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Database: 365,228(8 Aug 2026)

solid ultraviolet semiconductor

solid ultraviolet semiconductor, Total:259 items.

The international standard classification for "solid ultraviolet semiconductor" includes: Optoelectronics. Laser equipment , Optics and optical measurements , Integrated circuits. Microelectronics , Semiconductor devices , Semiconductor devices in general , Semiconducting materials .

The Chinese standard classification for "solid ultraviolet semiconductor" includes: Technical management , Technical Management , Semiconductor emitting device , Technical management , Technical management , Optoelectronic device assembly , Inorganic chemicals in general , Microcircuit in general , Semiconductor triode , Semiconductor integrated circuit , Semiconductor discrete devices in general , Semimetal and semiconductor material in general , Power semiconductor device and parts , Petroleum products in general .


Professional Standard - Electron

  • SJ/T 10176-1991 Detail specification of metal rhomb package for semiconductor integrated circuits
  • SJ 2658.1-1986 Methods of Measurement for Semiconductor Infrared Diodes - General Rules
  • SJ/T 11395-2009 Semiconductor lighting terminology
  • SJ 20744-1999 General rule of infrared absorption spectral analysis for the impurity concentration in semiconductor materials
  • SJ 50033/41-1994 Detail specification for type GR9414 semiconductor infrared light emitting diode
  • SJ/T 10308-1992 Detail specification of ceramic flat package for semiconductor integrated circuits
  • SJ 2684-1986 Physical demensions for light emitting device of semiconductor
  • SJ 2247-1982 Outlines dimension for semiconductor optoelectronic devices
  • SJ/Z 9021.4-1987 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor devices
  • SJ/T 11818.3-2022 Semiconductor UV-emitting diodes Part 3: Device Specifications
  • SJ/T 11818.2-2022 Semiconductor UV Emitting Diodes Part 2: Chip Specifications
  • SJ 2750-1987 Outline dimensions for semiconductor laser diodes
  • SJ 2433-1984 Bonding sheet for semiconductor tubes
  • SJ/T 11818.1-2022 Semiconductor UV-emitting diodes Part 1: Test methods

Military Standard of the People's Republic of China-General Armament Department

  • GJB 8190-2015 General specification for semiconductor solid-state light sources for aircraft exterior lighting
  • GJB/Z 41.3-1993 Military semiconductor discrete device series spectrum semiconductor optoelectronic devices
  • GJB 1557-1992 Semiconductor discrete device microwave diode dimensions
  • GJB 33/15-2011 Semiconductor optoelectronic device.Detail specification for type BT401 semiconductor infrared-emitting diode
  • GJB 33/16-2011 Semiconductor optoelectronic device.Detail specification for type 3DU32 semiconductor phototransistor
  • GJB 1420B-2011 General specification for packages of semiconductor integrated circuits
  • GJB 1420A-1999 General Specification for Semiconductor Integrated Circuit Enclosures
  • GJB 923A-2004 General specification for packages of semiconductor discrete devices
  • GJB 1934A-2009 Cables,raido frequency,coaxial,semirigid,corrugated outer conductor,general specification for
  • GJB 1557A-2021 Semiconductor discrete device microwave diode dimensions
  • GJB 1934-1994 General specification for semi-rigid coaxial radio frequency cables with wrinkled outer conductors
  • GJB 1420/1-2000 Detailed specification for ceramic dual-row enclosures for semiconductor integrated circuits
  • GJB 923B-2021 General Specification for Semiconductor Discrete Device Enclosures

国家市场监督管理总局、中国国家标准化管理委员会

  • GB/T 15879.4-2019 Mechanical standardization of semiconductor devices—Part 4:Coding system and classification into forms of package outlines for semiconductor device packages
  • GB/T 7092-2021 Outline dimensions of semiconductor integrated circuits
  • GB/T 37131-2018 Nanotechnologies—Test method of semiconductor nanopowder using UV-Vis diffuse reflectance spectroscopy
  • GB/T 37031-2018 Semiconductor lighting terminology

