YS/T 747-2010 in English

VALID

Lead-free tin-based solder

Issued on:2010-11-22
Implemented on:2011-03-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $150.00
$146.00

Standard No:	YS/T 747-2010
Document status:	VALID
Title in English:	Lead-free tin-based solder
Title in Chinese:	无铅锡基焊料
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	2010-11-22
Implemented on:	2011-03-01
ICS Classification:	77.120.60-Lead, zinc, tin and their alloys
Chinese Classification:	H62-Heavy metals and their alloys
Professional Classification:	YS-Non-ferrous Metal
Related Keywords:	lead-free tin-based solder scopethis standard lead-free tin-based solder order order product requirements solder
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本标准规定了无铅锡基焊料的产品要求、试验方法、检验规则、包装、标识、储存和运输、合同(或订货单)要求等内容。
本标准适用于金属锡为主要成份，不添加助焊剂，按不同组分加入锌、铜、锑、银、铋、镍、铟等配制，经铸造或机械加工而成的合金焊料。

Scope

This standard specifies the product requirements, test methods, inspection rules, packaging, labeling, storage and transportation, contract (or order order) requirements, etc. for lead-free tin-based solder. This standard is applicable to alloy solders with metal tin as the main component, no flux added, zinc, copper, antimony, silver, bismuth, nickel, indium, etc. added according to different components, and cast or machined.

More samples: NB/T 47013.2-2015 GB 50021-2001(2009) GB 18306-2015

Sample only — not a preview of YS/T 747-2010