Sign In |Help & Support
ALL SECTORS
  • ALL SECTORS
  • GB(National Standard)
  • CB(Shipping)
  • CECS(Engineering Construction)
  • CJ(Urban Construction)
  • CY(News and Publication)
  • DB(Provincial Standard)
  • DL(Electricity & Power)
  • DZ(Geology & Mineralogy)
  • FZ(Spinning & Textile)
  • GA(Public Security)
  • HB(Aviation)
  • HG(Chemical Industry)
  • HJ(Environmental Protection)
  • JB(Machinery)
  • JC(Building Materials)
  • JG(Building & Construction)
  • JJ(Metering)
  • JT(Highway & Transportation)
  • LY(Forestry)
  • MT(Coal)
  • NB(Energy)
  • NY(Agriculture)
  • QB(Light Industry)
  • QC(Automobile & Vehicle)
  • QJ(Aerospace)
  • SH(Petrochemical)
  • SJ(Electronics)
  • SL(Water Resources)
  • SN(Commodity Inspection)
  • SY(Oil & Gas)
  • TB(Railway & Train)
  • YB(Ferrous Metallurgy)
  • YC(Tobacco)
  • YD(Telecommunication)
  • YY(Medical Device)
Database: 365,228(8 Aug 2026)
copper-clad polyimide film laminates flexible printed circuits introduction standard frameworks standard items gb/t standard replaces gb/t models performance indicators basic requirements new volatile n-nitrosamines β-hydroxyethylsulfonyl sulfate ester cold heading hexagonal head nuts sizing female die scopethis standard
GB/T 13555-2017 in English

GB/T 13555-2017 in English

VALID

Copper-clad polyimide film laminates for flexible printed circuits

  • Issued on:2017-12-29
  • Implemented on:2019-01-01
  • File Format:PDF
  • Delivery:Via email within 1~3 business days
Price(USD): $240.00
$233.00
Standard No: GB/T 13555-2017
Document status: VALID
Title in English: Copper-clad polyimide film laminates for flexible printed circuits
Title in Chinese: 挠性印制电路用聚酰亚胺薄膜覆铜板
Language: English
File Format: Electronic (PDF)
Delivery: Via email within 1~3 business days
Issued on: 2017-12-29
Implemented on: 2019-01-01
ICS Classification: 31.180-Printed circuits and boards
Chinese Classification: L30-Printed circuit
Professional Classification: GB-National Standard
Related Keywords: copper-clad polyimide film laminates
flexible printed circuits introduction
standard frameworks standard items gb/t
standard replaces gb/t
models performance indicators basic requirements new
Related Topics: Polyimide
imide
polyimide film
imine
polyamide thin film chromatography
Polyimide application
polyimide film
copper plate
Polyimide+
GBT13555
GB/T 13555-1992
GB/T 13555-2017
printed circuit
Polyamide film running board
Polyamide film unfolding techniques
Thermal conductive polyimide film
polyetherimide film
Polyimide resin sheet
Polyimide sheet bending test
Transparent polyimide film
gb13555-2017
Polyimide standard
gb/t 13555-2008
Polyimide Standard


Introduction

1. Background of standard formulation and technological evolution

This standard replaces GB/T 13555-1992. The main changes include the addition of terms and definitions, the expansion of product classification and the improvement of performance requirements.

2. Comparative analysis of standard frameworks

Standard items GB/T 13555-1992 GB/T 13555-2017
Terms and definitions None New
Product classification 2 models 5 models
Performance indicators Basic requirements New thermal stress, folding resistance, etc.

3. Implementation suggestions

Enterprises should:

  • Update production processes and testing equipment
  • Strengthen employee training
  • Negotiate with suppliers on raw material standards
  • Establish a sound quality management system

Sample only — not a preview of GB/T 13555-2017
Page: 1 / 0
100%

Loading PDF document...

Error loading PDF. Please make sure the file is valid and try again.

We also recommend