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

  • GB/T 20522-2006 Semiconductor devices Part 14-3: Semiconductor sensors - Pressure sensors
  • GB/T 14264-2024 Terminology of semiconductor materials
  • GB/T 7581-1987 of outlines for semiconductor discrete devices
  • GB/T 37131-2018e Nanotechnologies—Test method of semiconductor nanopowder using UV-Vis diffuse reflectance spectroscopy
  • GB/T 20521-2006 Semconductor devices Part 14-1: Semiconductor sensors - General and classification
  • GB/T 14264-1993 Semiconductor materials-Terms and definitions
  • GB/T 37131-2018(英文版) Nanotechnology - Testing method of UV-visible diffuse reflectance spectrum of semiconductor nanopowder materials
  • GB/T 11493-1989 Blank detail specification of packages for semiconductor integrated circuits
  • GB/T 7092-1993 Outline dimensions of semiconductor integrated circuits
  • GB/T 14264-2009 Semiconductor materials - Terms and definitions

Group Standards of the People's Republic of China

机械工业部

Professional Standard - Machinery

  • JB/T 8175-1999 Outline dimensions of extruded heat sink for power semiconductor devices
  • JB/T 5631-1991 Epitaxial Furnace for Semiconductor Devices. Energy Efficiency Standard

Professional Standard - Aerospace

  • QJ 3006-1998 Solid surface (ship) to air missile semi-bomb test method

未注明发布机构

Taiwan Provincial Standard of the People's Republic of China

  • CNS 11900-1987 Fixed Ceramic Capacitors for Electronic Equipment (Semiconductor)

Professional Standard - Petrochemical Industry

Guangdong Provincial Standard of the People's Republic of China

工业和信息化部

Association Francaise de Normalisation

  • NF ISO 10677:2011 Céramiques techniques - Sources lumineuses UV destinée aux essais des matériaux photocatalytiques semi-conducteurs
  • NF B44-103*NF ISO 10677:2011 Fine ceramics (advanced ceramics, advanced technical ceramics) - Ultraviolet light source for testing semiconducting photocatalytic materials
  • NF C96-045:1992 Semiconductors devices. Integrated circuits. Part 11 : sectional specification for semiconducteur integrated circuits excluding hybrid circuits
  • NF C96-779-1*NF EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1 : general requirements
  • NF C96-015:2005 Discrete semiconductor devices - Part 15: isolated power semiconductor devices
  • NF C96-013-4*NF EN 60191-4:2014 Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages
  • NF EN 60191-6:2011 Mechanical standardization of semiconductor devices - Part 6: general rules for the preparation of outline drawings of packages for surface mount semiconductor devices
  • NF C96-013-4/A2*NF EN 60191-4/A2:2003 Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages.
  • NF C96-013-4*NF EN 60191-4:2000 Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages.

British Standards Institution (BSI)

