film residual stress
film residual stress, Total:12 items.
The international standard classification for "film residual stress" includes: .
The Chinese standard classification for "film residual stress" includes: .
American Society for Testing and Materials (ASTM)
- ASTM E2245-02 Standard Test Method for Residual Strain Measurements of Thin, Reflecting Films Using an Optical Interferometer
- ASTM E2245-05 Standard Test Method for Residual Strain Measurements of Thin, Reflecting Films Using an Optical Interferometer
International Electrotechnical Commission (IEC)
- IEC 62047-16:2015 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
SCC
- CEI EN 62047-16:2016 Semiconductor devices - Micro-electromechanical devices Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
- DANSK DS/EN 62047-16:2015 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
German Institute for Standardization
- DIN EN 62047-16:2015-12 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 62047-16:2015); German version EN 62047-16:2015
Spanish Association for Standardization (UNE)
- UNE-EN 62047-16:2015 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods (Endorsed by AENOR in August of 2015.)
Association Francaise de Normalisation
- NF EN 62047-16:2015 Semiconductor devices - Microelectromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
- NF C96-050-16*NF EN 62047-16:2015 Semiconductor devices - Micro-electromechanical devices - Part 16 : test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
GSO
- GSO IEC 62047-16:2021 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
- BH GSO IEC 62047-16:2022 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
European Committee for Electrotechnical Standardization（CENELEC）
- EN 62047-16:2015 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods
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