Semiconductor Magnetic
Semiconductor Magnetic, Total:171 items.
The international standard classification for "Semiconductor Magnetic" includes: Motors , Electricity. Magnetism. Electrical and magnetic measurements , Semiconductor devices in general , Semiconducting materials , Optoelectronics. Laser equipment , Electronic components in general .
The Chinese standard classification for "Semiconductor Magnetic" includes: Electronic industry production equipment in general , Electric drive control equipment , Electronic measurement and equipment in general , Semiconductor discrete devices in general , Semimetal and semiconductor material in general , Technical management , Optoelectronic device assembly , Reliability and maintainability .
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
- GB/T 20521-2006 Semconductor devices Part 14-1: Semiconductor sensors - General and classification
- GB/T 3859.2-1993 Semiconductor convertors Application guide
- GB/T 20522-2006 Semiconductor devices Part 14-3: Semiconductor sensors - Pressure sensors
- GB/T 14264-1993 Semiconductor materials-Terms and definitions
- GB/T 14264-2024 Terminology of semiconductor materials
- GB/T 12667-2012 General specification for excitation assembly with semiconductors for synchronous motors
- GB/T 30116-2013 Requirements for Semiconductor Manufacturing Facility Electromagnetic Compatibility
- GB/T 12667-1990 General specification for excitation assembly with semiconductor for synchronous motor
- GB/T 13973-2012 General specification test methods for semiconductor device curve tracers
- GB/T 14264-2009 Semiconductor materials - Terms and definitions
- GB/T 13974-1992 methods for semiconductor device curve tracers
Professional Standard - Electron
- SJ 2433-1984 Bonding sheet for semiconductor tubes
- SJ/T 11395-2009 Semiconductor lighting terminology
- SJ 2073-1982 Cores for IF transformers and medium wave oscillator coil of transistor radio receivers
- SJ/T 10229-1991 Graphic instrument for characteristics of semiconductor tubes for Type XJ4810
Hebei Provincial Standard of the People's Republic of China
- DB13/T 5293-2020 Specifications for Maintenance of Semiconductor Characteristic Tracer
Military Standard of the People's Republic of China-General Armament Department
- GJB/Z 41.3-1993 Military semiconductor discrete device series spectrum semiconductor optoelectronic devices
- GJB 33/16-2011 Semiconductor optoelectronic device.Detail specification for type 3DU32 semiconductor phototransistor
- GJB 33/17-2011 Semiconductor optoelectronic device.Detail specification for type GO11 semiconductor photocoupler
National Metrological Technical Specifications of the People's Republic of China
- JJF 1236-2010 Calibration Specification for Semiconductor Device Curve Tracers
Guangdong Provincial Standard of the People's Republic of China
- DB44/T 1873-2016 semiconductor refrigeration wine cabinet
Group Standards of the People's Republic of China
- T/QGCML 4031-2024 Semiconductor optical wafer
- T/JSXH 0002-2020 Regeneration solution for semiconductor
- T/CIE 144-2022 Reliability enhancement test of semiconductor devices
国家市场监督管理总局、中国国家标准化管理委员会
- GB/T 37031-2018 Semiconductor lighting terminology
工业和信息化部
- QB/T 5369-2019 Semiconductor refrigeration appliance
Semiconductor Equipment and Materials International (SEMI)
- SEMI E33-94 SPECIFICATION FOR SEMICONDUCTOR MANUFACTURING FACILITY ELECTROMAGNETIC COMPATIBILITY
German Institute for Standardization
- DIN V VDE V 0884-10:2006 Semiconductor devices - Magnetic and capacitive couplers for safe isolation
- DIN EN IEC 63287-1:2020-06 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for LSI reliability qualification (IEC 47/2614/CDV:2020); German and English version prEN IEC 63287-1:2020 / Note: Date of issue 2020-05-08*Intended as replacem...
- DIN IEC 60747-11:1992 Semiconductor devices; sectional specification for semiconductor devices; identical with IEC 60747-11:1985
- DIN EN 60747-15:2012-08 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (IEC 60747-15:2010); German version EN 60747-15:2012 / Note: DIN EN 60747-15 (2004-08) remains valid alongside this standard until 2014-01-20.