  • BS IEC 60747-14-11:2021 Semiconductor devices - Semiconductor sensors. Test method of surface acoustic wave-based integrated sensors for measuring ultraviolet, illumination and temperature
  • 19/30390371 DC BS IEC 60747-14-11. Semiconductor devices. Part 14-11. Semiconductor sensors. Test method of surface acoustic wave based integrated sensor for measuring ultra violet, illumination and temperature
  • BS IEC 60747-14-5:2010 Semiconductor devices - Semiconductor sensors - PN-junction semiconductor temperature sensor
  • 18/30362458 DC BS IEC 60747-14-11. Semiconductor devices. Part 14-11. Semiconductor sensors. Test method of surface acoustic wave based integrated sensor for measuring ultra violet, illumination and temperature
  • BS IEC 60748-11:1991 Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits
  • BS IEC 60748-11:2000 Semiconductor devices - Integrated circuits - Sectional specification for semiconductor integrated circuits excluding hybrid circuits
  • BS IEC 60747-14-4:2011 Semiconductor devices. Discrete devices. Semiconductor accelerometers
  • BS IEC 60747-5-4:2022 Semiconductor devices - Optoelectronic devices. Semiconductor lasers
  • BS EN 62779-1:2016 Semiconductor devices. Semiconductor interface for human body communication. General requirements
  • BS IEC 60747-14-3:2009 Semiconductor devices - Semiconductor sensors - Pressure sensors
  • BS ISO 10677:2011 Fine ceramics (advanced ceramics, advanced technical ceramics). Ultraviolet light source for testing semiconducting photocatalytic materials
  • BS IEC 60747-14-2:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
  • BS IEC 60747-14-2:2000 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
  • BS EN 60747-15:2004 Discrete semiconductor devices. Isolated power semiconductor devices
  • BS IEC 60747-14-1:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - General and classification - Sensor generals and classification for semiconductor sensors
  • BS EN 60191-4:2014+A1:2018 Mechanical standardization of semiconductor devices - Coding system and classification into forms of package outlines for semiconductor device packages
  • BS EN 60191-4:2014 Mechanical standardization of semiconductor devices. Coding system and classification into forms of package outlines for semiconductor device packages
  • BS IEC 62779-4:2020 Semiconductor devices. Semiconductor interface for human body communication - Capsule endoscope
  • BS IEC 60747-6:2000 Discrete semiconductor devices and integrated circuits - Thyristors
  • BS IEC 60747-6:2001 Discrete semiconductor devices and integrated circuits - Thyristors
  • BS EN 60191-6:2004 Mechanical standardization of semiconductor devices-Part 6:General rules for the preparation of outline drawings of surface mounted semiconductor device packages
  • BS EN 60191-6:2010 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages
  • BS EN 60191-6:2009 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages
  • BS EN 62779-2:2016 Semiconductor devices. Semiconductor interface for human body communication. Characterization of interfacing performances
  • BS EN 60747-15:2012 Semiconductor devices. Discrete devices. Isolated power semiconductor devices
  • BS EN 60191-6:2005 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages
  • BS IEC 60747-14-1:2010 Semiconductor devices - Semiconductor sensors - Generic specification for sensors
  • BS IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Optoelectronic devices - Semiconductor lasers
  • BS EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
  • 18/30363340 DC BS IEC 62779-4. Semiconductor devices. Semiconductor interface for human body communication. Part 4. Semiconductor interface for capsule endoscopy using human body communication
  • BS IEC 62951-4:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
  • BS EN 62779-3:2016 Semiconductor devices. Semiconductor interface for human body communication. Functional type and its operational conditions
  • PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices
  • BS IEC 60747-1:2006+A1:2010 Semiconductor devices - General

Indonesia Standards

Korean Agency for Technology and Standards (KATS)

  • KS D 2717-2008(2018) Evaluation of metallic/semiconducting ratio of single-walled carbon nanotube soots using UV-VIS-NIR absorption spectroscopy
  • KS C IEC 60748-11:2004 Semiconductor devices-Integrated circuits-Part 11:Sectional specification for semiconductor integrated circuits excluding hybrid circuits
  • KS C IEC 60748-11-1-2020 Semiconductor devices-Integrated circuits-Part 11-1:Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
  • KS C 2607-2002 TESTING METHODS OF SEMICONDUCTOR
  • KS C IEC 60748-11-1:2004 Semiconductor devices-Integrated circuits-Part 11-1:Internal visual examination for semiconductor integrated circuits excluding hybrid circuits

CZ-CSN

IN-BIS

PL-PKN

  • PN T01305-1992 Semiconductor devices. Integrated circuits. Sectional specificatiion for semiconductor integrated circuits excluding hybrid circuits

