Solderability Time and Temperature
Solderability Time and Temperature, Total:12 items.
The international standard classification for "Solderability Time and Temperature" includes: .
The Chinese standard classification for "Solderability Time and Temperature" includes: .
未注明发布机构
- IPC TR-465-2 Effect of Steam Aging Time and Temperature on Solderability Test Results
IPC - Association Connecting Electronics Industries
- IPC TR-585 CD-2006 Time@ Temperature and Humidity Stress of Final Board Finish Solderability
Institute of Interconnecting and Packaging Electronic Circuits (IPC)
- IPC TR-465-2-1993 Effect of Steam Aging Time and Temperature on Solderability Test Results
- IPC TR-585-2006 Time, Temperature and Humidity Stress of Final Board Finish Solderability
RO-ASRO
- STAS 11200/496-1983 GRAPHICAL SYMBOL FOR HEAD LOWERING TIME PLUS SQUEEZE TIME (SPOT WELDING, PROJECTION WELDING, AND SEAM WELDING
CZ-CSN
- CSN ON 25 8012-1964 Thermometer and thermometer time constants
British Standards Institution (BSI)
- BS 7908:1999 Packaging - Temperature and time-temperature indicators - Performance specification and reference testing
VDI - Verein Deutscher Ingenieure
- VDI/VDE 3522-1981 Zeitverhalten von Beruehrungsthermometern
Association Francaise de Normalisation
- NF E18-100:2013 Time-temperature indicators and integrators - Tests and performance
SCC
- VDI/VDE 3522 BLATT 2-2014 Time behavior of contact thermometers — Experimental determination of time percentage values
- BS 1041-7:1964 Code for temperature measurement-Temperature/time indicators
ESDU - Engineering Sciences Data Unit
- ESDU 89023-1989 Temperatures in plates subjected to a recovery temperature varying linearly with time.
