microcolumn compression
microcolumn compression, Total:17 items.
The international standard classification for "microcolumn compression" includes: Other semiconductor devices .
The Chinese standard classification for "microcolumn compression" includes: Micromodule .
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
- GB/T 44839-2024 Micro-electromechanical systems (MEMS) technology一Micro-pillar compression test for MEMS materials
Spanish Association for Standardization (UNE)
- UNE-EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (Endorsed by AENOR in December of 2011.)
German Institute for Standardization
- DIN EN 62047-10:2012-03 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011
- DIN IEC 62047-10 E:2010-05 Draft Document - Semiconductor devices - Micro-electromechanical devices - Part 10: Micropillar compression test for MEMS materials (IEC 47F/48/CD:2010)
- DIN IEC 62047-10 E:2010 Draft Document - Semiconductor devices - Micro-electromechanical devices - Part 10: Micropillar compression test for MEMS materials (IEC 47F/48/CD:2010)
Danish Standards Foundation
- DS/EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
- DANSK DS/EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
Kingdom of Bahrain Testing and Metrology Directorate
- BH GSO IEC 62047-10:2016 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
Swedish Institute for Standards
- SS-EN 62047-10:2012 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
The Directorate General of Specifications and Metrology (DGSM)
- OS GSO IEC 62047-10:2014 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
Comitato Elettrotecnico Italiano
- CEI EN 62047-10:2012 Semiconductor devices - Microelectromechanical devices Part 10: Micro-pillar compression test for MEMS materials
GCC Standardization Organization
- GSO IEC 62047-10:2014 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
International Electrotechnical Commission (IEC)
- IEC 62047-10:2011 Semiconductor devices – Micro-electromechanical devices – Part 10: Micro-pillar compression test for MEMS materials (Edition 1.0)
Lithuanian Standards Office
- LST EN 62047-10-2011 Semiconductor devices - Micro-electromechanical devices -- Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011)
British Standards Institution (BSI)
- 10/30211442 DC BS EN 62047-10. Semiconductor devices. Micro electromechanical devices. Part 10. Micro-pillar compression test for MEMS materials
- BS EN 62047-10:2011 Semiconductor devices. Micro-electromechanical devices. Micro-pillar compression test for MEMS materials
European Committee for Electrotechnical Standardization（CENELEC）
- EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
microcolumn compression,Microcolumn compression test,compression column,microcolumn compression,microcolumn,Domestic Microcolumn Compression,microcolumn test