SCC

  • BS EN 60191-4:2000 Mechanical standardization of semiconductor devices-Coding system and classification into forms of package outlines for semiconductor device packages
  • AS 1955.2:1978 Semiconductor convertors - Semiconductor self-commutated convertors
  • BS 3934-4:1992 Mechanical standardization of semiconductor devices-Recommendations for a coding system and classification into forms of package outlines for semiconductor devices
  • BS 3934-6:1992 Mechanical standardization of semiconductor devices-Specification for the preparation of outline drawings of surface mounted semiconductor device packages
  • BS IEC 60747-14-3:2001 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-Pressure sensors
  • BS IEC 60747-14-1:2000 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-General and classification-Sensor generals and classification for semiconductor sensors
  • 12/30258683 DC BS EN 62779-1. Semiconductor devices. Semiconductor interface for human body communication. General requirements
  • IEC 60146:1973 Semiconductor convertors
  • CEI EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication Part 1: General requirements
  • 12/30261676 DC BS EN 62779-2. Semiconductor devices. Semiconductor interface for human body communication. Characterization of interfacing performances
  • DIN IEC 60747-14-5 E:2008 Draft Document - Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor (IEC 47E/353/CD:2007)
  • IEC 60149-4:1987 Mechanical standardization of semiconductor devices - Part 4: Coding system and classificatioin into forms of package outlines for semiconductor devices
  • 07/30164953 DC IEC 60747-14-5. Semiconductor devices. Discrete devices. Part 14-5. Semiconductor sensors. PN-junction semiconductor temperature sensor
  • CEI EN 60191-6:2011 Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
  • BS PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices
  • MIL MIL-S-19500/530-1979 SEMICONDUCTOR DEVICE, TRANSISTOR, SILICON TYPE 2N3906
  • MIL MIL-S-19500/529-1978 SEMICONDUCTOR DEVICE, TRANSISTOR, SILICON TYPE 2N3904
  • BS IEC 60747-1:2006 Semiconductor devices. General
  • MIL MIL-DTL-19491J-2014 Semiconductor Devices, Packaging of
  • CEI EN 62258-1:2011 Semiconductor devices - Semiconductor die products Part 1: Procurement and use
  • DANSK DS/EN 60191-6:2010 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
  • AS C379.1:1970 Mechanical standardization of semiconductor devices - Preparation of drawings of semiconductor devices
  • CEI EN 60191-4:2015 Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
  • CEI EN 60191-4/A1:2015 Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
  • DANSK DS/EN 60191-4:2014 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

German Institute for Standardization

  • DIN 41885:1976 Cases type 101 for semiconductor devices; main dimensions
  • DIN 41877:1971 Case 6 A 3 for semiconductor devices; main dimensions
  • DIN IEC 60747-11:1992 Semiconductor devices; sectional specification for semiconductor devices; identical with IEC 60747-11:1985
  • DIN EN 60191-4:2003 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999 + A1:2001 + A2:2002); German version EN 60191-4:1999 + A1:2002 + A2:2002
  • DIN 41888:1976 Cases type 106 and 107 for semiconductor devices; main dimensions
  • DIN 41871:1971 Cases 1 A 2 and 1 A 3 for semiconductor devices; main dimensions
  • DIN 41884:1971 Case 118 A 2 for semiconductor devices; main dimensions
  • DIN 41814-2:1976 Cases for semiconductor devices; cases type 160 to 168, main dimensions

Defense Logistics Agency

International Electrotechnical Commission (IEC)

  • IEC 60747-14-11:2021 Semiconductor devices - Part 14-11: Semiconductor sensors - Test method of surface acoustic wave-based integrated sensors for measuring ultraviolet, illumination and temperature
  • IEC 60747-14-5:2010 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
  • IEC 60191-4:2013+AMD1:2018 CSV Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
  • IEC 60747-14-2:2000 Semiconductor devices - Part 14-2: Semiconductor sensors; Hall elements
  • IEC 62779-4:2020 Semiconductor devices - Semiconductor interface for human body communication - Part 4: Capsule endoscope
  • IEC 60747-14-4:2011 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
  • IEC 60191-4:1987 Mechanical standardization of semiconductor devices. Part 4 : Coding system and classification into forms of package outlines for semiconductor devices
  • IEC 60747-14-1:2000 Semiconductor devices - Part 14-1: Semiconductor sensors; General and classification
  • IEC 60747-15:2003 Discrete semiconductor devices - Part 15: Isolated power semiconductor devices
  • IEC 60191-4:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
  • IEC 60747-14-3:2001 Semiconductor devices - Part 14-3: Semiconductor sensors; Pressure sensors
  • IEC 60191-4:2013 Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
  • IEC 60747-5-4:2022 Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
  • IEC 60747-14-3:2009 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
  • IEC 60191-4:2018 Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
  • IEC 60191-4:1999 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

