Shear Strength Measurement Method
Shear Strength Measurement Method, Total:11 items.
The international standard classification for "Shear Strength Measurement Method" includes: .
The Chinese standard classification for "Shear Strength Measurement Method" includes: .
International Electrotechnical Commission (IEC)
- IEC 62047-25:2016 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
British Standards Institution (BSI)
- BS EN 62047-25:2016 Semiconductor devices. Micro-electromechanical devices. Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area
Association Francaise de Normalisation
- NF C96-050-25*NF EN 62047-25:2016 Semiconductor devices - Micro-electromechanical devices - Part 25 : silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
European Committee for Electrotechnical Standardization（CENELEC）
- EN 62047-25:2016 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
Spanish Association for Standardization (UNE)
- UNE-EN 62047-25:2016 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (Endorsed by Asociación Española de Normalización in January ...
GSO
- BH GSO IEC 62047-25:2022 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
- GSO IEC 62047-25:2021 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
SCC
- CEI EN 62047-25:2017 Semiconductor devices - Micro-electromechanical devices Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
- DANSK DS/EN 62047-25:2016 Semiconductor devices – Micro-electromechanical devices – Part 25: Silicon based MEMS fabrication technology – Measurement method of pull-press and shearing strength of micro bonding area
German Institute for Standardization
- DIN EN 62047-25:2017-04 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016
- DIN EN 62047-25 E:2014-05 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
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