Solder Paste Method

Solder Paste Method, Total:18 items.

The international standard classification for "Solder Paste Method" includes: Semiconducting materials .

The Chinese standard classification for "Solder Paste Method" includes: Metal physical property test method .

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Professional Standard - Electron

• SJ/T 11186-2009 General specification for solder paste
• SJ/T 11186-1998 General specifications for tin-lead soldering pastes

Taiwan Provincial Standard of the People's Republic of China

• CNS 2919-1968 Method of Test for Solder Paste
• CNS 2918-1968 Solder Paste

Group Standards of the People's Republic of China

• T/ZZB 2541-2021 Lead-free solder paste

工业和信息化部

• SJ/T 11186-2019 General specification for solder paste

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

• GB/T 31475-2015 Requirements for solder paste for high-quality interconnections in electronics assembly

Japanese Industrial Standards Committee (JISC)

• JIS Z 3285:2017 Solder paste for micro-joining -- Characteristic test methods for solder paste using fine particles
• JIS Z 3284-4:2014 Solder paste -- Part 4: Test methods for wettability, solderball and spread
• JIS Z 3284-2:2014 Solder paste -- Part 2: Test methods for solder particle shape, surface condition judgment, and particle size distribution

GM North America

• GM 9985774-2002 Tin-Silver Solder Metal Paste
• GM 9985775-2002 Lead-Tin Solder Metal Paste
• GM 9985325-1980 Solder Paste

Korean Agency for Technology and Standards (KATS)

• KS D 6773-2022 Solder paste
• KS D 6773-1997(2017) Solder paste
• KS L 9103-2021 Testing method for solderberg paste

(U.S.) Ford Automotive Standards

• FORD ESF-M11A19-A-2012 SOLDER PASTE (63% TIN) ***TO BE USED WITH FORD WSS-M99P1111-A***

RU-GOST R

• GOST 1429.2-1977 Tin-lead solders. Methods for the determination of tin

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