Herborist Ingredients

Herborist Ingredients, Total:195 items.

The international standard classification for "Herborist Ingredients" includes: Tobacco, tobacco products and related equipment , Integrated circuits. Microelectronics .

The Chinese standard classification for "Herborist Ingredients" includes: Others , Semiconductor integrated circuit , Microcircuit in general , Film integrated circuit .

Professional Standard - Tobacco

YC/T 493.1-2014 Specifications for Tobacco Industry Enterprises Application Integration Technology - Part 1: Portals Integration
YC/T 493.2-2014 Specifications for Tobacco Industry Enterprises Application Integration Technology - Part 2: Service Bus

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 20515-2006 Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits
GB/T 11498-1989 Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure
GB/T 17574-1998 Semiconductor devices --Integrated circuits Part 2:Digital integrated circuits
GB/T 17574.20-2006 Semiconductor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits
GB/T 17940-2000 Semiconductor devices--Integrated circuits--Part 3:Analogue integrated circuits

Professional Standard - Electron

SJ/Z 11359-2006 Taxonomy of functional verification for integrated circuit IP core development and integration

Group Standards of the People's Republic of China

T/ZZB 032-2024 Integrated Cooking Appliangces
T/CNHA 1020-2019 Integrated Cooking Appliances
T/ZRCX 004-2018 Integration cooking appliances
T/CBMMAS 024-2023 Ceiling and wall integration
T/ZZB 032-2015 Integrated Cooking Appliangces
T/ZZB 0148-2016 Integrated ceiling

国家市场监督管理总局、中国国家标准化管理委员会

GB/T 11498-2018 Semiconductor devices—Integrated circuits—Part 21:Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures

Professional Standard - Urban Construction

CJ/T 386-2012 Integration cooking appliances

Hebei Provincial Standard of the People's Republic of China

DB13/T 5552.3-2022 Government service "one window (network) integration office" work specification part 3: integration review
DB13/T 5552.4-2022 Government service "one window (network) integration office" work specification part 4: integrated approval

German Institute for Standardization

DIN EN IEC 62769-103-1 E:2019-11 Field device integration (FDI) - Part 103-1: Profiles - PROFIBUS
DIN EN 62769-1 E:2019-05 Field device integration (FDI) - Part 1: Overview
DIN EN 62769-1 E:2013-01 Field device integration (FDI) - Part 1: Overview
DIN EN 62264-2 E:2013-11 Enterprise-control system integration - Part 2: Objects and attributes for enterprise-control system integration
DIN EN 62769-4 E:2013-01 Field Device Integration (FDI) - Part 4: FDI Packages
DIN EN 62769-2 E:2013-01 Field Device Integration (FDI) - Part 2: FDI Client
DIN EN 62769-4 E:2019-05 Field Device Integration (FDI) - Part 4: FDI Packages
DIN EN 62769-2 E:2019-05 Field Device Integration (FDI) - Part 2: FDI Client
DIN EN 62769-3 E:2013-01 Field Device Integration (FDI) - Part 3: FDI Server
DIN EN 62264-4 E:2014-06 Enterprise-control system integration - Part 4: Object model attributes for manufacturing operations management integration
DIN EN IEC 62769-103-4 E:2020-09 Field device integration (FDI) - Part 103-4: Profiles - PROFINET
DIN EN 62769-3 E:2019-05 Field Device Integration (FDI) - Part 3: FDI Server
DIN EN ISO 25110 E:2017-04 Electronic toll collection using integrated circuit cards (draft)
DIN EN 62769-6 E:2019-06 Field Device Integration (FDI) - Part 6: FDI Technology Mapping
DIN EN 62769-5 E:2013-01 Field Device Integration (FDI) - Part 5: FDI Information Model
DIN EN 62769-5 E:2019-05 Field Device Integration (FDI) - Part 5: FDI Information Model
DIN EN 62769-6 E:2013-01 Field Device Integration (FDI) - Part 6: FDI Technology Mapping
DIN EN 62264-5 E:2015-11 Enterprise system integration - Part 5: Business to manufacturing transactions
DIN EN 62769-109-1 E:2014-05 Field Device Integration (FDI) - Part 109-1: Profiles - HART and WirelessHART
DIN EN IEC 62769-109-1 E:2019-11 Field devices integration (FDI) - Part 109-1: Profiles - HART® and WirelessHART®
DIN EN ISO 3826-4 E:2013-11 Plastic collapsible containers for human blood and blood components Part 4: Integrated functional drop-off blood pack system (draft)
DIN EN ISO 10656 E:2020-09 Resistance welding equipment transformer welding gun integrated transformer (draft)
DIN EN 4691-1 E:2016-06 Aerospace series - Tie rod with integrated bolts - Part 1: Technical specification
DIN EN 62264-3 E:2016-10 Enterprise-control system integration - Part 3: Activity models of manufacturing operations management
DIN EN 61968-100 E:2013-04 Application integration at electric utilities - System interfaces for distribution management - Part 100: Implementation profiles
DIN EN IEC 62769-101-2 E:2019-11 Field Device Integration (FDI) - Part 101-2: Profiles - Foundation Fieldbus HSE

