GB/T 4937.11-2018 in English

This standard outlines procedures for testing semiconductor devices under mechanical and climatic conditions. Specifically, it focuses on the method of rapid temperature change using a dual liquid bath. The test is designed to evaluate the performance and reliability of semiconductor devices when subjected to sudden temperature variations. The methodology involves exposing the device to alternating temperatures in two separate liquid baths, allowing for the assessment of thermal stress effects. The standard provides detailed guidelines on test conditions, equipment requirements, and procedures to ensure consistent and reproducible results. It serves as a reference for manufacturers and testing laboratories to conduct standardized evaluations of semiconductor devices.