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Database: 365,228(8 Aug 2026)

half application

half application, Total:112 items.

The international standard classification for "half application" includes: Semiconductor devices in general , Road vehicle systems , Measurement of force, weight and pressure .

The Chinese standard classification for "half application" includes: Semiconductor discrete devices in general , Electronic/electrical equipment and instruments for vehicle in general , Power semiconductor device and parts , Industrial automation and control device in general .


General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

  • GB/T 34590.11-2022 Road vehicles—Functional safety—Part 11: Guidelines on applications to semiconductors
  • GB/T 45721.1-2025 Semiconductor devices—Stress migration test—Part 1: Copper stress migration test
  • GB/T 3859.2-1993 Semiconductor convertors Application guide

Guangdong Provincial Standard of the People's Republic of China

  • DB44/T 1296-2014 Technical specification for the application of special mortar semi-flexible pavement

Professional Standard - Machinery

  • JB/T 8669-1997 Semiconductor Frequency Changing Unit Intended to Be Used in Medium Frequency Induction Heating
  • JB/T 7483-2005 Semiconductor resistance strain gauge force stransducer/sensor
  • JB/T 7483-1994 Semiconductor resistance strain sensor

Jiangsu Provincial Standard of the People's Republic of China

  • DB32/T 4074-2021 Technical specification for anti-rutting semi-flexible pavement application

Professional Standard - Electron

  • SJ 1990-1981 Detail specification for N channel junction pair field-effect transistors,Type CS20
  • SJ 1989-1981 Detail specification for Nchannel junction pair field-effect transistors,Type CS19
  • SJ 1976-1981 Detail specification for low frequency field-effect transistors,Type CS3
  • SJ 1978-1981 Detail specification for high frequency field-effect transistors,Type CS5
  • SJ 1980-1981 Detail specification for high frequency field-effect transistors,Type CS7
  • SJ/T 10435-1993 General specification for the semiconductor resistance strain gage
  • SJ 20756-1999 Guideline for application of structrually similarity of discrete semiconductor devices
  • SJ 1981-1981 Detail specification for high frequency field-effect transistors,Type CS8
  • SJ 1979-1981 Detail specification for high frequency field-effect transistors,Type CS6
  • SJ 1982-1981 Detail specification for high frequency field-effect transistors,Type CS9
  • SJ/T 11874-2022 Stress test procedures for semiconductor discrete devices used in electric vehicles
  • SJ/T 11875-2022 Stress test procedures for semiconductor integrated circuits for electric vehicles
  • SJ 1974-1981 Detail specification for low frequency field-effect transistors,Type CS1
  • SJ 1991-1981 Detail specification for N channel junction pair field-effect transistors,Type CS21
  • SJ 1992-1981 Detail specification for N channel junction pair field-effect transistors,Type CS22
  • SJ 1977-1981 Detail specification for high frequency field-effect transistors,Type CS4
  • SJ 1975-1981 Detail specification for low frequency field-effect transistors,Type CS2

Shandong Provincial Standard of the People's Republic of China

  • DB37/T 4681-2023 Technical specifications for the application of poured-in semi-flexible composite pavement

Military Standard of the People's Republic of China-General Armament Department

  • GJB/Z 41.4-1993 Military semiconductor discrete device series spectrum field effect transistor

British Standards Institution (BSI)

  • BS PD ISO/PAS 19451-1:2016 Application of ISO 26262:2011-2012 to semiconductors. Application of concepts
  • BS PD ISO/PAS 19451-2:2016 Application of ISO 26262:2011-2012 to semiconductors. Application of hardware qualification
  • PD ISO/PAS 19451-1:2016 Application of ISO 26262:2011-2012 to semiconductors. Application of concepts
  • PD ISO/PAS 19451-1:2016(2018) Application of ISO 26262:2011-2012 to semiconductors Part 1: Application of concepts
  • 19/30380822 DC BS EN 15807. Railway applications. Pneumatic half couplings
  • 08/30156909 DC BS EN 15807. Railway applications. Pneumatic half couplings
  • BS ISO 26262-11:2018 Road vehicles. Functional safety - Guidelines on application of ISO 26262 to semiconductors
  • BS 9352:1980 Rules for the preparation of detail specifications for semiconductor devices of assessed quality: field effect transistors for microwave applications
  • BS IEC 62880-1:2017 Semiconductor devices. Stress migration test standard - Copper stress migration test standard
  • PD ISO/PAS 19451-2:2016 Application of ISO 26262:2011-2012 to semiconductors. Application of hardware qualification
  • BS EN IEC 62007-2:2025 Semiconductor optoelectronic devices for fibre optic system applications - Measuring methods
  • BS PD IEC/TR 62258-4:2007 Semiconductor die products-Questionnaire for die users and suppliers