British Standards Institution (BSI)
- BS IEC 62951-4:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
- BS IEC 62951-7:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor
- BS EN 62779-2:2016 Semiconductor devices. Semiconductor interface for human body communication. Characterization of interfacing performances
- BS IEC 60747-14-5:2010 Semiconductor devices - Semiconductor sensors - PN-junction semiconductor temperature sensor
- BS IEC 62951-5:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for thermal characteristics of flexible materials
- BS EN IEC 60747-17:2020 Semiconductor devices. Magnetic and capacitive coupler for basic and reinforced insulation
- BS EN 62830-3:2017 Semiconductor devices. Semiconductor devices for energy harvesting and generation - Vibration based electromagnetic energy harvesting
- BS EN IEC 63287-1:2021 Semiconductor devices. Generic semiconductor qualification guidelines - Guidelines for IC reliability qualification
- BS IEC 62951-6:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for sheet resistance of flexible conducting films
- BS IEC 60747-14-4:2011 Semiconductor devices. Discrete devices. Semiconductor accelerometers
- BS IEC 60747-5-4:2022 Semiconductor devices - Optoelectronic devices. Semiconductor lasers
- BS IEC 62951-1:2017 Semiconductor devices. Flexible and stretchable semiconductor devices - Bending test method for conductive thin films on flexible substrates
- BS IEC 60747-14-3:2009 Semiconductor devices - Semiconductor sensors - Pressure sensors
- BS IEC 62830-3:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation. - Part 3: Vibration based electromagnetic energy harvesting
- BS IEC 60747-14-2:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
- BS PD IEC TR 63304:2021 Permanent magnet (magnetically hard) materials. Methods of measurement of magnetic properties in an open magnetic circuit using a superconducting magnet
- BS IEC 60747-14-2:2000 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
- 23/30478757 DC BS EN IEC 63287-3. Semiconductor devices. Generic semiconductor qualification guidelines - Part 3. Guidelines for reliability qualification plans for power semiconductor module
- BS EN 60747-15:2004 Discrete semiconductor devices. Isolated power semiconductor devices
- BS EN 62779-1:2016 Semiconductor devices. Semiconductor interface for human body communication. General requirements
- BS IEC 60747-14-1:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - General and classification - Sensor generals and classification for semiconductor sensors
- BS DD IEC/PAS 60747-17:2011 Semiconductor devices. Discrete devices. Magnetic and capacitive coupler for basic and reinforced isolation
- BS IEC 60747-6:2001 Discrete semiconductor devices and integrated circuits - Thyristors
- BS IEC 62951-3:2018 Semiconductor devices. Flexible and stretchable semiconductor devices - Evaluation of thin film transistor characteristics on flexible substrates under bulging
- BS IEC 60747-6:2000 Discrete semiconductor devices and integrated circuits - Thyristors
- BS IEC 62951-8:2023 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for stretchability, flexibility, and stability of flexible resistive memory
- BS EN 60747-15:2012 Semiconductor devices. Discrete devices. Isolated power semiconductor devices
- BS IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Optoelectronic devices - Semiconductor lasers
- BS IEC 60747-14-10:2019 Semiconductor devices. Semiconductor sensors. Performance evaluation methods for wearable glucose sensors
- BS IEC 60747-14-1:2010 Semiconductor devices - Semiconductor sensors - Generic specification for sensors
- BS IEC 62779-4:2020 Semiconductor devices. Semiconductor interface for human body communication - Capsule endoscope
- BS IEC 62951-9:2022 Semiconductor devices. Flexible and stretchable semiconductor devices - Performance testing methods of one transistor and one resistor (1T1R) resistive memory cells
- 14/30297227 DC BS EN 62880-1. Semiconductor devices. Wafer level reliability for semiconductor devices. Copper stress migration test method
- PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices
- BS EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
- BS IEC 60747-1:2006+A1:2010 Semiconductor devices - General
- BS IEC 62830-7:2021 Semiconductor devices. Semiconductor devices for energy harvesting and generation. Linear sliding mode triboelectric energy harvesting
- 18/30363340 DC BS IEC 62779-4. Semiconductor devices. Semiconductor interface for human body communication. Part 4. Semiconductor interface for capsule endoscopy using human body communication
- PD IEC TR 63304:2021 Permanent magnet (magnetically hard) materials. Methods of measurement of magnetic properties in an open magnetic circuit using a superconducting magnet
SCC
- 12/30261676 DC BS EN 62779-2. Semiconductor devices. Semiconductor interface for human body communication. Characterization of interfacing performances
- CEI EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication Part 2: Characterization of interfacing performances
- BS IEC 60747-14-3:2001 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-Pressure sensors
- BS IEC 60747-14-1:2000 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-General and classification-Sensor generals and classification for semiconductor sensors
- IEC 60146:1973 Semiconductor convertors
- CEI EN IEC 63287-1:2022 Semiconductor devices - Generic semiconductor qualification guidelines Part 1: Guidelines for IC reliability qualification
- DIN IEC 60747-14-5 E:2008 Draft Document - Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor (IEC 47E/353/CD:2007)
