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Solder height

Solder height, Total:114 items.

The international standard classification for "Solder height" includes: Printed circuits and boards , Semiconducting materials , Lead, zinc and tin products , Lead, zinc, tin and their alloys .

The Chinese standard classification for "Solder height" includes: Printed circuit , Metal physical property test method , Metal and alloy powder , Special electronic technology material , Heavy metals and their alloys , Technical Management .


Taiwan Provincial Standard of the People's Republic of China

Group Standards of the People's Republic of China

国家市场监督管理总局、中国国家标准化管理委员会

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

Professional Standard - Non-ferrous Metal

Professional Standard - Electron

Professional Standard - Aerospace

工业和信息化部

RO-ASRO

  • STAS 12126-1982 SOLDERING METALS Determination of lifting height by cappilarity
  • STAS 96-1987 Metals soldering SOFT SOLDHRS WITH TIN, I.EAD, CADMIUM AND ZINC CONTHNT

Standard Association of Australia (SAA)

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

GM North America

Society of Automotive Engineers (SAE)

British Standards Institution (BSI)

  • BS 3338-5:1961(2011) Method for The determination of lead in ingot tin and tin - antimony solders (photometric method)
  • BS 3338-4:1961(2011) Method for The determination of copper in ingot tin and tin - lead solders (photometric method) — Methods for the sampling and analysis oftin and tin alloys
  • BS 3338-6:1961(2011) Method for The determination of copper in high purity ingot tin (Photometric method) — Methods for the sampling and analysis oftin and tin alloys
  • BS 3338-4:1961 Methods for the sampling and analysis of tin and tin alloys - Method for the determination of copper in ingot tin and tin-lead solders (photometric method)
  • BS 3338-6:1961 Methods for the sampling and analysis of tin and tin alloys - Method for the determination of copper in high purity ingot tin (photometric method)
  • BS 3338-8:1961(2011) Method for The determination of bismuth in ingot tin, tin - lead solders and white metal bearing alloys (Photometric method) — Methods for the sampling and analysis oftin and tin alloys
  • BS 3338-5:1961 Methods for the sampling and analysis of tin and tin alloys - Method for the determination of lead in ingot tin and tin-antimony solders (photometric method)
  • BS 3338-10:1961(2011) Method for The determination of iron in ingot tin, tin - lead solders and white metal bearing alloys (Photometric method) — Methods for the sampling and analysis oftin and tin alloys
  • BS 3338-21:1983(2011) Methods for the sampling and analysis oftin and tin alloys — Part 21 : Determination ofhigh cadmium content ofsoft solders
  • BS 3338-21:1983 Methods for the sampling and analysis of tin and tin alloys - Determination of high cadmium content of soft solders

Indonesia Standards

International Organization for Standardization (ISO)

Defense Logistics Agency

CZ-CSN

Korean Agency for Technology and Standards (KATS)

  • KS D 6773-2022 Solder paste
  • KS C 0287-2002 Environmental test-Tests-Test Td:Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting device(SMD)

SAE - SAE International

GM Europe

RU-GOST R

IT-UNI

Japanese Industrial Standards Committee (JISC)

SCC

YU-JUS

  • JUS N.A5.782-1994 Environmental testing - Test Td: Solderability resistance to dissolution of metallization and to soldering heat of surface mounting devices(SMD)

ZA-SANS

  • SANS 857:1990 Welding, brazing and soldering processes - Vocabulary

(U.S.) Ford Automotive Standards

AT-ON

U.S. Air Force

Malaysia Standards

  • MS 964-1985 Specification for resin flux cored solder wire

AR-IRAM