solid ultraviolet semiconductor
solid ultraviolet semiconductor, Total:259 items.
The international standard classification for "solid ultraviolet semiconductor" includes: Optoelectronics. Laser equipment , Optics and optical measurements , Integrated circuits. Microelectronics , Semiconductor devices , Semiconductor devices in general , Semiconducting materials .
The Chinese standard classification for "solid ultraviolet semiconductor" includes: Technical management , Technical Management , Semiconductor emitting device , Technical management , Technical management , Optoelectronic device assembly , Inorganic chemicals in general , Microcircuit in general , Semiconductor triode , Semiconductor integrated circuit , Semiconductor discrete devices in general , Semimetal and semiconductor material in general , Power semiconductor device and parts , Petroleum products in general .
Professional Standard - Electron
- SJ/T 10176-1991 Detail specification of metal rhomb package for semiconductor integrated circuits
- SJ 2658.1-1986 Methods of Measurement for Semiconductor Infrared Diodes - General Rules
- SJ/T 11395-2009 Semiconductor lighting terminology
- SJ 20744-1999 General rule of infrared absorption spectral analysis for the impurity concentration in semiconductor materials
- SJ 50033/41-1994 Detail specification for type GR9414 semiconductor infrared light emitting diode
- SJ/T 10308-1992 Detail specification of ceramic flat package for semiconductor integrated circuits
- SJ 2684-1986 Physical demensions for light emitting device of semiconductor
- SJ 2247-1982 Outlines dimension for semiconductor optoelectronic devices
- SJ/Z 9021.4-1987 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor devices
- SJ/T 11818.3-2022 Semiconductor UV-emitting diodes Part 3: Device Specifications
- SJ/T 11818.2-2022 Semiconductor UV Emitting Diodes Part 2: Chip Specifications
- SJ 2750-1987 Outline dimensions for semiconductor laser diodes
- SJ 2433-1984 Bonding sheet for semiconductor tubes
- SJ/T 11818.1-2022 Semiconductor UV-emitting diodes Part 1: Test methods
Military Standard of the People's Republic of China-General Armament Department
- GJB 8190-2015 General specification for semiconductor solid-state light sources for aircraft exterior lighting
- GJB/Z 41.3-1993 Military semiconductor discrete device series spectrum semiconductor optoelectronic devices
- GJB 1557-1992 Semiconductor discrete device microwave diode dimensions
- GJB 33/15-2011 Semiconductor optoelectronic device.Detail specification for type BT401 semiconductor infrared-emitting diode
- GJB 33/16-2011 Semiconductor optoelectronic device.Detail specification for type 3DU32 semiconductor phototransistor
- GJB 1420B-2011 General specification for packages of semiconductor integrated circuits
- GJB 1420A-1999 General Specification for Semiconductor Integrated Circuit Enclosures
- GJB 923A-2004 General specification for packages of semiconductor discrete devices
- GJB 1934A-2009 Cables,raido frequency,coaxial,semirigid,corrugated outer conductor,general specification for
- GJB 1557A-2021 Semiconductor discrete device microwave diode dimensions
- GJB 1934-1994 General specification for semi-rigid coaxial radio frequency cables with wrinkled outer conductors
- GJB 1420/1-2000 Detailed specification for ceramic dual-row enclosures for semiconductor integrated circuits
- GJB 923B-2021 General Specification for Semiconductor Discrete Device Enclosures
国家市场监督管理总局、中国国家标准化管理委员会
- GB/T 15879.4-2019 Mechanical standardization of semiconductor devices—Part 4:Coding system and classification into forms of package outlines for semiconductor device packages
- GB/T 7092-2021 Outline dimensions of semiconductor integrated circuits