Danish Standards Foundation

German Institute for Standardization

  • DIN EN 15807:2021-05 Railway applications - Pneumatic half couplings; German version EN 15807:2021
  • DIN EN 15807:2011-05 Railway applications - Pneumatic half couplings
  • DIN EN 15807:2019 Railway applications - Pneumatic half couplings; German and English version prEN 15807:2019
  • DIN EN 15807 E:2019 Draft Document - Railway applications - Pneumatic half couplings; German and English version prEN 15807:2019
  • DIN EN 15807 E:2019-05 Draft Document - Railway applications - Pneumatic half couplings; German and English version prEN 15807:2019
  • DIN 25570:2004-02 Pipes for rail vehicles - Summary, selection, application, bending radius
  • DIN 25570:2004 Pipes for rail vehicles - Summary, selection, application, bending radius
  • DIN 6888:2022 Drive type fastenings without taper action - Woodruff keys - Dimensions and application
  • DIN EN 15807 E:2008-05 Draft Document - Railway applications - Pneumatic half couplings; German version prEN 15807:2008
  • DIN 6888 E:2020-07 Drive type fastenings without taper action - Woodruff keys - Dimensions and application

Standards Norway

Polski Komitet Normalizacyjny (PKN)

Ente Nazionale Italiano di Unificazione

European Committee for Standardization (CEN)

Association Francaise de Normalisation

Spanish Association for Standardization (UNE)

Swiss Association for Standardization (SNV)

Lithuanian Standards Office

Austrian Standards

International Organization for Standardization (ISO)

  • ISO/PAS 19451-1:2016 Application of ISO 26262:2011-2012 to semiconductors - Part 1: Application of concepts
  • ISO/PAS 19451-2:2016 Application of ISO 26262:2011-2012 to semiconductors - Part 2: Application of hardware qualification
  • ISO 18257:2016 Space systems - Semiconductor integrated circuits for space applications - Design requirements
  • ISO 5878:1982/Amd 2:1983 Application of Reference Atmospheric Humidity in the Northern Hemisphere

Swedish Institute for Standards

Automotive Electronics Council (AEC)

  • AEC Q101E Failure Mechanism Based Stress Test Qualification for Discrete Semiconductors in Automotive Applications
  • AEC Q102A Failure Mechanism Based Stress Test Qualification for Optoelectronic Semiconductors in Automotive Applications

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

Comitato Elettrotecnico Italiano

  • CEI ES 59001:2000 Approval scheme for automotive oriented applications within the electronic components industry - Semiconductor stress test qualification
  • CEI 22-2:1998 Semiconductor power electronic converters for industrial and traction applications

Society of Automotive Engineers (SAE)

  • SAE J2716_200802 SENT - Single Edge Nibble Transmission for Automotive Applications
  • SAE J2716_201604 SENT - Single Edge Nibble Transmission for Automotive Applications
  • SAE J2716_201001 SENT - Single Edge Nibble Transmission for Automotive Applications
  • SAE J2716_200704 SENT - Single Edge Nibble Transmission for Automotive Applications
  • SAE J1879_200710 Handbook for Robustness Validation of Semiconductor Devices in Automotive Applications
  • SAE J1879_201402 Handbook for Robustness Validation of Semiconductor Devices in Automotive Applications
  • SAE AS6294/3-2019 Requirements for Plastic Encapsulated Discrete Semiconductors in Space Applications

Japan Electronics and Information Technology Industries Association

Canadian General Standards Board (CGSB)

Yugoslav Association for Standardization

  • JUS N.R1.353-1979 Letter symbohfor semiconductor devices. Bipolar andfield-effect transistors.
  • JUS N.R1.323-1979 Termsand definitions for semiconductor devices. Bipolar and field-effect transistors.

Electronic Components, Assemblies and Materials Association

  • ECA 401-1973 Paper, Paper/Film, Film Dielectric Capacitors for Power Semiconductor Applications

International Electrotechnical Commission (IEC)

  • IEC 60747-14-4:2011 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers

International Telecommunication Union (ITU)

European Committee for Electrotechnical Standardization(CENELEC)

  • EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)

Korean Agency for Technology and Standards (KATS)

  • KS C IEC 60146-6-2013 Semiconductor convertors - Part 6: Application guide for the protection of semiconductor convertors against overcurrent by fuses
  • KS C IEC PAS 62166-2002(2012) Guidelines for user notification of product/process changes by semiconductor suppliers
  • KS C IEC PAS 62166:2002 Guidelines for user notification of product/process changes by semiconductor suppliers

South African Bureau of Standard

  • SANS 60146-6:1992 Semiconductor convertors Part 6: Application guide for the protection of semiconductor convertors against overcurrent by fuses

(U.S.) Telecommunications Industries Association

  • J-STD-026-1999 Semiconductor Design Standard for Flip Chip Applications (IPC/EIA J-STD-026)