GSO

  • GSO IEC 60747-14-5:2015 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
  • OS GSO ISO 10677:2015 Fine ceramics (advanced ceramics, advanced technical ceramics) -- Ultraviolet light source for testing semiconducting photocatalytic materials
  • GSO IEC 60747-15:2014 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
  • GSO ISO 10677:2015 Fine ceramics (advanced ceramics, advanced technical ceramics) -- Ultraviolet light source for testing semiconducting photocatalytic materials
  • GSO IEC 60747-14-2:2014 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
  • BH GSO IEC 60747-14-2:2016 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
  • GSO IEC 62779-1:2021 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
  • BH GSO IEC 62779-1:2022 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
  • OS GSO IEC 60747-14-4:2014 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
  • BH GSO IEC 60747-14-4:2016 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers

KR-KS

  • KS L ISO 10677-2023 Fine ceramics (advanced ceramics, advanced technical ceramics) — Ultraviolet light source for testing semiconducting photocatalytic materials

European Committee for Electrotechnical Standardization(CENELEC)

  • EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
  • EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements

RU-GOST R

  • GOST 23900-1987 Power semiconductor devices. Overall and mounting dimensions
  • GOST 23448-1979 Semiconductor infra-red emitting diodes. Basic dimensions
  • GOST 27591-1988 Power semiconductor modules. Orerall and mounting dimensions
  • GOST R 50471-1993 Semiconductor photoemitters. Measuring method for halfintensity angle

NEMA - National Electrical Manufacturers Association

Danish Standards Foundation

  • DS/EN 60191-4/A1:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
  • DS/EN 60191-4/A2:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
  • DS/EN 60191-4:2001 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
  • DS/EN 60191-6:2010 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

JP-JEITA

  • JEITA ED7500A-2-2006 Standard for the dimensions of semiconductor devices (Discrete semiconductor devices)
  • JEITA ED 7300A-2008 Recommended practice on standard for the preparation of outline drawings of semiconductor package

National Fire Protection Association (NFPA)

IEEE - The Institute of Electrical and Electronics Engineers@ Inc.

YU-JUS

ESDU - Engineering Sciences Data Unit

  • ESDU 03016-2003 Selection of lubricant class (liquids@ solids@ semi-solids and gases)

Institute of Electrical and Electronics Engineers (IEEE)

  • IEEE 216*61 IRE 28 S1 IEEE Standards on Solid-State Devices: Definitions of Semiconductor Terms 1960
  • IEEE Std 216-1960 IRE Standards on Solid-State Devices: Definitions of Semiconductor Terms

ES-UNE

  • UNE-EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements (Endorsed by AENOR in July of 2016.)
  • UNE-EN 60191-6:2009 Mechanical standardization of semiconductor devices -- Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (Endorsed by AENOR in April of 2010.)

Lithuanian Standards Office

  • LST EN 60191-4+A1-2002/A2-2002 Mechanical standardization of semiconductor devices. Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999/A2:2002)
  • LST EN 60191-4+A1-2002 Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999+A1:2001)

HU-MSZT

CENELEC - European Committee for Electrotechnical Standardization

  • EN 60191-6:2004 Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

US-Unspecified Preparing Activity

BE-NBN

SE-SIS

ZA-SANS

  • SANS 5730:2009 Antibacterial efficacy of solid and semi-solid antiseptics