- GB/T 37131-2018 Nanotechnologies—Test method of semiconductor nanopowder using UV-Vis diffuse reflectance spectroscopy
- GB/T 37031-2018 Semiconductor lighting terminology
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
- GB/T 20522-2006 Semiconductor devices Part 14-3: Semiconductor sensors - Pressure sensors
- GB/T 14264-2024 Terminology of semiconductor materials
- GB/T 7581-1987 of outlines for semiconductor discrete devices
- GB/T 37131-2018e Nanotechnologies—Test method of semiconductor nanopowder using UV-Vis diffuse reflectance spectroscopy
- GB/T 20521-2006 Semconductor devices Part 14-1: Semiconductor sensors - General and classification
- GB/T 14264-1993 Semiconductor materials-Terms and definitions
- GB/T 37131-2018(英文版) Nanotechnology - Testing method of UV-visible diffuse reflectance spectrum of semiconductor nanopowder materials
- GB/T 11493-1989 Blank detail specification of packages for semiconductor integrated circuits
- GB/T 7092-1993 Outline dimensions of semiconductor integrated circuits
- GB/T 14264-2009 Semiconductor materials - Terms and definitions
Group Standards of the People's Republic of China
- T/JSXH 0002-2020 Regeneration solution for semiconductor
- T/QGCML 4323-2024 Intelligent semiconductor six-sided appearance optical image sorter
- T/QGCML 4031-2024 Semiconductor optical wafer
- T/SZBSIA 006-2022 Semiconductor di e bonder technical?norm
- T/JGXH 008-2020 Diode pump solid state laser
- T/SZBSIA 007-2022 Semiconductor die bonder test specification
机械工业部
- JB/T 6306-1992 Power semiconductor module dimensions
Professional Standard - Machinery
- JB/T 8175-1999 Outline dimensions of extruded heat sink for power semiconductor devices
- JB/T 5631-1991 Epitaxial Furnace for Semiconductor Devices. Energy Efficiency Standard
Professional Standard - Aerospace
- QJ 3006-1998 Solid surface (ship) to air missile semi-bomb test method
未注明发布机构
- IEEE Std 216-1960(R1980) IRE Standards on Solid-State Devices: Definitions of Semiconductor Terms
Taiwan Provincial Standard of the People's Republic of China
- CNS 11900-1987 Fixed Ceramic Capacitors for Electronic Equipment (Semiconductor)
Professional Standard - Petrochemical Industry
- SH/T 0229-1992 SH/T 0229-1992
Guangdong Provincial Standard of the People's Republic of China
- DB44/T 1873-2016 semiconductor refrigeration wine cabinet
工业和信息化部
- SJ/T 11702-2018 Semiconductor integrated circuit serial peripheral interface test method
- QB/T 5369-2019 Semiconductor refrigeration appliance
Association Francaise de Normalisation
- NF ISO 10677:2011 Céramiques techniques - Sources lumineuses UV destinée aux essais des matériaux photocatalytiques semi-conducteurs
- NF B44-103*NF ISO 10677:2011 Fine ceramics (advanced ceramics, advanced technical ceramics) - Ultraviolet light source for testing semiconducting photocatalytic materials
- NF C96-045:1992 Semiconductors devices. Integrated circuits. Part 11 : sectional specification for semiconducteur integrated circuits excluding hybrid circuits
- NF C96-779-1*NF EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1 : general requirements
- NF C96-015:2005 Discrete semiconductor devices - Part 15: isolated power semiconductor devices
- NF C96-013-4*NF EN 60191-4:2014 Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages
- NF EN 60191-6:2011 Mechanical standardization of semiconductor devices - Part 6: general rules for the preparation of outline drawings of packages for surface mount semiconductor devices
- NF C96-013-4/A2*NF EN 60191-4/A2:2003 Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages.
- NF C96-013-4*NF EN 60191-4:2000 Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages.
