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Database: 365,228(8 Aug 2026)

High frequency microelectrode

High frequency microelectrode, Total:359 items.

The international standard classification for "High frequency microelectrode" includes: Aerospace electric equipment and systems , Diodes , Rubber , Insulating fluids , Conducting materials .

The Chinese standard classification for "High frequency microelectrode" includes: Electronic components , Technical management , Technical management , Radio Measurement , Semiconductor diode , Rubber products in general , Graphite material .


Group Standards of the People's Republic of China

  • T/ZZB 0542-2018 Disposable high frequency active electrode surgical instrument (active electrode is intended to coagulate or cut )

Taiwan Provincial Standard of the People's Republic of China

  • CNS 7013-1981 Measurement of Small Signal HF VHF, and UHF Power Gain of Transistors

Professional Standard - Aerospace

  • QJ 1299-1987 Specification for Screening of Silicon Microwave Mixer and Detector Diodes

Professional Standard - Electron

  • SJ 3123-1988 Detail specification for electronic components--Ambient-rated bipolar transistors for high frequency amplification,Type 3DG1779
  • SJ 796-1974 Detail specification for silicon NPN epitaxial planar high frequency low power high reverse voltage transistors,Type 3DG160
  • SJ 790-1974 Detail specification for silicon NPN epitaxial planar high frequency low power transistors,Type 3DG121
  • SJ 783-1974 Detail specification for silicon NPN epitaxial planar high frequency low power transistors,Type 3DG101
  • SJ 800-1974 Detail specification for silicon NPN epitaxial planar high frequency low power high reverse voltage transistors,Type 3DG180
  • SJ 2372-1983 Detail specification for silicon PNP low frequency high voltage high power transistors,Type 3CD259 and 3CD260
  • SJ 1482-1979 Detail specification for silicon PNP epitaxial planar high frequency low power transistors,Type 3CG132
  • SJ 799-1974 Detail specification for silicon NPN epitaxial planar high frequency low power reverse voltage transistors,Type 3DG170
  • SJ 1421-1978 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA22
  • SJ 1408-1978 Detail specification for silicon NPN high frequency high power transistors,Type 3DA101
  • SJ 2369-1983 Detail specification for silicon PNP low frequency high voltage high power transistors,Type 3CD253,3CD254 and 3CD453
  • SJ 1428-1978 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA107
  • SJ 1682-1980 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA151
  • SJ 3121-1988 Detail specification for electronic components--Ambient-rated bipolar transistors for high frequency amplification,Type 3DG2464
  • SJ 2373-1983 Detail specification for silicon PNP low frequency high voltage high power transistors,Type 3CD262 and 3CD462
  • SJ 784-1974 Detail specification for silicon NPN epitaxial planar high frequency low power transistors,Type 3DG102
  • SJ 935-1975 Detail specification for silicon NPN low frequency high power high reverse voltage transistors,Type 3DD101 and 3DD102
  • SJ 1470-1979 Detail specification for silicon PNP epitaxial planar high frequency low power transistors,Type 3CG102
  • SJ 2371-1983 Detail specification for silicon PNP low frequency high voltage high power transistors,Type 3CD257,3CD258 and 3CD457
  • SJ 1426-1978 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA21
  • SJ 2279-1983 Detail specification for silicon NPN epitaxial planar superhigh frequency low power transistors,Type 3DG123
  • SJ 3122-1988 Detail specification for electronic components--Ambient-rated bipolar transistors for high frequency amplification,Type 3DG3177
  • SJ 1423-1978 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA32
  • SJ 3120-1988 Detail specification for electronic component--Ambient-rated bipolar transistors for high frequency amplification,Type 3DG1215
  • SJ 2273-1983 Detail specification for silicon NPN epitaxial planar superhigh frequency low power transistors,Type 3DG81
  • SJ 1481-1979 Detail specification for silicon PNP epitaxial planar high frequency low power transistors,Type 3CG131
  • SJ 934-1975 Detail specification for silicon NPN low frequency high power high reversse voltage transistors,Type 3DD100
  • SJ 1422-1978 Detail specificaiton for silicon NPN high-frequency high power transistors,Type 3DA37
  • SJ 2366-1983 Detail specification for silicon PNP low frequency high voltage high power transistors,Type 3CD447
  • SJ 2276-1983 Detail specification for silicon NPN epitaxial planar superhigh frequency low power transistors,Type 3DG114
  • SJ 1407-1978 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA4
  • SJ 1471-1979 Detail specification for silicon PNP epitaxial planar high frequency low power transistors,Type 3CG103
  • SJ 1419-1978 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA18
  • SJ 1472-1979 Detail specification for silicon PNP epitaxial planar high frequency low power transistors,Type 3CG110
  • SJ 1484-1979 Detail specification for silicon PNP epitaxial planar high frequency low power high reverse voltage transistors,Type 3CG160
  • SJ 1414-1978 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA102
  • SJ 1416-1978 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA100
  • SJ 1430-1978 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA89
  • SJ/T 11759-2020 Test method for determining the aspect ratio of solar cell's grid line electrode-confocal laser scanning microscope
  • SJ 1479-1979 Detail specifiation for silicon PNP epitaxial planar high frequency low power transistors,Type 3CG122
