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Database: 365,228(8 Aug 2026)

Fiber Array Spacing

Fiber Array Spacing, Total:45 items.

The international standard classification for "Fiber Array Spacing" includes: .

The Chinese standard classification for "Fiber Array Spacing" includes: .


未注明发布机构

  • DS/EN IEC 62148-21:2019 Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
  • DIN EN IEC 62148-21:2020 Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
  • DIN EN 60191-6-13 E:2013-07 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

未注明发布机构

  • DIN EN IEC 62148-21:2020 Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
  • DIN EN 60191-6-13 E:2013-07 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
  • DS/EN IEC 62148-21:2019 Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

工业和信息化部

JP-JEITA

  • JEITA EDR-7316C-2007 Design guideline of integrated circuits for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array

International Electrotechnical Commission (IEC)

  • IEC 62148-21:2019 Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silico
  • IEC 62148-21:2021 Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (SFLGA)
  • IEC 60191-6-13:2016 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
  • IEC 60191-6-13:2007 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline for open-top type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

SCC

  • BS EN IEC 62148-21:2019 Fibre optic active components and devices. Package and interface standards-Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
  • DIN EN 62148-21 E:2017 Draft Document - Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using Silicon Fine-pitch Ball Grid Array (S-FBGA) and Silicon Fine-pitch Land Grid Array (S-FLG...
  • DANSK DS/EN IEC 62148-21:2021 Fibre optic active components and devices – Package and interface standards – Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
  • CEI EN IEC 62148-21:2019 Fibre optic active components and devices - Package and interface standards Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
  • DIN EN IEC 62148-21 E:2021 Draft Document - Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLG...
  • CEI EN 60191-6-13:2017 Mechanical standardization of semiconductor devices Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
  • DANSK DS/EN 60191-6-13:2016 Mechanical standardization of semiconductor devices – Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
  • 05/30132033 DC IEC 60191-6-13. Mechanical standardization of semiconductor devices. Part 6-13. Design guideline of open-top type socket for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
  • DIN EN 60191-6-13 E:2013 Draft Document - Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 47D/834/CD:2013)

British Standards Institution (BSI)

  • BS EN IEC 62148-21:2021 Fibre optic active components and devices. Package and interface standards - Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
  • 20/30417696 DC BS EN IEC 62148-21. Fibre optic active components and devices. Package and interface standards. Part 21. Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
  • BS EN 60191-6-13:2008 Mechanical standardization of semiconductor devices - Design guideline of open-top-type sockets for fine-pitch ball grid array and fine-pitch land grid array (FBGA/FLGA)
  • BS EN 60191-6-13:2016 Mechanical standardization of semiconductor devices. Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
  • BS EN 60191-6-13:2007 Mechanical standardization of semiconductor devices — Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

Standard Association of Australia (SAA)

  • IEC 62148-21:2021 RLV Fibre optic active components and devices — Package and interface standards — Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

European Committee for Electrotechnical Standardization(CENELEC)

  • EN IEC 62148-21:2021 Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
  • EN 60191-6-13:2016 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
  • EN 60191-6-13:2007 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

CENELEC - European Committee for Electrotechnical Standardization

  • EN IEC 62148-21:2019 Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

German Institute for Standardization

  • DIN EN 62148-21:2017 Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using Silicon Fine-pitch Ball Grid Array (S-FBGA) and Silicon Fine-pitch Land Grid Array (S-FLGA) (IEC 86C/1469/CD:
  • DIN EN 60191-6-13:2008 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 60191-6-13:2007); German version EN 60191-6-13:2007
  • DIN EN IEC 62148-21:2022-09 Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA) (IEC 6214...

Association Francaise de Normalisation

  • NF C93-883-21*NF EN IEC 62148-21:2021 Fibre optic active components and devices - Package and interface standards - Part 21 : design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
  • NF C96-013-6-13:2008 Mechanical standardization of semiconductor devices - Part 6-13 : design guideline of open-top-type socket for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA).
  • NF C96-013-6-13*NF EN 60191-6-13:2017 Mechanical standardization of semiconductor devices - Part 6-13 : design guideline of open-top-type sockets for fine-pitch ball grid array (FBGA) and fine-pitch land grid array (FLGA)

Lithuanian Standards Office

  • LST EN IEC 62148-21:2021 Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA) (IEC 62148-2

GSO

  • GSO IEC 60191-6-13:2024 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

Danish Standards Foundation

  • DS/EN 60191-6-13:2008 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

American National Standards Institute (ANSI)

  • ANSI/TIA-568-C.3-1-2011 Optical Fiber Cabling Components Standard - Addendum 1: Addition of OM4 Cables Optical Fiber and 24-fiber array connectors

ES-UNE

  • UNE-EN 120005:1992 BDS: PHOTODIODES, PHOTODIODE ARRAYS (NOT INTENDED FOR FIBRE OPTIC APPLICATIONS). (Endorsed by AENOR in September of 1996.)
  • UNE-EN IEC 62148-21:2019 Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using Silicon Fine-pitch Ball Grid Array (S-FBGA) and Silicon Fine-pitch Land Grid Array (S-FLGA) (Endorsed by A...
  • UNE-EN IEC 62148-21:2021 Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA) (Endorsed...