British Standards Institution (BSI)
- BS IEC 60747-14-11:2021 Semiconductor devices - Semiconductor sensors. Test method of surface acoustic wave-based integrated sensors for measuring ultraviolet, illumination and temperature
- 19/30390371 DC BS IEC 60747-14-11. Semiconductor devices. Part 14-11. Semiconductor sensors. Test method of surface acoustic wave based integrated sensor for measuring ultra violet, illumination and temperature
- BS IEC 60747-14-5:2010 Semiconductor devices - Semiconductor sensors - PN-junction semiconductor temperature sensor
- 18/30362458 DC BS IEC 60747-14-11. Semiconductor devices. Part 14-11. Semiconductor sensors. Test method of surface acoustic wave based integrated sensor for measuring ultra violet, illumination and temperature
- BS IEC 60748-11:1991 Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits
- BS IEC 60748-11:2000 Semiconductor devices - Integrated circuits - Sectional specification for semiconductor integrated circuits excluding hybrid circuits
- BS IEC 60747-14-4:2011 Semiconductor devices. Discrete devices. Semiconductor accelerometers
- BS IEC 60747-5-4:2022 Semiconductor devices - Optoelectronic devices. Semiconductor lasers
- BS EN 62779-1:2016 Semiconductor devices. Semiconductor interface for human body communication. General requirements
- BS IEC 60747-14-3:2009 Semiconductor devices - Semiconductor sensors - Pressure sensors
- BS ISO 10677:2011 Fine ceramics (advanced ceramics, advanced technical ceramics). Ultraviolet light source for testing semiconducting photocatalytic materials
- BS IEC 60747-14-2:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
- BS IEC 60747-14-2:2000 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
- BS EN 60747-15:2004 Discrete semiconductor devices. Isolated power semiconductor devices
- BS IEC 60747-14-1:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - General and classification - Sensor generals and classification for semiconductor sensors
- BS EN 60191-4:2014+A1:2018 Mechanical standardization of semiconductor devices - Coding system and classification into forms of package outlines for semiconductor device packages
- BS EN 60191-4:2014 Mechanical standardization of semiconductor devices. Coding system and classification into forms of package outlines for semiconductor device packages
- BS IEC 62779-4:2020 Semiconductor devices. Semiconductor interface for human body communication - Capsule endoscope
- BS IEC 60747-6:2000 Discrete semiconductor devices and integrated circuits - Thyristors
- BS IEC 60747-6:2001 Discrete semiconductor devices and integrated circuits - Thyristors
- BS EN 60191-6:2004 Mechanical standardization of semiconductor devices-Part 6:General rules for the preparation of outline drawings of surface mounted semiconductor device packages
- BS EN 60191-6:2010 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages
- BS EN 60191-6:2009 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages
- BS EN 62779-2:2016 Semiconductor devices. Semiconductor interface for human body communication. Characterization of interfacing performances
- BS EN 60747-15:2012 Semiconductor devices. Discrete devices. Isolated power semiconductor devices
- BS EN 60191-6:2005 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages
- BS IEC 60747-14-1:2010 Semiconductor devices - Semiconductor sensors - Generic specification for sensors
- BS IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Optoelectronic devices - Semiconductor lasers
- BS EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
- 18/30363340 DC BS IEC 62779-4. Semiconductor devices. Semiconductor interface for human body communication. Part 4. Semiconductor interface for capsule endoscopy using human body communication
- BS IEC 62951-4:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
- BS EN 62779-3:2016 Semiconductor devices. Semiconductor interface for human body communication. Functional type and its operational conditions
- PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices
- BS IEC 60747-1:2006+A1:2010 Semiconductor devices - General
Indonesia Standards
- SNI 19-0429-1989 Guide for sampling of liquid and semi solid materials
Korean Agency for Technology and Standards (KATS)
- KS D 2717-2008(2018) Evaluation of metallic/semiconducting ratio of single-walled carbon nanotube soots using UV-VIS-NIR absorption spectroscopy
- KS C IEC 60748-11:2004 Semiconductor devices-Integrated circuits-Part 11:Sectional specification for semiconductor integrated circuits excluding hybrid circuits
- KS C IEC 60748-11-1-2020 Semiconductor devices-Integrated circuits-Part 11-1:Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
- KS C 2607-2002 TESTING METHODS OF SEMICONDUCTOR
- KS C IEC 60748-11-1:2004 Semiconductor devices-Integrated circuits-Part 11-1:Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
CZ-CSN
- CSN 35 8701-1975 Terminology of semiconductors and semiconductor devices
- CSN 35 8701 Z1-1997 Semiconductor naming
- CSN 35 1531-1973 Silicon semiconductor rectifiers
- CSN 35 8720 Cast.1-1987 Semiconductor devices. Dimensions
IN-BIS
- IS 5000 OD.11-1971 Semiconductor device size device outline OD11
- IS 5000 OB.4-1969 Basic overall dimensions of semiconductor devices OB4
- IS 5000 OB.1-1969 Basic overall dimensions of semiconductor devices OB1
- IS 5000 OD.1-1969 Semiconductor device size device outline OD1
- IS 5000 OD.6-1969 Semiconductor device size device outline OD6
- IS 5000 OB.7-1969 Basic overall dimensions of semiconductor devices OB7
- IS 5000 OD.2-1969 Semiconductor device size device outline OD2
- IS 5000 OD.16-1973 Semiconductor device size device outline OD16
- IS 5000 OD.4-1969 Semiconductor device size device outline OD4
- IS 5000 OD.31-1981 Semiconductor device size device outline OD31
- IS 5000 OD.9-1969 Semiconductor device size device outline OD9
- IS 5000 OD.10-1971 Semiconductor device size device outline OD1O
- IS 5000 OD.30-1981 Semiconductor device size device outline OD30
- IS 5000 OD.13-1971 Semiconductor device size device outline OD13
- IS 5000 OD.18-1974 Semiconductor device size device outline OD18
- IS 5000 OB.2-1969 Basic overall dimensions of semiconductor devices OB2
- IS 5000 OD.19-1974 Semiconductor device size device outline OD19
- IS 5000 OB.6-1969 Basic overall dimensions of semiconductor devices OB6
- IS 5000 OD.14-1971 Semiconductor device size device outline OD14
- IS 5000 OD.15-1973 Semiconductor device size device outline OD15
- IS 5000 OD.8-1969 Semiconductor device size device outline OD8
- IS 5000 OD.5-1969 Semiconductor device size device outline OD5
- IS 5000 OD.33-1981 Semiconductor device size device outline OD33
- IS 5000 OD.17-1974 Semiconductor device size device outline OD17
- IS 5000 OB.5-1969 Basic dimensions of semiconductor devices OB5
- IS 5000 OD.35-1981 Semiconductor device size device outline OD35
- IS 5000 OD.7-1969 Semiconductor device size device outline OD7
- IS 5000 OD.12-1971 Semiconductor device size device outline OD12
- IS 5000 OD.21-1979 Semiconductor device size device outline OD 21
- IS 5000 OD.36-1981 Semiconductor Device Dimensions Device Outline Figure 36
- IS 5000 OD.24-1979 Semiconductor device size device outline OD 24
- IS 5000 OD.28-1978 Semiconductor device size device outline OD 28
- IS 5000 OD.26-1978 Semiconductor device size device outline OD 26
- IS 5000 OD.29-1979 Semiconductor Device Dimensions Device Outline OD 29
- IS 5000 OD.22-1978 Semiconductor device size device outline OD 22
- IS 5000 OD.25-1978 Semiconductor device size device outline OD 25
- IS 5000 OD.20-1978 Semiconductor device size device outline OD 20
- IS 5000 OD.27-1978 Semiconductor Device Dimensions Device Outline OD 27
- IS 5000 OD.23-1978 Semiconductor device size device outline OD 23
- IS 5000 OD.37-1982 Semiconductor device size device outline size OD 37
PL-PKN
