JR/T 0098.1-2012 in English
VALIDChina Financial Mobile Payment-Test Specifications-Part 1:Mobile Device Contactless Interface
- Issued on:2012-12-12
- Implemented on:2012-12-12
- File Format:PDF
- Delivery:Via email within 1~3 business days
$117.00
| Standard No: | JR/T 0098.1-2012 |
| Document status: | VALID |
| Title in English: | China Financial Mobile Payment-Test Specifications-Part 1:Mobile Device Contactless Interface |
| Title in Chinese: | 中国金融移动支付 检测规范 第1部分：移动终端非接触式接口 |
| Language: | English |
| File Format: | Electronic (PDF) |
| Delivery: | Via email within 1~3 business days |
| Issued on: | 2012-12-12 |
| Implemented on: | 2012-12-12 |
| Professional Classification: | JR-Finance |
| Related Topics: | shift
mobile payment Test gauge Test gauge jr/t+0074-2012 jr/t 0071-2012 China Mobile China Gold National Finance jr/t0074-2012 mobile terminal Non-contact mobility tester JR/t China Mobile Vibration Experiment Mobile Spectral Detection China Financial Mobile Payment jr/t 0099-2012 |
Introduction
Standard Core Framework
| Test Dimensions | International Standard Reference | China-specific Requirements | Detection Accuracy |
|---|---|---|---|
| Electrical Characteristics | ISO/IEC 14443 | Field Strength Range2.33-7.5A/m | ±0.01A/m |
| Communication Protocol | EMV Contactless | Mandatory SWP Interface Support | 100% Instruction Coverage |
| Transaction Performance | PBOC 3.0 | 500ms timeout limit | 1ms sampling accuracy |
Key Technology Analysis
1. Electrical Characteristics of Contactless Interface
The standard requires that the load modulation amplitude of PICC at the dual frequencies of 12.7125MHz and 14.4075MHz must meet the dynamic field strength compensation. The 9-level field strength test specified in Table 2 covers typical scenarios of mobile payment:
- Minimum field strength 2.33A/m corresponds to weak field environments such as subway gates
- Base field strength 3.5A/m meets the requirements of JR/T 0025.12
- Peak field strength 7.5A/m ensures stability under extreme interference
2. Multi-environment compatibility test
The standard innovatively defines three types of test environments:
Typical case: The smart SD card based on the SWP interface must pass the CLF chip induction power test in environment two (no battery power supply), and its energy conversion efficiency must be ≥65%.
Implementation Recommendations
1. Key points for manufacturer compliance
- Give priority to SE security chips that have passed SAC/TC180 certification
- A 15% design margin should be reserved for the load modulation circuit
- The transaction timeout mechanism must be implemented at the hardware level
2. Notes for testing agencies
- Environment III test needs to be performed simultaneously with GSM/CDMA communication interference
- Dual-interface (U)SIM cards require additional testing of 13.56MHz harmonic suppression
- All terminal devices should verify the HCI protocol consistency of NFC and SE
Analysis of standard evolution
Compared with the 2010 draft, this version has the following major upgrades:
- Added optional test path for dual-interface SIM card
- Tightened transaction timeout from 800ms to 500ms
- Clarified temperature compensation formula for working field strength
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