Package Substrate
Package Substrate, Total:3 items.
The international standard classification for "Package Substrate" includes: .
The Chinese standard classification for "Package Substrate" includes: .
Group Standards of the People's Republic of China
- T/NLIA 003-2021 Requirements for etching process simulation of flexible printed circuit board packaging substrates
- T/CI 360-2024 Technical specification for image inspection system of IC package substrate
- T/XAI 10-2021 Test equipment for impedance value of package substrate
metal substrate,Encapsulation glue,mxf package,switch package,mxf package,copper substrate,flexible substrate,Semiconductor packaging substrate billion yuan,Instrument Package,flexible substrate,Package Substrate,plastic substrate,plastic substrate,Package Substrate,chip packaging,encapsulation,Substrate material,Substrate,Ceramic substrate,Aluminum plate