- PN T01305-1992 Semiconductor devices. Integrated circuits. Sectional specificatiion for semiconductor integrated circuits excluding hybrid circuits
SCC
- BS EN 60191-4:2000 Mechanical standardization of semiconductor devices-Coding system and classification into forms of package outlines for semiconductor device packages
- AS 1955.2:1978 Semiconductor convertors - Semiconductor self-commutated convertors
- BS 3934-4:1992 Mechanical standardization of semiconductor devices-Recommendations for a coding system and classification into forms of package outlines for semiconductor devices
- BS 3934-6:1992 Mechanical standardization of semiconductor devices-Specification for the preparation of outline drawings of surface mounted semiconductor device packages
- BS IEC 60747-14-3:2001 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-Pressure sensors
- BS IEC 60747-14-1:2000 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-General and classification-Sensor generals and classification for semiconductor sensors
- 12/30258683 DC BS EN 62779-1. Semiconductor devices. Semiconductor interface for human body communication. General requirements
- IEC 60146:1973 Semiconductor convertors
- CEI EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication Part 1: General requirements
- 12/30261676 DC BS EN 62779-2. Semiconductor devices. Semiconductor interface for human body communication. Characterization of interfacing performances
- DIN IEC 60747-14-5 E:2008 Draft Document - Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor (IEC 47E/353/CD:2007)
- IEC 60149-4:1987 Mechanical standardization of semiconductor devices - Part 4: Coding system and classificatioin into forms of package outlines for semiconductor devices
- 07/30164953 DC IEC 60747-14-5. Semiconductor devices. Discrete devices. Part 14-5. Semiconductor sensors. PN-junction semiconductor temperature sensor
- CEI EN 60191-6:2011 Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
- BS PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices
- MIL MIL-S-19500/530-1979 SEMICONDUCTOR DEVICE, TRANSISTOR, SILICON TYPE 2N3906
- MIL MIL-S-19500/529-1978 SEMICONDUCTOR DEVICE, TRANSISTOR, SILICON TYPE 2N3904
- BS IEC 60747-1:2006 Semiconductor devices. General
- MIL MIL-DTL-19491J-2014 Semiconductor Devices, Packaging of
- CEI EN 62258-1:2011 Semiconductor devices - Semiconductor die products Part 1: Procurement and use
- DANSK DS/EN 60191-6:2010 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
- AS C379.1:1970 Mechanical standardization of semiconductor devices - Preparation of drawings of semiconductor devices
- CEI EN 60191-4:2015 Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
- CEI EN 60191-4/A1:2015 Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
- DANSK DS/EN 60191-4:2014 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
(U.S.) Joint Electron Device Engineering Council Soild State Technology Association
- JEDEC JESD22-B118-2011 Semiconductor Wafer and Die Backside External Visual Inspection
German Institute for Standardization
- DIN 41885:1976 Cases type 101 for semiconductor devices; main dimensions
- DIN 41877:1971 Case 6 A 3 for semiconductor devices; main dimensions
- DIN IEC 60747-11:1992 Semiconductor devices; sectional specification for semiconductor devices; identical with IEC 60747-11:1985
- DIN EN 60191-4:2003 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999 + A1:2001 + A2:2002); German version EN 60191-4:1999 + A1:2002 + A2:2002
- DIN 41888:1976 Cases type 106 and 107 for semiconductor devices; main dimensions
- DIN 41871:1971 Cases 1 A 2 and 1 A 3 for semiconductor devices; main dimensions
- DIN 41884:1971 Case 118 A 2 for semiconductor devices; main dimensions
- DIN 41814-2:1976 Cases for semiconductor devices; cases type 160 to 168, main dimensions
Defense Logistics Agency
- DLA SMD-5962-88635 REV A-1993 MICROCIRCUIT, DIGITAL, CMOS UV ERASABLE, PROGRAMMABLE LOGIC DEVICE
- DLA SMD-5962-93144 REV B-2007 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, UV ERASABLE PROGRAMMABLE, LOGIC DEVICE, MONOLITHIC SILICON
