GB/T 36476-2018 in English
VALIDGeneral specification for metal base copper-clad laminates for printed circuits
- Issued on:2018-06-07
- Implemented on:2019-01-01
- File Format:PDF
- Delivery:Via email within 5 business days
$418.00
| Standard No: | GB/T 36476-2018 |
| Document status: | VALID |
| Title in English: | General specification for metal base copper-clad laminates for printed circuits |
| Title in Chinese: | 印制电路用金属基覆铜箔层压板通用规范 |
| Language: | English |
| File Format: | Electronic (PDF) |
| Delivery: | Via email within 5 business days |
| Issued on: | 2018-06-07 |
| Implemented on: | 2019-01-01 |
| ICS Classification: | 31.180-Printed circuits and boards |
| Chinese Classification: | L30-Printed circuit |
| Professional Classification: | GB-National Standard |
| Related Topics: | Metal foils for printed circuits
Communication circuit board gold Copper foil thickness GBT36476 GB/T 36476-2018 printed circuit |
《GB/T 36476-2018印制电路用金属基覆铜箔层压板通用规范》由TC47（全国印制电路标准化技术委员会）归口，主管部门为工业和信息化部（电子）。
Introduction
Core Standard Analysis
| Technical Dimensions | Aluminum Substrate Requirements | Copper Substrate Requirements |
|---|---|---|
| Thermal Conductivity Grade | AF Grade (1.0-5.0W/m·K) | Same as Aluminum Substrate |
| Substrate Thickness Tolerance | 1.0mm±0.09mm(Grade 1) | 1.0mm±0.09mm(Grade 1) |
| Peel Strength | ≥1.0N/mm(As-received) | |
Key Performance Indicators
Thermal management performance: The standard divides the thermal conductivity of the insulating medium layer into 6 levels (AF), among which level F>5.0W/(m·K) requires special agreement. The steady-state method in Appendix A must be used for actual measurement, and the measurement must be made using a thermal impedance tester at a pressure of 0.69MPa.
Typical case: LED lighting modules usually use CAL-D type aluminum substrates (thermal conductivity 2.0-3.0W/m·K), which can meet the 10W/cm² heat flux density requirements.
Key points of inspection rules
Three-level system is adopted for quality consistency inspection:
- Group A batch inspection: basic items such as appearance and size, sampling according to GB/T 2828
- Group B periodic inspection: process performance such as thermal stress and weldability
- Group C reliability verification: long-term performance such as dielectric constant and arc resistance is tested every 12 months
Note:Thickness measurement should avoid the 13mm edge area, and the tolerance in this area is allowed to be relaxed to 125%.
Technology Evolution Background
This standard replaces SJ20780-2000, with the following major improvements:
- Added technical requirements for copper substrates
- Refined thermal impedance grading (Grade 1-5)
- Added Appendix B for dielectric withstand voltage test
Implementation suggestions
| Application scenarios | Recommended models | Key parameters |
|---|---|---|
| Automotive electronics | CCU-3 | Thermal impedance ≤1.0×10⁻⁴K·m²/W |
| High frequency circuit | CAL-E | Dielectric constant ≤4@1MHz |
When purchasing, please specify: metal base type (A/C), copper foil quality code (such as 305g/m² represented by "1"), insulation layer thickness (such as 080 represents 80μm).
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