SJ 2425-1983 in English
VALIDMethods for tensile testing of fine metal wires
- Issued on:1983-12-05
- Implemented on:1984-10-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
$30.00
Scope
This standard is applicable to the normal temperature static tensile test method for metal and alloy filaments with a diameter equal to or less than 0.12 mm used for semiconductor device bonding wires.

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