- DLA SMD-5962-94510 REV A-2007 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, UV ERASEABLE PROGRAMMABLE LOGIC ARRAY, MONOLITHIC SILICON
- DLA SMD-5962-88549 REV A-1992 MICROCIRCUIT, DIGITAL, CMOS, UV ERASABLE PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON
- DLA SMD-5962-90989 REV A-2006 MICROCIRCUIT, MEMORY, DIGITAL, CMOS UV ERASABLE PROGRAMMABLE LOGIC ARRAY, MONOLITHIC SILICON
- DLA SMD-5962-91772-1993 MICROCIRCUIT, MEMORY, DIGITAL, CMOS UV ERASABLE PROGRAMMABLE LOGIC ARRAY, MONOLITHIC SILICON
- DLA SMD-5962-93248-1993 MICROCIRCUIT, MEMORY, DIGITAL, CMOS UV ERASABLE PROGRAMMABLE LOGIC ARRAY, MONOLITHIC SILICON
- DLA SMD-5962-88548 REV A-1992 MICROCIRCUIT, MEMORY, DIGITAL, CMOS UV ERASABLE PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON
- DLA SMD-5962-88678 REV B-2005 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, UV ERASABLE, PROGRAMMABLE LOGIC ARRAY, MONOLITHIC SILICON
- DLA SMD-5962-88726 REV E-2007 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, ULTRAVIOLET ERASABLE, PROGRAMMABLE LOGIC ARRAY, MONOLITHIC SILICON
- DLA SMD-5962-88724 REV D-2007 MICROCIRCUIT, DIGITAL, MEMORY, CMOS UV ERASABLE, PROGRAMMABLE LOGIC ARRAY, MONOLITHIC SILICON
- DLA MIL-DTL-19491 H-2002 SEMICONDUCTOR DEVICES, PACKAGING OF
- DLA SMD-5962-89469 REV B-1994 MICROCIRCUIT, MEMORY, DIGITAL, CMOS UV ERASABLE PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON
- DLA MIL-S-19500/529 VALID NOTICE 4-2011 Semiconductor Device, Transistor, Silicon Type 2N3904
- DLA SMD-5962-93245-1993 MICROCIRCUITS, DIGITAL, MEMORY, CMOS, EXTENDED VOLTAGE, UV ERASABLE, PROGRAMMABLE LOGIC ARRAY, MONOLITHIC SILICON
International Electrotechnical Commission (IEC)
- IEC 60747-14-11:2021 Semiconductor devices - Part 14-11: Semiconductor sensors - Test method of surface acoustic wave-based integrated sensors for measuring ultraviolet, illumination and temperature
- IEC 60747-14-5:2010 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
- IEC 60191-4:2013+AMD1:2018 CSV Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
- IEC 60747-14-2:2000 Semiconductor devices - Part 14-2: Semiconductor sensors; Hall elements
- IEC 62779-4:2020 Semiconductor devices - Semiconductor interface for human body communication - Part 4: Capsule endoscope
- IEC 60747-14-4:2011 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
- IEC 60191-4:1987 Mechanical standardization of semiconductor devices. Part 4 : Coding system and classification into forms of package outlines for semiconductor devices
- IEC 60747-14-1:2000 Semiconductor devices - Part 14-1: Semiconductor sensors; General and classification
- IEC 60747-15:2003 Discrete semiconductor devices - Part 15: Isolated power semiconductor devices
- IEC 60191-4:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
- IEC 60747-14-3:2001 Semiconductor devices - Part 14-3: Semiconductor sensors; Pressure sensors
- IEC 60191-4:2013 Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
- IEC 60747-5-4:2022 Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- IEC 60747-14-3:2009 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
- IEC 60191-4:2018 Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
- IEC 60191-4:1999 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
GSO
- GSO IEC 60747-14-5:2015 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
- OS GSO ISO 10677:2015 Fine ceramics (advanced ceramics, advanced technical ceramics) -- Ultraviolet light source for testing semiconducting photocatalytic materials
- GSO IEC 60747-15:2014 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- GSO ISO 10677:2015 Fine ceramics (advanced ceramics, advanced technical ceramics) -- Ultraviolet light source for testing semiconducting photocatalytic materials
- GSO IEC 60747-14-2:2014 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
- BH GSO IEC 60747-14-2:2016 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
