Metal foils for printed circuits
Metal foils for printed circuits, Total:40 items.
The international standard classification for "Metal foils for printed circuits" includes: Printed circuits and boards , Copper products .
The Chinese standard classification for "Metal foils for printed circuits" includes: Printed circuit , Heavy metals and their alloys .
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
- GB/T 4721～4722 GB 4723～4725-92 Copper-clad laminate for printed circuits
- GB 4723-1992 Copper-clad phenolic paper laminates for printed circuits
- GB/T 4723-1992 Phenolic cellulose paper copper-clad laminated sheets for printed circuits
- GB/T 4721-1992 General rules for copper-clad laminated sheets for printed circuits
- GB/T 31471-2015 General specification for metal foil for printed circuits
- GB/T 31988-2015 Aluminium base copper clad laminate for printed circuits
- GB/T 4724-1992 Epoxide cellulose paper copper-clad laminated sheets for printed circuits
- GB/T 13556-1992 Flexible copper-clad polyester flim for printed circuits
- GB 13556-1992 Flexible copper - Clad polyester film for printed circuits
- GB/T 36476-2018 General specification for metal base copper-clad laminates for printed circuits
- GB 4724-1992 Epoxide cellulose paper copper-clad laminated sheets for printed circuits
Group Standards of the People's Republic of China
- T/CPCA 4105-2016 Metal base copper clad laminate for printed circuits
- T/ZZB 2017-2020 Aluminum basecopper-clad laminates for printed circuits
Military Standard of the People's Republic of China-General Armament Department
- GJB 1651-1993 Test methods for metal foil clad laminates for printed circuits
- GJB/Z 50.1-1993 Military printed circuit board and its base material series Foil-clad base material for printed circuits
- GJB 1651A-2017 Test methods for metal foil clad laminates for printed circuits
- GJB 2142A-2011 General specification for metal-clad laminated sheets for printed wiring boards
- GJB 2142-1994 General specification for metal foil clad laminates for printed wiring boards
国家市场监督管理总局、中国国家标准化管理委员会
- GB/T 5230-2020 Electrodeposited copper foil for printed board
- GB/T 4721-2021 General rules for rigid copper clad laminates for printed circuits
Professional Standard - Electron
- SJ/T 11779-2021 Thermal Conductive Resin Coated Copper Foil for Printed Circuits
中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会
- GB/T 4724-2017 Composite base copper clad laminated sheets for printed circuits
- GB/T 4723-2017 Phenolic celluloss paper copper clad laminated sheets for printed circuit
YU-JUS
- JUS N.R7.040-1980 Printed circuits. Special metal-clad base materials used in connection with printed circuits
IPC - Association Connecting Electronics Industries
- IPC 4562A CHINESE-2008 Metal Foil for Printed Board Applications
- IPC 4562A CHINESE CD-2008 Metal Foil for Printed Board Applications
- IPC 4562A CD-2008 Metal Foil for Printed Board Applications
- IPC 4562A AMD 1-2013 Metal Foil for Printed Board Applications
SCC
- UNE 20620-4:1980 METAL-CLAD BASE MATERIALS FOR PRINTED CIRCUITS. COPPER FOIL
- AENOR UNE 20620-4:1980 Base materials with metallic coating for printed circuits. Copper foil.
Institute of Interconnecting and Packaging Electronic Circuits (IPC)
- IPC 4562A-2016 Metal Foil for Printed Board Applications
- IPC 4562A-2008 Metal Foil for Printed Board Applications
- IPC-H-855-1982 Metal Foil for Printed Board Applications
Japanese Industrial Standards Committee (JISC)
- JIS C 6512:1992 Electrodeposited copper foil for printed wiring boards
- JIS C 6511:1992 Test methods of copper foil for printed wiring boards
- JIS C 6513:1996 Rolled copper foil for printed wiring boards
British Standards Institution (BSI)
- BS 4584-103.2:1990 Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for copper foil for use in the manufacture of copper-clad base materials
- BS 4584 Sec.103.2:1990 Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for copper foil for use in the manufacture of copper-clad base materials
Korean Agency for Technology and Standards (KATS)
- KS C 6457-1997(2012) Rolled copper foil for printed wiring boards
- KS C 6457-1997 Rolled copper foil for printed wiring boards