- AENOR UNE 21017:1959 BARE, SEMI-RIGID COPPER CABLES FOR ELECTRICAL CONDUCTORS
- 12/30258683 DC BS EN 62779-1. Semiconductor devices. Semiconductor interface for human body communication. General requirements
- DANSK DS/EN IEC 63287-1:2021 Semiconductor devices – Generic semiconductor qualification guidelines – Part 1: Guidelines for IC reliability qualification
- CEI EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication Part 1: General requirements
- BS PD IEC/TR 63133:2017 Semiconductor devices. Scan based ageing level estimation for semiconductor devices
- 07/30164953 DC IEC 60747-14-5. Semiconductor devices. Discrete devices. Part 14-5. Semiconductor sensors. PN-junction semiconductor temperature sensor
- CEI EN 62258-1:2011 Semiconductor devices - Semiconductor die products Part 1: Procurement and use
- MIL MIL-DTL-19491J-2014 Semiconductor Devices, Packaging of
- BS IEC 60747-1:2006 Semiconductor devices. General
International Electrotechnical Commission (IEC)
- IEC 62951-4:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
- IEC 62830-3:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting
- IEC 60747-14-5:2010 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
- IEC 63287-1:2021 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification
- IEC 62951-5:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials
- IEC 60747-17:2020 Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation
- IEC 62951-6:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films
- IEC 62951-1:2017 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates
- IEC 62951-3:2018 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 3: Evaluation of thin film transistor characteristics on flexible substrates under bulging
- IEC 60747-17:2020/COR1:2021 Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation; Corrigendum 1
- IEC 60747-14-2:2000 Semiconductor devices - Part 14-2: Semiconductor sensors; Hall elements
- IEC 60747-14-4:2011 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
- IEC PAS 60747-17:2011 Semiconductor devices - Discrete devices - Part 17: Magnetic and capacitive coupler for basic and reinforced isolation
- IEC 60747-14-1:2000 Semiconductor devices - Part 14-1: Semiconductor sensors; General and classification
- IEC 60747-15:2003 Discrete semiconductor devices - Part 15: Isolated power semiconductor devices
- IEC 60747-14-3:2001 Semiconductor devices - Part 14-3: Semiconductor sensors; Pressure sensors
- IEC 60747-14-3:2009 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
- IEC 62779-4:2020 Semiconductor devices - Semiconductor interface for human body communication - Part 4: Capsule endoscope
- IEC TR 63304:2021 Methods of measurement of the magnetic properties of permanent magnet (magnetically hard) materials in an open magnetic circuit using a superconducting magnet
- IEC 60747-5-4:2022 Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
VDE - VDE Verlag GmbH@ Berlin@ Germany
- VDE V 0884-10-2006 Semiconductor devices - Magnetic and capacitive couplers for safe isolation
CZ-CSN
- CSN 35 8701-1975 Terminology of semiconductors and semiconductor devices
- CSN 35 8701 Z1-1997 Semiconductor naming
- CSN 35 1531-1973 Silicon semiconductor rectifiers
- CSN 35 8720 Cast.1-1987 Semiconductor devices. Dimensions
YU-JUS
- JUS A.A4.302-1990 Tabular layouts ofarticle characteristics for semiconductor diodes
- JUS N.R1.322-1979 Terms and definitions for semiconductor ?evices. Thyristors
IEC - International Electrotechnical Commission
- IEC 62951-7:2019 Semiconductor devices – Flexible and stretchable semiconductor devices – Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor (Edition 1.0)
- IEC 62779-2:2016 Dispositifs à semiconducteurs – Interface à semiconducteurs pour les communications via le corps humain – Partie 2: Caractérisation des performances d'interfa?age (Edition 1.0)
- IEC 60146-2:1974 Semiconductor Convertors Part 2: Semiconductor Self-Commutated Convertors (Edition 1.0)
HU-MSZT
- MSZ 771/5-1979 Mechanical properties of semiconductor materials
- MSZ 9200/18-1980 Electronic signals. semiconductor
GSO
- GSO IEC 60747-14-5:2015 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
- GSO IEC 62779-2:2021 Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
- GSO IEC 60747-15:2014 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- GSO IEC 63287-1:2024 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification
- GSO IEC 62830-3:2021 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting
- BH GSO IEC 62830-3:2022 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting
- GSO IEC 60747-14-2:2014 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
- BH GSO IEC 60747-14-2:2016 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
- OS GSO IEC 60747-14-4:2014 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
- BH GSO IEC 60747-14-4:2016 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
- OS GSO IEC 60747-14-3:2014 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
- BH GSO IEC 60747-15:2016 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- BH GSO IEC 60747-14-10:2022 Semiconductor devices - Part 14-10: Semiconductor sensors - Performance evaluation methods for wearable glucose sensors
Standard Association of Australia (SAA)
- AS 1955.2:1978 Semiconductor convertors - Semiconductor self-commutated convertors
- AS 1054:1973 Electromagnetic interference limits and measurements for semiconductor control devices
- AS C379.1:1970 Mechanical standardization of semiconductor devices - Preparation of drawings of semiconductor devices
Spanish Association for Standardization (UNE)
- UNE-EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances (Endorsed by AENOR in July of 2016.)