- GSO IEC 62779-1:2021 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
- BH GSO IEC 62779-1:2022 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
- OS GSO IEC 60747-14-4:2014 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
- BH GSO IEC 60747-14-4:2016 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
KR-KS
- KS L ISO 10677-2023 Fine ceramics (advanced ceramics, advanced technical ceramics) — Ultraviolet light source for testing semiconducting photocatalytic materials
European Committee for Electrotechnical Standardization(CENELEC)
- EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
- EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
RU-GOST R
- GOST 23900-1987 Power semiconductor devices. Overall and mounting dimensions
- GOST 23448-1979 Semiconductor infra-red emitting diodes. Basic dimensions
- GOST 27591-1988 Power semiconductor modules. Orerall and mounting dimensions
- GOST R 50471-1993 Semiconductor photoemitters. Measuring method for halfintensity angle
NEMA - National Electrical Manufacturers Association
- NEMA CB-4:1989 Semiconductor Graphite
Danish Standards Foundation
- DS/EN 60191-4/A1:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
- DS/EN 60191-4/A2:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
- DS/EN 60191-4:2001 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
- DS/EN 60191-6:2010 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
JP-JEITA
- JEITA ED7500A-2-2006 Standard for the dimensions of semiconductor devices (Discrete semiconductor devices)
- JEITA ED 7300A-2008 Recommended practice on standard for the preparation of outline drawings of semiconductor package
National Fire Protection Association (NFPA)
- NFPA FPH SECTION 6-30-2003 Semiconductor Manufacturing
IEEE - The Institute of Electrical and Electronics Engineers@ Inc.
- IEEE 216-1960 STANDARDS ON SOLID STATE DEVICES: DEFINITIONS OF SEMICONDUCTOR TERMS
- IEEE 256-1963 SEMICONDUCTOR DIODES
- IEEE 59-1962 SEMICONDUCTOR RECTIFIER COMPONENTS
YU-JUS
- JUS N.R1.322-1979 Terms and definitions for semiconductor ?evices. Thyristors
ESDU - Engineering Sciences Data Unit
- ESDU 03016-2003 Selection of lubricant class (liquids@ solids@ semi-solids and gases)
Institute of Electrical and Electronics Engineers (IEEE)
- IEEE 216*61 IRE 28 S1 IEEE Standards on Solid-State Devices: Definitions of Semiconductor Terms 1960
- IEEE Std 216-1960 IRE Standards on Solid-State Devices: Definitions of Semiconductor Terms
ES-UNE
- UNE-EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements (Endorsed by AENOR in July of 2016.)
- UNE-EN 60191-6:2009 Mechanical standardization of semiconductor devices -- Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (Endorsed by AENOR in April of 2010.)
Lithuanian Standards Office
- LST EN 60191-4+A1-2002/A2-2002 Mechanical standardization of semiconductor devices. Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999/A2:2002)
- LST EN 60191-4+A1-2002 Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999+A1:2001)
HU-MSZT
- MSZ 9200/18-1980 Electronic signals. semiconductor
CENELEC - European Committee for Electrotechnical Standardization
- EN 60191-6:2004 Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
US-Unspecified Preparing Activity
- DI-QCIC-80924 A-2006 SEMICONDUCTOR PROCESS SPECIFICATION
BE-NBN
- NBN C 95-001-1977 Semiconductor equipment. the term
SE-SIS
- SIS SEN 01 03 51-1976 Semiconductor devices Terminology
- SIS SEN 01 03 51-1966 Semiconductor devices Terminology
ZA-SANS
- SANS 5730:2009 Antibacterial efficacy of solid and semi-solid antiseptics
Solid UV Spectroscopy,Solid UV absorption,Solid UV analysis,Solid UV %r,Solid UV quantitative,Solid UV Solid Instruments,Solid UV Computing,Test Solid UV,Solid UV analysis,Solid UV Instruments,Solid UV number,Solid UV f,Solid UV quantitative,solid material UV,Solid UV analysis,UV solid,solid ultraviolet semiconductor,solid UV liquid UV,solid material liquid uv solid uv,solid UV liquid UV