  • SJ 1424-1978 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA105
  • SJ 1410-1978 Detail specification for silicon NPN high-frequency high power transistors, Type 3DA98
  • SJ 1230-1977 Methods of measurement for high frequency rectified current of germanium detector diodes
  • SJ 2281-1983 Detail specification for silicon NPN epitaxial planar superhigh frequency low power transistors,Type 3DG132
  • SJ 1405-1978 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA1
  • SJ 1420-1978 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA104
  • SJ 787-1974 Detail specification for silicon NPN epitaxial planar high frequency low power transistors,Type 3DG111
  • SJ 1406-1978 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA96
  • SJ 1429-1978 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA108
  • SJ 1418-1978 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA10
  • SJ 2367-1983 Detail specification for silicon PNP low frequency high voltage high power transistors,Type 3CD249,3CD250 and 3CD449
  • SJ 1476-1979 Detail specification for silicon PNP epitaxial planar high frequency low power transistors,Type 3CG114
  • SJ 2368-1983 Detail specification for silicon PNP low frequncy high voltage high power transistors,Type 3CD251,3CD252 and 3CD451
  • SJ 1468-1979 Detail specification for silicon PNP epitaxial planar high frequency low power transistors,Type 3CG100
  • SJ 1425-1978 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA106
  • SJ 2278-1983 Detail specification for silicon NPN epitaxial planar superhigh frequency low power transistors,Type 3DG72
  • SJ 791-1974 Detail specification for silicon NPN epitaxial planar high frequency low power transistors,Type 3DG122
  • SJ 782-1974 Detail specfication for silicon NPN planar high frequency low power transistors,Type 3DG100
  • SJ 1417-1978 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA103
  • SJ 2271-1983 Type 3DG104 silicon NPN epitaxial planar super-high frequency low power triodes
  • SJ 2370-1983 Detail specification for silicon PNP low frequency high voltage high power transistors,Type 3CD255,3CD256 and 3CD455
  • SJ 2375-1983 Detail specification for silicon PNP low frequency high voltage high power transistors,Type 3CD267 and 3CD467
  • SJ 1415-1978 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA28
  • SJ 50033/28-1994 Semiconductor discrete device-Detail specification for stripline mixer diodes for 2CV334,2CV3338
  • SJ 1478-1979 Detail specification for silicon PNP epitaxial planar high frequency low power transistors,Type 3CG121
  • SJ 785-1974 Detail specification for silicon NPN epitaxial planar high frequency low power transistors,Type 3DG103
  • SJ 1427-1978 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA92
  • SJ 1469-1979 Detail specification for silicon PNP epitaxial planar high frequency low power transistors,Type 3CG101
  • SJ 2275-1983 Detail specification for silicon NPN epitaxial planar superhigh frequency low power transistors,Type 3DG85
  • SJ 1473-1979 Detail specification for silicon PNP epitaxial planar high frequency low power transistors,Type 3CG111
  • SJ 2374-1983 Detail specification for silicon PNP low frequency high voltage high power transistors,Type 3CD264,3CD464
  • SJ 1485-1979 Detail specification for silicon PNP epitaxial planar high frequency low power high reverse voltage transistors,Type 3CG170
  • SJ 2277-1983 Detail specification for silicon NPN epitaxial planar superhigh frequency low power transistors,Type 3DG115
  • SJ 936-1975 Detail specification for silicon NPN low frequency high power high reverse voltage transistors,Type 3DD103 and 3DD104
  • SJ 1412-1978 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA14
  • SJ 1486-1979 Detail specification for silicon PNP epitaxial planar high frequency low power high reverse voltage transistors,Type 3CG180
  • SJ 797-1974 Detail specification for silicon NPN epitaxial planar high frequency low power high reverse voltage transistors,Type 3DG161
  • SJ 801-1974 Detail specification for silicon NPN epitaxial planar high frequency low power high reverse voltage transistors,Type 3DG181
  • SJ 1413-1978 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA2
  • SJ 786-1974 Detail specification for silicon NPN planar high frequency low power transistors,Type 3DG110
  • SJ 1409-1978 Detail specification for silicon NPN high-frequency high pwer transistors,Type 3DA3
  • SJ 2274-1983 Detail specification for silicon NPN epitaxial planar superhigh frequency low power transistors,Type 3DG113
  • SJ 1683-1980 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA152
  • SJ 1480-1979 Detail specification for silicon PNP epitaxial planar high frequency low power transistors,Type 3CG130
  • SJ 788-1974 Detail specification for silicon NPN epitaxial planar high frequency low power transistors,Type 3DG112
  • SJ 1411-1978 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA5
  • SJ 1431-1978 Detail specification for silicon NPN high-frequency high power transistors,Type 3DA39
  • SJ 789-1974 Detail specification for silicon NPN epitaxial planar high frequency low power transistors,Type 3DG120
  • SJ 1475-1979 Detail specification for silicon PNP epitaxial planar high frequency low power transistors,Type 3CG113
  • SJ 2272-1983 Detail specification for silicon NPN epitaxial planar superhigh frequency low power transistors,Type 3DG44
  • SJ 1474-1979 Detail specification for silicon PNP epitaxial planar high frequency low power transistors,Type 3CG112
  • SJ 1477-1979 Detail specification for silicon PNP epitaxial planar high frequency low power transistors,Type 3CG120