FI-SFS

SFS 3872-1977 Fiber analysis of materials and paper. Herzberg staining

SE-SIS

SIS 62 37 02-1965 The holder of 5 shares (one hundred SEK per share) becomes a co-owner of Aktiebolaget Inventom. total

British Standards Institution (BSI)

BS ISO 10303-101:1994 Industrial automation systems and integration - Product data representation and exchange - Integrated application resources: Draughting
BS ISO 10303-101:1995 Industrial automation systems and integration - Product data representation and exchange - Integrated application resources: Draughting
23/30483797 DC Draft BS EN 63534 Integrating distributed PV into LVDC systems and use cases
BS IEC 63011-1:2018 Integrated circuits. Three dimensional integrated circuits - Terminology
BS EN 60747-16-3:2002 Discrete semiconductor devices and integrated circuits - Microwave integrated circuits - Frequency converters
BS IEC 60748-5:1997 Semiconductor devices - Integrated circuits - Semicustom integrated circuits
BS IEC 60748-2-20:2008 Semiconductor devices - Integrated circuits - Digital integrated circuits - Family specification - Low voltage integrated circuits
BS EN 60747-16-1:2002 Discrete semiconductor devices and integrated circuits - Microwave integrated circuits - Amplifiers

Standard Association of Australia （SAA）

AS 10303.101:1998 Industrial automation systems and integration - Product data representation and exchange - Integrated application resources: Draughting

