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Database: 365,228(8 Aug 2026)
assemblies scopethis standard through-hole solder assemblies hole mount tht part assemblies electronic document file format household refrigerating appliances scopethis standard green zone transmission design
GB/T 19247.3-2003 in English

GB/T 19247.3-2003 in English

VALID

Printed board assemblies - Part 3: Sectional specification - Requirements for through - Hole mount soldered assemblies

  • Issued on:2003-11-24
  • Implemented on:2004-08-01
  • File Format:PDF
  • Delivery:Via email within 1~3 business days
Price(USD): $130.00
$127.00
Standard No: GB/T 19247.3-2003
Document status: VALID
Title in English: Printed board assemblies - Part 3: Sectional specification - Requirements for through - Hole mount soldered assemblies
Title in Chinese: 印制板组装 第3部分:分规范 通孔安装焊接组装的要求
Language: English
File Format: Electronic (PDF)
Delivery: Via email within 1~3 business days
Issued on: 2003-11-24
Implemented on: 2004-08-01
ICS Classification: 31.240-Mechanical structures for electronic equipment
Chinese Classification: L94-Mechanical structural member for electronic equipment
Professional Classification: GB-National Standard
Related Keywords: assemblies scopethis standard
through-hole solder assemblies
hole mount
tht part
assemblies
Related Topics: rule
Standard Orifice Mounting
Orifice flowmeter installation requirements
GB/T 19247.3
GB/T 19247.3-2003

《GB/T 19247.3-2003印制板组装 第3部分:分规范 通孔安装焊接组装的要求》由TC47(全国印制电路标准化技术委员会)归口,主管部门为工业和信息化部(电子)。
本部分规定了引线与通孔焊接组装的要求。本部分适用于用通孔安装方法(THT)进行整体引线与孔组装,也适用于采用其他相关方法(即:表面组装、芯片组装、端接组装)组装中的THT部分。


Scope

This standard specifies the requirements for lead and through-hole solder assemblies. This standard applies to the overall lead and hole assembly using the through-hole mounting method (THT), and also applies to the THT part of the assembly using other related methods (ie: surface mount, chip assembly, terminal assembly).

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