor materials
SJ/T 11775-2021 Multi-wire saw used for semiconductor materials
SJ/T 10414-2015 Solder for semiconductor device
SJ/T 10414-1993 Solder for semicoductor device
SJ/Z 3206.13-1989 General rules for emision spectrum analysis for semiconductor materials
SJ/T 11067-1996 Commonly used terms for semiconductor photoelectric materials and pyroelectric materials in infrared detecting materials

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 14264-2024 Terminology of semiconductor materials
GB/T 14264-1993 Semiconductor materials－Terms and definitions
GB/T 14844-1993 of semiconductor materials
GB/T 31469-2015 Semiconductor materials cutting fluid
GB/T 1550-1997 methods for measuring conductivity type of extrinsic semiconducting materials
GB/T 4298-1984 The activation analysis method for the determination of elemental impurities in semiconductor silicon materials
GB/T 14264-2009 Semiconductor materials - Terms and definitions

Group Standards of the People's Republic of China

T/ICMTIA CM0035-2023 Sealing gasket for semiconductor silicon material process device
T/CASME 798-2023 Specialized processing tools for semiconductor materials
T/SHDSGY 135-2023 New Energy Semiconductor Silicon Wafer Material Technology
T/CNIA 0143-2022 Ultrapure Resin Vessels for Trace Impurity Analysis of Semiconductor Materials

国家市场监督管理总局、中国国家标准化管理委员会

GB/T 14844-2018 Designations of semiconductor materials
GB/T 1550-2018 Test methods for conductivity type of extrinsic semiconducting materials

Shaanxi Provincial Standard of the People's Republic of China

DB61/T 1250-2019 General Specification for Sic (Silicon Carbide) Material Semiconductor Discrete Devices

Professional Standard - Machinery

JB/T 7622-1994 Organosilicone Lacquer Intended to Be Used in Power Semiconductor Device Production Process

未注明发布机构

SEMI S23-0311-2011 GUIDE FOR CONSERVATION OF ENERGY, UTILITIES AND MATERIALS USED BY SEMICONDUCTOR MANUFACTURING EQUIPMENT
DIN SPEC 1994 E:2016-07 Testing of materials for semiconductor technology - Determination of anions in weak acids

Defense Logistics Agency

DLA MIL-PRF-19500 N-2005 SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR

Danish Standards Foundation

DS-håndbog 116.3.6:2021 Using frequency converters and guidance in leakage currents and stray currents – What is the meaning?
DS/EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods -- Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

HU-MSZT

MSZ 771/5-1979 Mechanical properties of semiconductor materials

SCC

AWWA ACE70729 Why Don't Utilities Get Tangible Savings from Their Automation?
CEI EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
DANSK DS/EN IEC 60749-39:2022 Semiconductor devices – Mechanical and climatic test methods – Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
CEI EN 60749-39:2007 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solublity in organic materials used for semiconductor components
DANSK DS/EN 60749-39:2006 Semiconductor devices – Mechanical and climatic test methods -- Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
SPC GB/T 14844-2018 Designations of semiconductor materials (TEXT OF DOCUMENT IS IN CHINESE)
AWWA IMTECH54035 Application Service Providers (ASPs): What Are They, and How Do They Fit Into Your Overall IT Strategy?
DIN EN IEC 60749-39:2023 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2021); German version EN IEC 60749-39:2022

Building Officials and Code Administrators International(U.S.)

BOCA ARTICLE 18 NFPC COMM-1990 Semiconductor Fabrication Facilities Using Hazardous Production Materials
BOCA ARTICLE 18 NFPC-1990 Semiconductor Fabrication Facilities Using Hazardous Production Materials Eighth Edition

British Standards Institution (BSI)

BS EN IEC 60749-39:2022 Semiconductor devices. Mechanical and climatic test methods. Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
BS EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
23/30450091 DC BS IEC 62899-203-2 Printed electronics. Materials - Semiconductor Ink- Space charge limited mobility measurement in printed organic semiconductive layers
BS IEC 62899-203:2024 Printed electronics - Materials. Semiconductor ink
BS IEC 62899-203:2018 Printed electronics. Materials. Semiconductor ink
BS IEC 62951-5:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for thermal characteristics of flexible materials
20/30425840 DC BS EN IEC 60749-39. Semiconductor devices. Mechanical and climatic test methods. Part 39. Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
BS EN 62779-1:2016 Semiconductor devices. Semiconductor interface for human body communication. General requirements
BS IEC 62951-4:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
BS IEC 62951-7:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor

German Institute for Standardization

DIN 50447:1995 Testing of materials for semiconductor technology - Contactless determination of the electrical sheet resistance of semiconductor layers with the eddy-current method
DIN EN 60749-39:2007-01 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006); German version EN 60749-39:2006 / Note: To be r...
DIN EN 60749-39:2007 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006); German version EN 60749-39:2006
DIN 50448:1998 Testing of materials for semiconductor technology - Contactless determination of the electrical resistivity of semi-insulating semi-conductor slices using a capacitive probe
DIN 50439:1982 Testing of materials for semiconductor technology; determination of the dopant concentration profile of single crystalline semiconductor material by means of the capacitancevoltage method and mercury contact
DIN 50445:1992 Testing of materials for semiconductor technology; contactless determination of the electrical resistivity of semiconductor slices with the eddy current method; homogeneously doped semiconductor wafers
DIN EN IEC 60749-39:2021-07 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 47/2652/CDV:2020); English version prEN IEC 60749-39:2020 / Not...
DIN 50441-2:1998 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 2: Testing of edge profile
DIN 50443-1:1988 Testing of materials for use in semiconductor technology; detection of crystal defects and inhomogeneities in silicon single crystals by X-ray topography
DIN SPEC 1994:2017-02 Testing of materials for semiconductor technology - Determination of anions in weak acids

RO-ASRO

STAS 6360-1974 SEMICONDUCTOR MATERIALS AND DEVICES Terminology

Indonesia Standards

SNI 19-0429-1989 Guide for sampling of liquid and semi solid materials

Association Francaise de Normalisation

NF T51-223:1985 Plastics. Semi-cristalline materials. Determination of the conventional melting temperature by thermal analyse.
NF C96-022-39*NF EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39 : measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
NF C96-022-39*NF EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Part 39 : measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
NF EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39: measurement of moisture diffusivity and water solubility in organic materials used in semiconductor components
NF ISO 10677:2011 Céramiques techniques - Sources lumineuses UV destinée aux essais des matériaux photocatalytiques semi-conducteurs

Korean Agency for Technology and Standards (KATS)

KS C IEC 60749-39-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C IEC 60749-39-2021 Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C IEC 60749-39-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C IEC 60749-39:2006 Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C 6520-2021 Components and materials of semiconductor process —Measurement of wear characteristics by plasma

International Electrotechnical Commission (IEC)

IEC 60749-39:2021 RLV Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC 60749-39:2021 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC 62899-203:2018 Printed electronics - Part 203: Materials - Semiconductor ink
IEC 62951-5:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials

GSO

GSO IEC 60749-39:2014 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
OS GSO IEC 60749-39:2014 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

ES-UNE

UNE-EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (Endorsed by Asociación Española de Normalización in March of 2022.)
UNE-EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods -- Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006). (Endorsed by AENOR in November of 2006.)

European Committee for Electrotechnical Standardization（CENELEC）

EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

US-CFR-file

CFR 10-770.4-2013 Energy.Part770:Transfer of real property at defense nuclear facilities for economic development. Section770.4:What definitions are used in this part?

Lithuanian Standards Office

LST EN 60749-39-2006 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006)

IX-IX-IEC

IEC 62899-203:2024 RLV Printed electronics - Part 203: Materials - Semiconductor ink

American National Standards Institute （ANSI)

ANSI/ASTM D3004:2008 Specification for Extruded Crosslinked and Thermoplastic Semi-conducting, Conductor and Insulation Shielding Materials

American Society for Testing and Materials (ASTM)

ASTM D3004-02 Standard Specification for Extruded Crosslinked and Thermoplastic Semi-Conducting, Conductor and Insulation Shielding Materials
ASTM D3004-08(2020) Standard Specification for Crosslinked and Thermoplastic Extruded Semi-Conducting, Conductor, and Insulation Shielding Materials
ASTM D3004-97 Standard Specification for Extruded Crosslinked and Thermoplastic Semi-Conducting, Conductor and Insulation Shielding Materials

AT-OVE/ON

OVE EN IEC 60749-39:2020 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 47/2652/CDV) (english version)

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