SCC

DIN EN IEC 62769-1 E:2023 Draft Document - Field Device Integration (FDI©) - Part 1: Overview (IEC 62769-1:2023); English version EN IEC 62769-1:2023
DIN EN ISO 28158 E:2017 Draft Document - Dentistry - Integrated dental floss and handles (ISO/DIS 28158:2017); German and English version prEN ISO 28158:2017
DIN EN 62264-4 E:2014 Draft Document - Enterprise-Control System Integration - Part 4: Object model attributes for manufacturing operations management integration (IEC 65E/384/CD:2013), Text in English
DIN EN 62769-4 E:2019 Draft Document - Field Device Integration (FDI) - Part 4: FDI Packages (IEC 65E/591/CDV:2018); English version prEN 62769-4:2018
DIN EN 62769-1 E:2019 Draft Document - Field device integration (FDI) - Part 1: Overview (IEC 65E/588/CDV:2018); English version prEN 62769-1:2018
DIN EN 50398-1 E:2016 Draft Document - Alarm systems - Combined and integrated systems - Part 1: General requirements; German version prEN 50398-1:2016
DIN EN 62264-1 E:2012 Draft Document - Enterprise system integration - Part 1: Models and terminology (IEC 65E/229/CDV:2012); German version FprEN 62264-1:2012
DIN IEC /TS 61967-3 E:2012 Draft Document - Integrated Circuits - Measurement of Electromagnetic Emissions - Part 3: Measurement of radiated emissions - Surface scan methodIntegrated circuits (IEC 47A/880/CD:2012)
DIN EN 62769-3 E:2019 Draft Document - Field Device Integration (FDI) - Part 3: FDI Server (IEC 65E/590/CDV:2018); English version prEN 62769-3:2018
DIN EN 62769-2 E:2019 Draft Document - Field Device Integration (FDI) - Part 2: FDI Client (IEC 65E/589/CDV:2018); English version prEN 62769-2:2018
DIN EN 62769-7 E:2019 Draft Document - Field Device Integration (FDI) - Part 7: FDI Communication Devices (IEC 65E/594/CDV:2018); English version prEN 62769-7:2018
DIN EN 62769-5 E:2019 Draft Document - Field Device Integration (FDI) - Part 5: FDI Information Model (IEC 65E/592/CDV:2018); English version prEN 62769-5:2018
DIN EN 62769-6 E:2019 Draft Document - Field Device Integration (FDI) - Part 6: FDI Technology Mapping (IEC 65E/593/CDV:2018); English version prEN 62769-6:2018
DIN IEC 62264-1 E:2004 Draft Document - Enterprise-control system integration - Part 1: Models and terminology (IEC 62264-1:2003, text in English)
DIN EN 997 E:2017 Draft Document - WC pans and WC suites with integral trap; German and English version prEN 997:2017
DIN EN 62264-2 E:2013 Draft Document - Enterprise system integration - Part 2: Object models and attributes (IEC 65E/290/FDIS:2013); English version FprEN 62264-2:2013
DIN ISO 10656 E:2015 Draft Document - Electric resistance welding - Integrated transformers for welding guns (ISO/DIS 10656:2015); Text in German and English
DIN EN 4691-1 E:2016 Draft Document - Aerospace series - Tie rod with integrated bolts - Part 1: Technical specification; German and English version FprEN 4691-1:2016
DIN EN 62769-103-4 E:2014 Draft Document - Field Device Integration (FDI) - Profiles - Part 103-4: PROFINET (IEC 65E/355/CDV:2013); English version FprEN 62769-103-4:2013
DIN EN 62769-103-1 E:2014 Draft Document - Field Device Integration (FDI) - Profiles - Part 103-1: PROFIBUS (IEC 65E/354/CDV:2013); English version FprEN 62769-103-1:2013
DIN EN 62228-2 E:2015 Draft Document - Integrated circuits - EMC evaluation of LIN transceivers (IEC 47A/938/CD:2014)
DANSK DS/IEC 748-20:1989 Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
DIN 17850 E:2023 Draft Document - Titanium - Chemical composition
DIN EN 60747-16-4/A2 E:2016 Draft Document - Semiconductor devices - Part 16-4: Micowave integrated circuits - Switches (IEC 47E/524/CD:2015)
DIN EN 4692 E:2016 Draft Document - Aerospace series - Tie Rod with integrated bolts - Locking clip; German and English version FprEN 4692:2016
DIN EN 62769-115-2 E:2018 Draft Document - Field Device Integration (FDI) - Part 115-2: Profiles - Modbus-RTU (IEC 65E/574/CDV:2017); English version prEN 62769-115-2:2018
DIN EN 62433-1 E:2017 Draft Document - Integrated circuits - EMC IC modelling - Part 1: General modelling framework (IEC 47A/1011/CD:2017)
BS IEC 60748-2-20:2000 Semiconductor devices. Integrated circuits. Digital integrated circuits-Family specification. Low voltage integrated circuits
DIN EN IEC 62228-6 E:2023 Draft Document - Integrated circuit - EMC Evaluation of transceivers - Part 6: PSI5 transceivers (IEC 47A/1123/CD:2021); Text in German and English
DIN EN IEC 60747-16-9 E:2022 Draft Document - Semiconductor devices - Part 16-9: Microwave integrated circuits - Phase shifters (IEC 47E/768/CD:2021); Text in German and English
06/30153491 DC EN 60748-2-20. Semiconductor devices. Integrated circuits. Part 2-20. Digital integrated circuits. Family specification. Low voltage integrated circuits
DIN EN 62769-100 E:2018 Draft Document - Field device integration (FDI) - Part 100: Profiles - Generic protocols (IEC 65E/573/CDV:2017); English version prEN 62769-100:2017
DIN EN 63092-2 E:2018 Draft Document - Photovoltaics in buildings - Part 2: Building integrated photovoltaic systems (IEC 82/1410A/CD:2018); Text in German and English
IEC 60748-2:1985/AMD1:1991 Amendment 1 - Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
IEC 60748-4:1987/AMD2:1994 Amendment 2 - Semiconductor devices. Integrated circuits. Part 4: Interface integrated circuits.
IEC 60748-2:1985/AMD2:1993 Amendment 2 - Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits
DANSK DS/ISO 5501-1:2024 Tobacco heating systems – Definitions and standard conditions for aerosol generation and collection – Part 1: Electrically heated tobacco products (eHTPs)