National Metrological Verification Regulations of the People's Republic of China

  • JJG 362-1984 for Model DO16 UHF Microvolt Voltage Calibrating Equipment
  • JJG 279-1981 Verification Regulation of HE Microvoltmeter Type WFG-1B
  • JJG 319-1983 Verification Regulation of VHF Microvolt Meter

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

  • GB/T 3073-1982 High power graphite electrodes
  • GB/T 3789.18-1991 Measurements of the electrical properties of transmitting tubes-Measuring methods of high frequency loss for interelectrode insulators
  • GB/T 1694-1981 Vulcanized rubber--Test method for HF dielectric constant and dielectric loss angular tangent value
  • GB/T 15177-1994 Blank detail specification for mircowave detectors and mixer diodes

Military Standard of the People's Republic of China-General Armament Department

  • GJB 7052-2010 Methods of measure the frequency and spectrum characteristics of short high power microwave pulse

Professional Standard - Ferrous Metallurgy

Defense Logistics Agency

Gosstandart of Russia

  • GOST 18604.14-1977 Bipolar microwave oscillator transistors. Techniques for measuring coefficient modulus of inverse transmission of voltage in the circuit with general base at high frequency
  • GOST 19656.3-1974 Semiconductor UHF mixer diodes. Measurement methods of output impedance at an intermediate frequency
  • GOST 18604.15-1977 Bipolar microwave oscillator transistors. Techniques for measuring critical current
  • GOST 27694-1988 Integrated circuits. Low-, intermediate- and high-frequency amplifiers. Methods for measuring electric parameters
  • GOST 19656.2-1974 Semiconductor UHF mixer diodes. Measurement method of rectified current
  • GOST 18604.11-1988 Transistors bipolar. Method of measuring noise figure at high and ultra-high frequencies
  • GOST 19656.4-1974 Semiconductor UHF mixer diodes. Measurement methods of conversion losses
  • GOST 19656.0-1974 Semiconductor UHF diodes. Measurement methods of electrical parameters. General conditions
  • GOST 19656.1-1974 Semiconductor UHF mixer and detector diodes. Measurement method of voltage standing-wave ratio
  • GOST 19656.5-1974 Semiconductor UHF mixer and detector diodes. Measurement methods of output noise ratio
  • GOST 19656.9-1974 Ultra-high frequency multiplication and parametric semiconductor diodes fixed time and limit frequency measurement methods
  • GOST 19656.14-1979 Semiconductor microwave switching diodes. Measurement method of critical frequency
  • GOST 19656.9-1979 Semiconductor microwave varactors and multiplier diodes. Methods of measuring time constant and limiting frequency
  • GOST 19656.7-1974 Semiconductor UHF detector diodes. Measurement method of current sensitivity
  • GOST 19656.12-1976 Semicondactor UHF mixer diodes. Measurement method of input impedance
  • GOST 18604.1-1980 Transistors bipolar. Method for measuring collector-tobase time constant at high frequencies
  • GOST 19656.10-1988 Semiconductor microwave switching and limiter diodes. Methods of measuring loss resistances
  • GOST 19656.6-1974 Semiconductor UHF mixer diodes. Measurement methods of standard overall noise figure
  • GOST 20215-1984 Semiconductor microwave diodes. General specifications
  • GOST 26169-1984 Radioelectronic equipment electromagnetic compatibility. High-power bipolar high-frequency linear transistors intermodulation component coefficient standards
  • GOST R 71378-2024 High-voltage cenotrons. Method of measuring the anode-cathode capacitance
  • GOST 19656.15-1984 Semiconductor UHF diodes. Measurement methods of thermal resistance and pulse thermal resistance
  • GOST 18604.27-1986 Power high-voltage bipolar transistors. Collector-base (emitter-base) breakdown voltage measurement at emitter (collector) cut-off current

