Xishuang other printing materials

Xishuang other printing materials, Total:53 items.

The international standard classification for "Xishuang other printing materials" includes: .

The Chinese standard classification for "Xishuang other printing materials" includes: .

German Institute for Standardization

DIN EN IEC 61249-2-46:2018-10*VDE 0322-249-2-46:2018-10 Materials for printed boards and other interconnecting structures
DIN EN IEC 61249-2-45:2018-10*VDE 0322-249-2-45:2018-10 Materials for printed boards and other interconnecting structures
DIN EN 61249-2-43:2017-03*VDE 0322-249-2-43:2017-03 Materials for printed boards and other interconnecting structures
DIN EN IEC 61249-6-3:2024-08*VDE 0322-249-6-3:2024-08 Materials for printed boards and other interconnecting structures
DIN EN 61249-2-44:2017-03*VDE 0322-249-2-44:2017-03 Materials for printed boards and other interconnecting structures
DIN EN IEC 61249-2-47:2018-10*VDE 0322-249-2-47:2018-10 Materials for printed boards and other interconnecting structures
DIN EN 61249-4-17:2009-12 Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability ...
DIN EN 61249-4-14:2009-12 Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burnin...
DIN EN 61249-4-16:2009-12 Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defin...
DIN EN 61249-4-15:2009-12 Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability ...
DIN EN 61249-4-19:2014-07 Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defi...
DIN EN 61249-4-18:2014-07 Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability...
DIN EN IEC 61249-6-3:2024 Materials for printed boards and other interconnecting structures - Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from "E" glass for printed boards (IEC 61249-6-3:2023)
DIN EN IEC 61249-6-3:2019-04 Draft Document - Materials for printed boards and other interconnecting structures - Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from "E" glass for printed boards (IEC 91/1548/CD:2018); Te...
DIN EN IEC 61249-6-3 E:2019 Draft Document - Materials for printed boards and other interconnecting structures - Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from "E" glass for printed boards (IEC 91/1548/CD...
DIN EN IEC 61189-2-803:2024 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (IEC 61189-2-803:2023); German version EN IEC 61189-2-803:2023
DIN EN IEC 61189-2-803:2024-08 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (IEC 61189-2-803:2023); German version EN IEC 61189-2-803:2023
DIN EN IEC 61249-6-3:2024-08 Materials for printed boards and other interconnecting structures - Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from "E" glass for printed boards (IEC 61249-6-3:2023); German version EN IE...

Korean Agency for Technology and Standards (KATS)

KS C IEC 61249-2-23-2006(2020) Printed circuit boards and other connected structural materials - Part 2-23: Copper foil and copper-free reinforcement materials - Halogen-free phenolic resin copper clad laminates based on cellulose paper, economic grade

British Standards Institution (BSI)

BS EN IEC 61249-6-3:2023 Materials for printed boards and other interconnecting structures Part 6 - 3 : Sectional specification set for reinforcement materials — Specification for finished fabric woven from " E " glass for printed boards
BS EN 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. Soldering flux for printed board assemblies
BS EN 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. Soldering paste for printed board assemblies
BS EN IEC 61189-2-801:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Thermal conductivity test for base materials
21/30441795 DC BS EN IEC 61249-2-51. Materials for printed boards and other interconnecting structures. Part 2-51. Reinforced base materials; clad and unclad. Base materials for Integrated Circuit card carrier tape; unclad
PD IEC/TR 61189-3-914:2017 Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines
BS PD IEC/TR 61189-3-914:2017 Test methods for electrical materials, printed boards and other interconnection structures and assemblies-Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines
BS IEC 62899-201:2016+A1:2018 Printed electronics - Materials. Substrates
BS EN IEC 61189-2-805:2024 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - X/Y CTE test for thin base materials by TMA

Spanish Association for Standardization (UNE)

UNE-EN IEC 61249-6-3:2023 Materials for printed boards and other interconnecting structures - Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from \"E\" glass for printed boards
UNE-EN 61249-4-18:2013 Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability...
UNE-EN 61249-4-15:2009 Materials for printed boards and other interconnecting structures -- Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability...
UNE-EN 61249-4-17:2009 Materials for printed boards and other interconnecting structures -- Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability...
UNE-EN 61249-4-14:2009 Materials for printed boards and other interconnecting structures -- Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burni...
UNE-EN 61249-4-16:2009 Materials for printed boards and other interconnecting structures -- Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defi...
UNE-EN 61249-4-19:2013 Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Hich performance non-halogenated epoxide woven E-glass prepreg of defi...
UNE-EN 61249-3-5:2000 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES. PART 3-5: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS). TRANSFER ADHESIVE FILMS.
AENOR UNE 54104:1999 Graphic technology. Prints and printing inks. Evaluation of the resistance of printed materials to acids.

Comitato Elettrotecnico Italiano

CEI EN IEC 61249-6-3:2023 Materials for printed boards and other interconnecting structures Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from "E" glass for printed boards

SE-SIS

SIS SS-IEC 249:1991 Printed circuits - Base materials for printed circuits —
SIS 03 61 05-1969 Typographical measures. Typographical material for letterpress printing
SIS 03 60 20-1968 Typographical measures. Typographical material for letterpress printing

Association Francaise de Normalisation

NF C93-732-803*NF EN IEC 61189-2-803:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
NF EN 61249-4-19:2014 Materials for printed circuits and other interconnect structures - Part 4-19: series of intermediate specifications for prepreg, non-plated materials (for the manufacture of multilayer boards) - Epoxy glass fabric pr...

Danish Standards Foundation

DANSK DS/EN IEC 61189-2-803:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
DANSK DS/EN 61249-3-5:1999 Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

International Electrotechnical Commission (IEC)

IEC 61249-6-3:2023 Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards
IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board ass

AT-OVE/ON

OVE EN IEC 61249-6-3:2021 Materials for printed boards and other interconnecting structures - Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from \

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

IPC MI-660 10.0-1984 Other Materials
IPC MI-660 SECTION 10 Other Materials

American Society for Testing and Materials (ASTM)

ASTM D779-94(2002) Standard Test Method for Water Resistance of Paper, Paperboard, and Other Sheet Materials by the Dry Indicator Method

Swedish Institute for Standards

SS-EN IEC 61189-2-803:2024 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board

GCC Standardization Organization

GSO IEC 61249-3-5:2014 Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

Others: Xishuang other building materials,Xishuang other printing materials