GB/T 19247.3-2003 in English
VALIDPrinted board assemblies - Part 3: Sectional specification - Requirements for through - Hole mount soldered assemblies
- Issued on:2003-11-24
- Implemented on:2004-08-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
$127.00
| Standard No: | GB/T 19247.3-2003 |
| Document status: | VALID |
| Title in English: | Printed board assemblies - Part 3: Sectional specification - Requirements for through - Hole mount soldered assemblies |
| Title in Chinese: | 印制板组装 第3部分:分规范 通孔安装焊接组装的要求 |
| Language: | English |
| File Format: | Electronic (PDF) |
| Delivery: | Via email within 1~3 business days |
| Issued on: | 2003-11-24 |
| Implemented on: | 2004-08-01 |
| ICS Classification: | 31.240-Mechanical structures for electronic equipment |
| Chinese Classification: | L94-Mechanical structural member for electronic equipment |
| Professional Classification: | GB-National Standard |
| Related Keywords: | assemblies scopethis standard
through-hole solder assemblies hole mount tht part assemblies |
| Related Topics: | rule
Standard Orifice Mounting Orifice flowmeter installation requirements GB/T 19247.3 GB/T 19247.3-2003 |
《GB/T 19247.3-2003印制板组装 第3部分:分规范 通孔安装焊接组装的要求》由TC47(全国印制电路标准化技术委员会)归口,主管部门为工业和信息化部(电子)。
本部分规定了引线与通孔焊接组装的要求。本部分适用于用通孔安装方法(THT)进行整体引线与孔组装,也适用于采用其他相关方法(即:表面组装、芯片组装、端接组装)组装中的THT部分。
Scope
This standard specifies the requirements for lead and through-hole solder assemblies. This standard applies to the overall lead and hole assembly using the through-hole mounting method (THT), and also applies to the THT part of the assembly using other related methods (ie: surface mount, chip assembly, terminal assembly).

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