American National Standards Institute （ANSI)

ANSI/VITA 58.0-2009 Line Replaceable Integrated Electronics Chassis Draft Standard

International Electrotechnical Commission (IEC)

IEC 63011-1:2018 Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology
IEC 60748-2-20:2000 Semicondutor devices - Integrated circuits - Part 2-20: Digital integrated circuits; Family specifications: Low voltage integrated circuits
IEC 60748-2:1997 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
IEC 60748-3:1986 Semiconductor devices. Integrated circuits.. Part 3 : Analogue integrated circuits
IEC 60748-4:1987 Semiconductor devices - Intergrated circuits.. Part 4: Interface integrated circuits.
IEC 60748-20:1988 Semiconductor devices - Intergrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film intergrated circuits
IEC 60748-2-20:2008 Semicondutor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits
IEC 60748-4:1997 Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits
IEC 60748-5:1997 Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits
IEC 60748-3:1986/AMD1:1991 Semiconductor devices; integrated circuits; part 3: analogue integrated circuits; amendment 1
IEC 60748-2-11:1999 Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory
IEC 60748-21:1997 Semiconductor devices - Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure
IEC 60748-3:1986/AMD2:1994 Semiconductor devices; integrated circuits; part 3: analogue integrated circuits; amendment 2
IEC 60748-3/AMD2/COR1:1996 Semiconductor devices; integrated circuits; part 3: analogue integrated circuits; amendment 2

PT-IPQ

E 233-1969 Aggregate. Ingredient analysis
E 234-1969 Aggregate. Ingredient analysis

PL-PKN

PN T01610-1972 Integra ted circuits Classification

European Standard for Electrical and Electronic Components

EN 163100:1991 Sectional specification: film and hybrid integrated circuits

KR-KS

KS C IEC 63011-1-2022 Integrated circuits — Three dimensional integrated circuits — Part 1: Terminology
KS C IEC 60748-2-20-2021 Semiconductor devices — Integrated circuits — Part 2-20: Digital integrated circuits — Family specification — Low voltage integrated circuits
KS C IEC 60748-5-2019 Semiconductor devices — Integrated circuits —Part 5: Semicustom integrated circuits
KS C IEC 60748-5-2021 Semiconductor devices — Integrated circuits —Part 5: Semicustom integrated circuits
KS C IEC 60748-20-2021 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-20-2019 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-2-20-2019 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits

Korean Agency for Technology and Standards (KATS)