- UNE-EN IEC 63287-1:2021 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification (Endorsed by Asociación Española de Normalización in November of 2021.)
Association Francaise de Normalisation
- NF C96-779-2*NF EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 2 : characterization of interfacing performances
- NF C96-287-1*NF EN IEC 63287-1:2021 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1 : guidelines for IC reliability qualification
- NF EN 62779-2:2016 Dispositifs à semiconducteurs - Interface à semiconducteurs pour les communications via le corps humain - Partie 2 : caractérisation des performances d'interfaçage
- NF EN IEC 63287-1:2021 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Integrated circuit reliability qualification guidelines
- NF C96-017:2020 Semiconductor devices - Part 17 : magnetic and capacitive coupler for basic and reinforced insulation
- NF C96-015:2005 Discrete semiconductor devices - Part 15: isolated power semiconductor devices
- NF C96-779-1*NF EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1 : general requirements
European Committee for Electrotechnical Standardization(CENELEC)
- EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
- EN IEC 63287-1:2021 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification
- EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
- EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
JP-JEITA
- JEITA ED7500A-2-2006 Standard for the dimensions of semiconductor devices (Discrete semiconductor devices)
NEMA - National Electrical Manufacturers Association
- NEMA CB-4:1989 Semiconductor Graphite
National Fire Protection Association (NFPA)
- NFPA FPH SECTION 6-30-2003 Semiconductor Manufacturing
Danish Standards Foundation
- DS/EN IEC 63287-1:2021 Semiconductor devices – Generic semiconductor qualification guidelines – Part 1: Guidelines for IC reliability qualification
- DS/EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
Korean Agency for Technology and Standards (KATS)
- KS C IEC 62951-1:2022 Semiconductor devices — Flexible and stretchable semiconductor devices — Part 1: Bending test method for conductive thin films on flexible substrates
- KS C 2607-2002 TESTING METHODS OF SEMICONDUCTOR
- KS C 5212-1981(2002) GENERAL RULES FOR RELIABILITY ASSURED DISCRETE SEMICONDUCTOR DEVICES
- KS C 5212-1981 GENERAL RULES FOR RELIABILITY ASSURED DISCRETE SEMICONDUCTOR DEVICES
- KS C IEC 60747-14-1:2003 Semiconductor devices-Part 14-1:Semiconductor sensors-General and classification
- KS C IEC 60747-14-1:2021 Semiconductor devices — Part 14-1: Semiconductor sensors — Generic specification for sensors
KR-KS
- KS C IEC 62951-1-2022 Semiconductor devices — Flexible and stretchable semiconductor devices — Part 1: Bending test method for conductive thin films on flexible substrates
IEEE - The Institute of Electrical and Electronics Engineers@ Inc.
- IEEE 256-1963 SEMICONDUCTOR DIODES
- IEEE 59-1962 SEMICONDUCTOR RECTIFIER COMPONENTS
RU-GOST R
- GOST 24688-1981 Static semiconductor exciters for three-phase synchronous engines. General technical requirements
(U.S.) Joint Electron Device Engineering Council Soild State Technology Association
- JEDEC JESD30E-2008 Descriptive Designation System for Semiconductor-device Packages
American National Standards Institute (ANSI)
- ANSI/UL 1557-2013 Standard for Safety for Electrically Isolated Semiconductor Devices
RO-ASRO
- STAS 6693/2-1975 Semiconductor devices TRANSISTORS Methods for measuring electrical properties
Japanese Industrial Standards Committee (JISC)
- JIS C 2500:2022 Methods of measurement of the magnetic properties of permanent magnet (magnetically hard) materials in an open magnetic circuit using a superconducting magnet
SE-SIS
- SIS SEN 01 03 51-1976 Semiconductor devices Terminology
- SIS SEN 01 03 51-1966 Semiconductor devices Terminology
Defense Logistics Agency
- DLA MIL-DTL-19491 H-2002 SEMICONDUCTOR DEVICES, PACKAGING OF
BE-NBN
- NBN C 95-001-1977 Semiconductor equipment. the term
US-Unspecified Preparing Activity
- DI-QCIC-80924 A-2006 SEMICONDUCTOR PROCESS SPECIFICATION
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