The Institution of Engineering and Technology (IET)

Association Francaise de Normalisation

Military Standards (MIL-STD)

Cuban Institute of Standards and Metrology

  • NC 66-25-1987 Electronic and Electrotechnical Industry. High Frequency Bipolar Transistors. Quality Specifications
  • NC 66-28-1984 Electronics. High-Frequency Bipolar Transistors. Type BF 199. Quality Specifications
  • NC 66-27-1984 Electronics High-Frequency Bipolar Transistors, Type BF 310 Quality Specifications

Polski Komitet Normalizacyjny (PKN)

Institute of Electrical and Electronics Engineers (IEEE)

  • IEEE Std 433-2022 IEEE Recommended Practice for Insulation Testing™ of AC Electric Machinery with High Voltage at Very Low Frequency - Redline
  • IEEE Std 433-2009 IEEE Recommended Practice for Insulation Testing™ of AC Electric Machinery with High Voltage at Very Low Frequency - Redline
  • IEEE Unapproved Draft Std P433/D16 Oct 2009 Draft Recommeded Practice for Insulation Testing of AC Electric Machinery with High Voltage at Very Low Frequency
  • IEEE 433-2022 IEEE Recommended Practice for Insulation Testing of AC Electric Machinery with High Voltage Rating up to 30 kV at Very Low Frequency

International Telecommunication Union (ITU)

Magyar Szabványügyi Testület

  • MSZ 10906/19-1969 Electrode tube power mark measurement mode. Microelectrode tube band definition

Korean Agency for Technology and Standards (KATS)

  • KS C 6111-4-2007(2017) Homogeneity in the surface resistance of large high-Tc superconductor films at microwave frequencies
  • KS C 6111-4-2007(2022) Homogeneity in the surface resistance of large high-Tc superconductor films at microwave frequencies
  • KS C 6111-4-2022 Homogeneity in the surface resistance of large high-Tc superconductor films at microwave frequencies
  • KS C 6111-3-2022 Electronic characteristic measurements-Intrinsic surface impedance of high-TC superconductor films at microwave frequencies
  • KS C 6111-3-2007(2022) Electronic characteristic measurements-Intrinsic surface impedance of high-TC superconductor films at microwave frequencies
  • KS C 3610-2006 Radio-frequency coaxial cables

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

  • IPC 6018D-2022 Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
  • IPC 6018B-2011 Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
  • IPC 6018B CD-2011 Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
  • IPC AJ-820A-CHINESE-2012 Identification and performance specifications for high frequency (microwave) printed boards
  • IPC 6018C CHINESE-2016 Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
  • IPC 6018B CHINESE-2011 Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

American Society for Testing and Materials (ASTM)

  • ASTM F632-90 Test Method for Measuring High Frequency Small Signal Common Emitter Current Gain of Transistor
  • ASTM F1238-95(2003) Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications

Association of German Mechanical Engineers

British Standards Institution (BSI)

  • BS EN IEC 61788-7:2020 Superconductivity - Electronic characteristic measurements. Surface resistance of high-temperature superconductors at microwave frequencies
  • BS EN 62024-1:2002 High frequency inductive components - Electrical characteristics and measuring methods - Nanohenry range chip inductor
  • BS ISO 12156-2:1998 Diesel fuel. Assessment of lubricity using the high-frequency reciprocating rig (HFRR)-Limit

Czech Standards Institute (UNMZ)

  • CSN 35 8781-1983 Mixing and detection semiconductor UHF diodes Electric parameter Measurement methods

American Welding Society (AWS)

National Association of Corrosion Engineers (NACE)

  • NACE Paper 06117-2015 pH and reference electrodes for corrosion monitoring in extreme environments of high pressure and temperature

European Telecommunications Standards Institute (ETSI)

Spanish Association for Standardization (UNE)

International Electrotechnical Commission (IEC)

  • QC 750102/ SU 0001-1990 Detail Specification for Electronic Components High- Frequency Epitaxy-Planar Ambient-Rated Bipolar Transistors Type KT3II7A

Welding Research Council

Comitato Elettrotecnico Italiano

  • CEI EN IEC 61788-7:2020 Superconductivity Part 7: Electronic characteristic measurements - Surface resistance of high-temperature superconductors at microwave frequencies

Swiss Association for Standardization (SNV)

  • SN 219 505.6-1978 Weld preparation; juncture forms on steel, submerged arc welding.

General Motors Corporation (GM)