GB/T 5489-2018 in English
VALIDPrinted circuit board draw
- Issued on:2018-09-17
- Implemented on:2019-04-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
$243.00
| Standard No: | GB/T 5489-2018 |
| Document status: | VALID |
| Title in English: | Printed circuit board draw |
| Title in Chinese: | 印制板制图 |
| Language: | English |
| File Format: | Electronic (PDF) |
| Delivery: | Via email within 1~3 business days |
| Issued on: | 2018-09-17 |
| Implemented on: | 2019-04-01 |
| Superseding: |
GB/T 5489-1985 Printed board drawing
|
| ICS Classification: | 31.180-Printed circuits and boards |
| Chinese Classification: | L30-Printed circuit |
| Professional Classification: | GB-National Standard |
| Related Topics: | Printed board industry
Printed board definition printed board board diagram GBT5489 GB/T 5489-1985 GB/T 5489-2018 mapping Printed board inductor |
《GB/T 5489-2018印制板制图》由TC47(全国印制电路标准化技术委员会)归口,主管部门为工业和信息化部(电子)。
Introduction
In-depth interpretation of GB/T 5489—2018 Printed Circuit Board Drawing Standard
| Standard Dimensions | Technical Requirements | Implementation Suggestions | Comparative Analysis |
|---|---|---|---|
| Annotation Method | The dimension line method, grid method and hybrid method are used in combination to ensure the accuracy and clarity of dimensioning. | The dimension line method is preferred, the grid method is used for complex structures, and the hybrid method is suitable for multi-layer board design. | Compared with the old standard, the specific requirements of the grid method and hybrid method are added, and the annotation flexibility is significantly improved. |
| Conductive graphics | Draw with double-line outline or coloring method, and indicate the dimension data such as wire width and spacing; large-area conductive areas and isolation areas need to be specially marked. | Choose the appropriate drawing method according to the complexity of the board layer; ensure that the marking of key dimensions meets the manufacturing tolerance requirements. | New requirements for the inner isolation area and isolation plate of multi-layer boards have been added, further improving the standardization of graphic drawing. |
| Solder mask graphics | The size of the solder mask pad needs to consider parameters such as aperture and ring width; the shape of the pad is selected according to the wiring density to ensure that the risk of short circuit is avoided. | High-density design gives priority to round or square pads; special-shaped holes and special packaging devices require customized processing. | The simple solder mask pattern in the old standard has been refined, and a variety of shapes and calculation formulas have been added to meet the needs of modern manufacturing. |
Explanation of professional terms and practical application cases
Grid Method: Dimensioning is done by using rectangular coordinates or polar coordinates, which is suitable for dimensioning complex printed circuit board graphics. For example, in multi-layer board design, the grid method can more clearly express the relative position relationship between layers.
Solder Mask Pattern: A key structure used to prevent short circuits between wires. In practical applications, high-density wiring areas usually use cut circular or elliptical pads to optimize space utilization and reduce welding risks.
Via Position Drawing: A drawing method that includes circular holes and special-shaped holes. For example, in drilling manufacturing, special-shaped holes need to be accurately marked with six parameter values to ensure processing accuracy and position accuracy.
Implementation suggestions
1. Design stage:
- Preferentially use automatic CAD tools for drawing to ensure the overlap accuracy of each layer of graphics.
- Choose the appropriate marking method (dimension line method, grid method or mixed method) according to the number of layers and complexity of the board.
- Use fine marking in high-density areas to avoid conductive graphics covering character graphics.
2. Manufacturing stage:
- Strictly follow the standard requirements for drilling and solder mask processes to ensure that parameters such as hole diameter and ring width meet the design requirements.
- Check the multi-layer board layer by layer to ensure that the dimensions of the isolation area and isolation plate are accurate.
- Use optical positioning marks to ensure the accuracy of surface mounted components.
3. Inspection stage:
- Focus on checking the hole pattern and solder mask pattern to ensure that the hole diameter classification is clear and the solder mask film is fully covered.
- Use professional testing equipment to verify whether the minimum spacing of the conductive pattern and the distance of the isolation area meet the requirements.

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