KS C IEC 63011-1:2022 Integrated circuits — Three dimensional integrated circuits — Part 1: Terminology
KS C IEC 60748-2-2001(2016) Semiconductor devices－integrated circuits－Part 2：Digital integrated circuits
KS C IEC 60748-3:2002 Semiconductor devices－Integrated circuits Part 3：Analogue integrated circuits
KS C IEC 60748-2-2001(2021) Semiconductor devices－integrated circuits－Part 2：Digital integrated circuits
KS C IEC 60748-4-2004(2020) Semiconductor devices－Integrated circuits－Part 4：Interface integrated circuits
KS C IEC 60748-4:2004 Semiconductor devices－Integrated circuits－Part 4：Interface integrated circuits
KS C IEC 60748-3-2002(2022) Semiconductor devices－Integrated circuits Part 3：Analogue integrated circuits
KS C IEC 60748-3-2022 Semiconductor devices－Integrated circuits Part 3：Analogue integrated circuits
KS C IEC 60748-2:2001 Semiconductor devices－integrated circuits－Part 2：Digital integrated circuits
KS C IEC 60748-2-2021 Semiconductor devices－integrated circuits－Part 2：Digital integrated circuits
KS C IEC 60748-4-2020 Semiconductor devices－Integrated circuits－Part 4：Interface integrated circuits
KS C IEC 60748-3-2002(2017) Semiconductor devices－Integrated circuits Part 3：Analogue integrated circuits
KS C IEC 60748-5:2021 Semiconductor devices — Integrated circuits —Part 5: Semicustom integrated circuits
KS C IEC 60748-2-20:2002 Semiconductor devices－Integrated circuits－Part 2－20：Digital integrated circuits－Family specification－Low voltage integrated circuits
KS C IEC 60748-2-20:2021 Semiconductor devices — Integrated circuits — Part 2-20: Digital integrated circuits — Family specification — Low voltage integrated circuits
KS C IEC 60748-20:2021 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-5:2019 Semiconductor devices — Integrated circuits —Part 5: Semicustom integrated circuits
KS C IEC 60748-5:2003 Semiconductor devices－Integrated circuits－Part 5：Semicustom integrated circuits
KS C IEC 60748-3-1:2002 Semiconductor devices－Integrated circuits－Part 3：Analogue integrated circuits－Section 1：Blank detail specification for monolithic integrated operational amplifiers
KS C IEC 60748-2-20:2019 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-20-1:2003 Semiconductor devices－Integrated circuits－Part 20：Generic specification for film integrated circuits and hybrid film integrated circuits－Section 1：Requirements for internal visual examination
KS C IEC 60748-20:2003 Semiconductor devices－Integrated circuits－Part 20：Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-20:2019 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-2-8:2002 Semiconductor devices－Integrated circuits－Part 2：Digital integrated circuits－Section 8：Blank detail specification for integrated circuits static read/write memories
KS C IEC 60748-2-7:2002 Semiconductor devices－Integrated circuits－Part 2：Digital integrated circuits Section 7：Blank detail specification for integrated circuits fusible－link programmable bipolar read－only memories

BR-ABNT

ABNT MB-7-1939 Aggregate screening component detection

Institute of Electrical and Electronics Engineers (IEEE)

P3156/D2.1, September 2023 IEEE Draft Standard for Requirements of Privacy-preserving Computation Integrated Platforms
IEEE Std P1801/D13, January 2013 IEEE Draft Standard for Design and Verification of Low Power Integrated Circuits
IEEE P3156/D2, July 2023 IEEE Draft Standard for Requirements of Privacy-preserving Computation Integrated Platforms
IEEE Unapproved Draft Std P1481/D2, Jun 2009 IEEE Draft Standard for Integrated Circuit (IC) Open Library Architecture (OLA)
IEEE P1481/D1, August 2019 IEEE Draft Standard for Integrated Circuit (IC) Open Library Architecture (OLA)
IEEE Unapproved Draft Std P1481/D2, Oct 2008 IEEE Draft Standard for Integrated Circuit (IC) Open Library Architecture (OLA)
IEEE P3156/D2.1, September 2023 IEEE Approved Draft Standard for Requirements of Privacy-preserving Computation Integrated Platforms
IEEE P1838_D2.0, August 2019 IEEE Draft Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits
IEEE P1851/D1.3, April 2012 IEEE Draft Standard for Design Criteria of Integrated Sensor-based Test Applications for Household Appliances
IEEE P1481/D2, September 2019 IEEE Approved Draft Standard for Integrated Circuit (IC) Open Library Architecture (OLA)

