flexible circuit board
flexible circuit board, Total:39 items.
The international standard classification for "flexible circuit board" includes: .
The Chinese standard classification for "flexible circuit board" includes: .
Korean Agency for Technology and Standards (KATS)
- KS C 6510-1996(2001) RIGID-FLEX PRINTED BOARDS
- KS C 6471-1999(2009) Test methods for flexible printed wiring boards
- KS C 6473-1996 TEST METHODS OF COPPER-CLAD LAMINATES FOR FLEXIBLE PRINTED WIRING BOARDS
- KS C 6473-1996(2001) TEST METHODS OF COPPER-CLAD LAMINATES FOR FLEXIBLE PRINTED WIRING BOARDS
- KS C 6488-1997 FLEXIBLE PRINTED WIRING BOARDS - SINGLE-SIDED, DOUBLE-SIDED
- KS C IEC 63251-2024 Test method for mechanical property of flexible opto – electric circuit boards under thermal stress
- KS C IEC TR 63017-2024 Flexible printed circuit boards (FPCBs) — Method of compensation of impedance variations
Japanese Industrial Standards Committee (JISC)
- JIS C 5017:1994 Flexible printed wiring boards -- Single-sided, Double-sided
- JIS C 5016:1994 Test methods for flexible printed wiring boards
- JIS C 6471:1995 Test methods of copper-clad laminates for flexible printed wiring boards
German Institute for Standardization
- DIN EN 123500/A2:1996 Sectional specification: Flexible printed boards with through connections; German version EN 123500:1992/A2:1995
- DIN EN 123400/A2:1996 Sectional specification: Flexible printed boards without through connections; German version EN 123400:1992/A2:1995
- DIN EN 62496-3-1:2011-01 Optical circuit boards - Performance standard - Part 3-1: Flexible optical circuit boards using unconnectorized optical glass fibres (IEC 62496-3-1:2009); German version EN 62496-3-1:2010
IPC - Association Connecting Electronics Industries
- IPC 6013B GERMAN CD-2009 Qualification and Performance Specification for Flexible Printed Boards
- IPC 6013B GERMAN-2009 Qualification and Performance Specification for Flexible Printed Boards
European Standard for Electrical and Electronic Components
- EN 123500:1992 Sectional specification; flexible printed boards with through connections
- EN 123500-800:1992 Capability detail specification; flexible printed boards with through connections
Danish Standards Foundation
- DS/EN 62496-3-1:2010 Optical circuit boards - Performance standard - Part 3-1: Flexible optical circuit boards using unconnectorized optical glass fibres
- DANSK DS/EN 62496-3-1:2010 Optical circuit boards - Performance standard - Part 3-1: Flexible optical circuit boards using unconnectorized optical glass fibres
European Committee for Electrotechnical Standardization（CENELEC）
- EN 62496-3-1:2010 Optical circuit boards - Performance standard - Part 3-1: Flexible optical circuit boards using unconnectorized optical glass fibres
- EN 123400:1992 Sectional Specification: Flexible Printed Boards Without Through Connections
- EN 123400-800:1992 Capability Detail Specification: Flexible Printed Boards Without Through Connections
- EN IEC 63251:2023 Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
SE-SIS
- SIS SS CECC 23400-1986 Sectional specification: Flexible printed boards without through connections
- SIS SS CECC 23500-1986 Sectional specification: Flexible printed boards with through connections
- SIS SS CECC 23400-800-1991 Capability detail specification: Flexible printed boards without through-connections
- SIS SS CECC 23500-800-1991 Capability detail specification: Flexible printed boards with through-connections
British Standards Institution (BSI)
- BS PD IEC/TR 63017:2015 Flexible printed circuit boards (FPCBs). Method of compensation of impedance variations
- PD IEC/TR 63017:2015 Flexible printed circuit boards (FPCBs). Method of compensation of impedance variations
- BS EN IEC 63251:2023 Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
International Electrotechnical Commission (IEC)
- IEC TR 63017:2015 Flexible printed circuit boards (FPCBs) - Method of compensation of impedance variations
- IEC 63251:2023 Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
Association for Electrical, Electronic & Information Technologies (VDE)
- VDE 0885-201 E*DIN EN IEC 63251:2020-05 Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress
The Directorate General of Specifications and Metrology (DGSM)
- OS GSO IEC 62496-3-1:2013 Optical circuit boards - Part 3-1: Performance standards - Flexible optical circuit boards using unconnectorized optical glass fibres
Comitato Elettrotecnico Italiano
- CEI EN 62496-3-1:2011 Optical circuit boards - Performance standard Part 3-1: Flexible optical circuit boards using unconnectorized optical glass fibres
GCC Standardization Organization
- GSO IEC 62496-3-1:2013 Optical circuit boards - Part 3-1: Performance standards - Flexible optical circuit boards using unconnectorized optical glass fibres
Spanish Association for Standardization (UNE)
- UNE-EN 62496-3-1:2010 Optical circuit boards - Performance standard -- Part 3-1: Flexible optical circuit boards using unconnectorized optical glass fibres (Endorsed by AENOR in June of 2010.)
Lithuanian Standards Office
- LST EN 62496-3-1-2010 Optical circuit boards - Performance standard - Part 3-1: Flexible optical circuit boards using unconnectorized optical glass fibres (IEC 62496-3-1:2009)
Swedish Institute for Standards
- SS-EN 123500-800:1995 Capability detail specification: Flexible printed boards with through connections
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