SJ/T 11273-2002 in English

本标准规定了电子焊接用免清洗液态助焊剂的技术要求，试验方法、检验规则和产品的标志、包装、运输、贮存。本标准适用于印制板组装件及电气和电子电路接点锡焊用免清洗液态助焊剂。使用免清洗液态助焊剂时，对具有预涂保护层印制板组装的焊接，建议选用与其配套的预涂覆材料。

Scope

This standard specifies the technical requirements, test methods, inspection rules and product marking, packaging, transportation and storage of no-clean liquid flux for electronic welding. This standard applies to no-clean liquid flux for soldering of printed board assemblies and electrical and electronic circuit contacts. When using no-clean liquid flux, it is recommended to use matching pre-coating materials for welding printed circuit boards with pre-coated protective layers.