GSO

BH GSO IEC 60748-2:2016 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
GSO IEC 60748-2-20:2014 Semiconductor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits
OS GSO IEC 60748-2:2014 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
OS GSO IEC 60748-3:2014 Semiconductor devices - Integrated circuits - Part 3: Analogue integrated circuits
OS GSO IEC 60748-2-20:2014 Semiconductor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits
BH GSO IEC 60748-3:2016 Semiconductor devices - Integrated circuits - Part 3: Analogue integrated circuits
GSO IEC 60748-3:2014 Semiconductor devices - Integrated circuits - Part 3: Analogue integrated circuits
OS GSO IEC 60748-4:2013 Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits
GSO IEC 60748-4:2013 Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits
GSO IEC 60748-2:2014 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
GSO IEC 60748-5:2015 Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits
GSO IEC 60748-20:2014 Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
OS GSO IEC 60748-20:2014 Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
BH GSO IEC 60748-20:2016 Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
OS GSO IEC 60748-22:2014 Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

CZ-CSN

CSN IEC 748-2:1994 Semiconductor devices.Integrated circuits.Part 2:Digital integrated circuits
CSN IEC 748-4:1994 Semiconductor devices.Integrated circuits.Part 4:Interface integrated circuits
CSN IEC 748-3:1994 Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits
CSN IEC 748-20:1993 Semiductors devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits

Danish Standards Foundation

DS/IEC 748-3:1993 Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits
DS/IEC 748-4:1993 Semiconductor devices. Integrated circuits. Part 4: Interface integrated circuits
DS/IEC 748-3+Amd.1:1993 Semiconductor devices - Integrated circuits - Part 3: analogue integrated circuits
DS/IEC 748-2:1993 Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits
DS/IEC 748-4+Amd.1:1993 Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits
DS/IEC 748-20:1990 Semiconductor devices. Intergrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film intergrated circuits

RO-ASRO

SR CEI 748-3+A1-1991 Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits
STAS SR CEI 748-2/A1-1994 DISPOZITIVE CU SEMICONDUCTOARE Circuite integrate. Partea 2: Circuite integrate digitale

Association Francaise de Normalisation

NF C96-042:1989 Semiconductor Devices Integrated circuits Part 2:Digital integrated circuits

RU-GOST R

GOST 29107-1991 Semiconductor devices. Integrated circuits. Part 2. Digital integrated circuits
GOST 29108-1991 Semiconductor devices. Integrated circuits. Part 3. Analog integrated circuits
GOST 29109-1991 Semiconductor devices. Integrated circuits. Part 4. Interface integrated circuits

IEC - International Electrotechnical Commission

IEC 60748-2:1985 Semiconductor Devices Integrated Circuits Part 2: Digital Integrated Circuits (Amendment 1-1991) (Amendment 2-1993) (Edition 1.0)

Japanese Industrial Standards Committee (JISC)

JIS X 6319-1:2023 Specification of implementation for integrated circuit cards -- Part 1: Integrated circuit cards with contacts
JIS X 6319-1:2005 Specification of implementation for integrated circuit(s) cards -- Part 1: Integrated circuit(s) cards with contacts
JIS X 6319-1:2010 Specification of implementation for integrated circuit cards -- Part 1: Integrated circuit cards with contacts

IN-BIS

IS 5001 Pt.2-1973 Semiconductor Device and Integrated Circuit Drawing Guide Part II Integrated Circuits
IS 12970 Pt.2/Sec.2-1992 Semiconductor devices—Integrated circuits Part 2 Digital integrated circuits—Basic ratings and characteristics Part 2 Integrated circuits Memory

European Committee for Electrotechnical Standardization（CENELEC）

EN 165000-5:1997 Film and Hybrid Integrated Circuits Part 5: Procedure for Qualification Approval
EN 165000-3:1996 Film and Hybrid Integrated Circuits Part 3: Self-Audit Checklist and Report for Film and Hybrid Integrated Circuit Manufacturers

SAE - SAE International

SAE PT-182-2017 Integrated Vehicle Health Management - System of Systems Integration

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

IPC PD-335 SECTION 2-1989 System Integration